DISPLAYING MODULE AND DISLAYING DEVICE

    公开(公告)号:US20220236475A1

    公开(公告)日:2022-07-28

    申请号:US17485197

    申请日:2021-09-24

    IPC分类号: F21V8/00

    摘要: A displaying module and a displaying device. The displaying module includes a backlight module and a display panel arranged at a light-emitting side of the backlight module, wherein the backlight module is provided with an ambient light hole penetrating through the backlight module along a direction perpendicular to a light-emitting surface of the backlight module; and a side, facing the backlight module, of the display panel is provided with a light equalization layer which covers the ambient light hole. By arranging the equalization layer at the side, facing the backlight module, of the display panel and at a position corresponding to the ambient light hole, when a screen of the display panel is black, the display panel is non-transparent, and the light equalization layer located at the side, facing the backlight module, of the display panel is incapable of being seen via the display panel.

    VOLTAGE COMPENSATION METHOD, VOLTAGE COMPENSATION DEVICE AND TOUCH DISPLAY MODULE

    公开(公告)号:US20210365171A1

    公开(公告)日:2021-11-25

    申请号:US16478716

    申请日:2018-12-27

    IPC分类号: G06F3/041 G06F3/044 G09G3/36

    摘要: A voltage compensation method includes: within a touch time period, multiplexing common electrode blocks as touch electrodes, and scanning the common electrode blocks in at least one column sequentially to detect a capacitance of each scanned common electrode block; within a time period between detecting the capacitance of each scanned common electrode block and starting an Nth display time period after the touch time period, calculating power consumption for each scanned common electrode block in accordance with the capacitance thereof, acquiring a corresponding common electrode voltage compensation value based on the power consumption, and adding the common electrode voltage compensation value to a reference common electrode voltage to acquire a compensated common electrode voltage applied to each scanned common electrode block; and within the Nth display time period, adjusting a common electrode voltage applied to each scanned common electrode block into the compensated common electrode voltage.

    DISPLAY PANEL MOTHERBOARD AND MANUFACTURING METHOD THEREOF
    4.
    发明申请
    DISPLAY PANEL MOTHERBOARD AND MANUFACTURING METHOD THEREOF 有权
    显示面板主板及其制造方法

    公开(公告)号:US20150313021A1

    公开(公告)日:2015-10-29

    申请号:US14427947

    申请日:2014-06-18

    IPC分类号: H05K3/00 H05K3/46 H05K1/02

    摘要: A display panel motherboard and a manufacturing method thereof are provided. The display panel motherboard comprises display panel regions (Q1) spaced apart from each other and precut regions (Q2) adjacent to the display panel regions. The manufacturing method comprises forming an electrical insulating layer (102); and removing at least portions of the electrical insulating layer provided on the precut regions (Q2). The method avoids the problem of other patterns offset on the display panel motherboard caused by the larger internal stress within the electrical insulating layer.

    摘要翻译: 提供了显示面板主板及其制造方法。 显示面板母板包括彼此间隔开的显示面板区域(Q1)和与显示面板区域相邻的预切割区域(Q2)。 制造方法包括形成电绝缘层(102); 以及去除设在预切区(Q2)上的电绝缘层的至少一部分。 该方法避免了由电绝缘层内的较大的内部应力引起的显示面板主板上的其他图案偏移的问题。

    BACKLIGHT MODULE AND DISPLAY DEVICE
    6.
    发明申请

    公开(公告)号:US20200012039A1

    公开(公告)日:2020-01-09

    申请号:US16403815

    申请日:2019-05-06

    IPC分类号: F21V8/00

    摘要: The present disclosure provides a backlight module and a display device. The backlight module includes a back plate, a first film layer, and a bonding portion. The back plate includes a back plate body and a side plate, where the side plate is disposed at a periphery of the back plate body and extends from the periphery of the back plate body. The first film layer is located in the accommodation space and is disposed as the outermost surface of the backlight module, and includes a film layer body and a protruding portion protruding from a periphery of the film layer body, where a projection of the protruding portion at a plane of the backlight exceeds a projection of the side panel at a plane of the backlight. The bonding portion is disposed at an outer side of the side plate and bonding the protruding portion and the side plate.