公开(公告)号：US11979976B2

公开(公告)日：2024-05-07

申请号：US17383129

申请日：2021-07-22

Applicant: CelLink Corporation

Inventor： Kevin Michael Coakley ,  Malcolm Parker Brown ,  Dongao Yang ,  Michael Lawrence Miller ,  Paul Henry Lego

IPC: H05K3/20 ,  H01M50/519 ,  H05K1/02 ,  H05K1/11 ,  H05K3/00 ,  H05K3/06 ,  H05K3/28 ,  H05K3/46 ,  H05K3/04 ,  H05K3/44

CPC classification number: H05K1/0201 ,  H01M50/519 ,  H05K1/118 ,  H05K3/007 ,  H05K3/0073 ,  H05K3/06 ,  H05K3/20 ,  H05K3/281 ,  H05K3/4623 ,  H05K3/046 ,  H05K3/064 ,  H05K3/44 ,  H05K3/445 ,  Y02E60/10

Abstract: Provided are interconnect circuits and methods of forming thereof. A method may involve laminating a substrate to a conductive layer followed by patterning the conductive layer. This patterning operation forms individual conductive portions, which may be also referred to as traces or conductive islands. The substrate supports these portions relative to each other during and after patterning. After patterning, an insulator may be laminated to the exposed surface of the patterned conductive layer. At this point, the conductive layer portions are also supported by the insulator, and the substrate may optionally be removed, e.g., together with undesirable portions of the conductive layer. Alternatively, the substrate may be retained as a component of the circuit and the undesirable portions of the patterned conductive layer may be removed separately. These approaches allow using new patterning techniques as well as new materials for substrates and/or insulators.

公开(公告)号：US09961780B2

公开(公告)日：2018-05-01

申请号：US14926316

申请日：2015-10-29

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Hirofumi Shinagawa ,  Shigeru Tago ,  Masaki Kawata ,  Yuki Ito

IPC: H05K3/32 ,  H05K1/18 ,  H05K3/46 ,  H05K3/30 ,  H05K3/00

CPC classification number: H05K3/32 ,  H01L2224/16225 ,  H01L2224/81 ,  H05K1/185 ,  H05K1/186 ,  H05K3/0073 ,  H05K3/306 ,  H05K3/4611 ,  H05K3/4632 ,  H05K3/4644 ,  H05K3/4697 ,  H05K2201/0129 ,  H05K2203/061 ,  H05K2203/063

Abstract: A method for manufacturing a resin multilayer board formed from a thermoplastic resin, which method allows for improvement in accuracy of the position of a component relative to the resin multilayer board, is provided. A method for manufacturing a resin multilayer board includes: a step of bonding a component to a pressure-sensitive adhesive layer of a pressure-sensitive adhesive sheet having the pressure-sensitive adhesive layer on a surface thereof; a step of opposing a thermoplastic resin sheet to the pressure-sensitive adhesive layer, and fixing the component bonded to the pressure-sensitive adhesive sheet and the thermoplastic resin sheet to each other by heating; a step of peeling the pressure-sensitive adhesive sheet from the component fixed to the thermoplastic resin sheet; and stacking and thermally welding a plurality of thermoplastic resin sheets including the thermoplastic resin sheet to which the component has been transferred.

公开(公告)号：US20160338205A1

公开(公告)日：2016-11-17

申请号：US14710956

申请日：2015-05-13

Applicant: International Business Machines Corporation

Inventor： Sarah K. Czaplewski ,  Joseph Kuczynski ,  Jason T. Wertz ,  Jing Zhang

IPC: H05K3/00 ,  H05K1/03

CPC classification number: H05K3/0064 ,  H05K1/09 ,  H05K3/0073 ,  H05K3/225 ,  H05K3/281 ,  H05K3/34 ,  H05K3/3452 ,  H05K2201/0195

Abstract: In an example, a process for bonding a dry film solder mask (DFSM) material to a printed circuit board (PCB) laminate material is disclosed. The process includes applying a DFSM material that includes a dienophile functional group to a PCB laminate material that includes a diene functional group. The process further includes bonding the DFSM material to the PCB laminate material via a chemical reaction of the dienophile functional group with the diene functional group.

