公开(公告)号：US20230265576A1

公开(公告)日：2023-08-24

申请号：US18005171

申请日：2021-06-30

Applicant: BASF SE

Inventor： Charlotte EMNET ,  Verena STREMPEL ,  Lucas Benjamin HENDERSON ,  Alexander FLUEGEL ,  Robert BRAENDLE ,  Sathana KITAYAPORN ,  Nadine ENGELHARDT

IPC: C25D3/38

CPC classification number: C25D3/38

Abstract: Described herein is an acidic aqueous composition for copper electroplating including

(a) copper ions;
(b) bromide ions; and
(c) at least one additive of formula S1






where
XS1 is selected from the group consisting of a linear, branched or cyclic C1-C12 alkanediyl;
RS1 is a monovalent

(a) poly(oxy(C3 to C6)alkylene)-block-poly(oxyethylene) group, or
(b) a poly(oxyethylene)-block-poly(oxy(C3 to C6)alkylene)-block-poly(oxyethylene) group;


RS2, RS3, RS4

(a) are selected from the group consisting of H, RS1, RS40, or
(b) RS3 and an adjacent group RS4 or, if n>2, two adjacent groups RS4 may together form a divalent group XS3;


RS40 is selected from the group consisting of (a) linear or branched C1-C20 alkyl, and (b) linear or branched C1-C20 alkenyl;
XS3 is selected from the group consisting of a linear, branched or cyclic C1-C12 alkanediyl; and
n is an integer of from 1 to 6.

公开(公告)号：US20240166977A1

公开(公告)日：2024-05-23

申请号：US18548582

申请日：2022-02-24

Applicant: BASF SE

Inventor： Verena STREMPEL ,  Marta REINOSO GARCIA ,  Daniel LOEFFLER ,  Carsten SUELING

IPC: C11D17/00 ,  C11D3/12 ,  C11D3/16 ,  C11D3/33

CPC classification number: C11D17/0039 ,  C11D3/1206 ,  C11D3/168 ,  C11D3/33 ,  C11D17/0091 ,  C11D2111/14

Abstract: Process for making a particulate coated chelating agent (A) wherein said process comprises the following steps:



(a) Providing a granule or powder containing an alkali metal salt of methyl glycine diacetic acid (MGDA) or glutamic acid diacetic acid (GLDA), preferably with a moisture content in the range of from 1 to 15% by weight,
(b) treating said salt with a metal alkoxide or metal halide or metal amide or alkyl metal compound or with an alkoxide, amide, halide or alkyl compound of silicon,
(c) treating the material obtained in step (b) with moisture or
(c*) with ozone,
(d) optionally, repeating the sequence of steps (b) and (c) once to 25 times.