Abstract translation: 在一个示例中，公开了将干膜焊接掩模（DFSM）材料粘合到印刷电路板（PCB）层压材料上的工艺。 该方法包括将包含亲双烯体官能团的DFSM材料应用于包括二烯官能团的PCB层压材料。 该方法还包括通过亲二烯官能团与二烯官能团的化学反应将DFSM材料粘合到PCB层压材料上。

公开(公告)号：US20160192501A1

公开(公告)日：2016-06-30

申请号：US14896861

申请日：2014-06-03

Applicant: NANYANG TECHNOLOGICAL UNIVERSITY

Inventor： Chaoyi YAN ,  Pooi See LEE

IPC: H05K3/00

CPC classification number: H05K3/0073 ,  H01L29/0673 ,  H01L29/1606 ,  H01L29/401 ,  H01L29/413 ,  H01L51/0048 ,  H01L51/50 ,  H02S50/00 ,  H02S50/10 ,  H05K1/0283 ,  H05K1/097 ,  H05K3/207 ,  H05K3/246 ,  H05K2201/0133 ,  H05K2201/0248 ,  H05K2201/0257 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2201/0326 ,  H05K2203/0191 ,  H05K2203/1476 ,  H05K2203/304

Abstract: A method of manufacturing a flexible electronic device is provided. The method includes a) filtering a mixture including an electrically conducting nanostructured material through a membrane such that the electrically conducting nanostructured material is deposited on the membrane; b) depositing an elastomeric polymerisable material on the electrically conducting nanostructured material and curing the elastomeric polymerisable material thereby embedding the electrically conducting nanostructured material in an elastomeric polymer thus formed; and c) separating the elastomeric polymer with the embedded electrically conducting nanostructured material from the membrane to obtain the flexible electronic device. Flexible electronic device manufactured by the method, and use of the flexible electronic device are also provided.

Abstract translation: 提供一种制造柔性电子装置的方法。 该方法包括：a）通过膜过滤包含导电纳米结构材料的混合物，使得导电纳米结构材料沉积在膜上; b）将弹性体可聚合材料沉积在导电纳米结构材料上并固化弹性体可聚合材料，从而将导电纳米结构材料嵌入如此形成的弹性体聚合物中; 以及c）将所述弹性体聚合物与所述嵌入的导电纳米结构材料从所述膜分离以获得所述柔性电子器件。 还提供了通过该方法制造的柔性电子装置和柔性电子装置的使用。

公开(公告)号：US08658910B2

公开(公告)日：2014-02-25

申请号：US13704248

申请日：2012-06-07

Applicant: Tetsuro Kubo ,  Tsuyoshi Himori ,  Shogo Hirai

Inventor： Tetsuro Kubo ,  Tsuyoshi Himori ,  Shogo Hirai

IPC: H05K1/11 ,  H05K1/09

CPC classification number: H05K1/0306 ,  H01B1/24 ,  H05K3/0073 ,  H05K3/4069 ,  H05K3/4652 ,  H05K2201/029

Abstract: A circuit board includes a core substrate portion, an insulating layer, a second wiring, and a via to be a cured product of a via paste. The via paste has a first latent curing agent and a second latent curing agent, an uncured resin mixture, and a conductive particle. Both a softening temperature of the first latent curing agent and that of the second latent curing agent are equal to or higher than 40° C. and are equal to or lower than 200° C., and a difference between the softening temperature of the first latent curing agent and that of the second latent curing agent is equal to or higher than 10° C. and is equal to or lower than 140° C.

Abstract translation: 电路板包括芯基板部分，绝缘层，第二布线和作为通孔糊的固化产物的通孔。 通孔糊具有第一潜在性固化剂和第二潜在性固化剂，未固化树脂混合物和导电颗粒。 第一潜在性固化剂和第二潜在性固化剂的软化温度均等于或高于40℃，等于或低于200℃，第一潜在性固化剂的软化温度与第一潜在性固化剂的软化温度之差 潜在性固化剂和第二潜在性固化剂的固化剂等于或高于10℃并且等于或低于140℃。

公开(公告)号：US20140037862A1

公开(公告)日：2014-02-06

申请号：US13671377

申请日：2012-11-07

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Chang Bo Lee ,  Do Wan Kim ,  Cheol Ho Choi ,  Chang Sup Ryu

IPC: H05K3/18

CPC classification number: H05K3/18 ,  H01L23/13 ,  H01L2924/0002 ,  H05K3/0073 ,  H05K3/243 ,  H05K3/28 ,  H05K3/282 ,  H05K3/3452 ,  H05K2201/09845 ,  H05K2201/099 ,  H05K2203/107 ,  H05K2203/1476 ,  H01L2924/00

Abstract: Disclosed herein is a method for manufacturing a printed circuit board for forming a solder resist of an outermost layer having a step structure by performing laser machining or exposing and developing processes.

Abstract translation: 本发明公开了一种制造印刷电路板的方法，该印刷电路板通过执行激光加工或曝光和显影工艺来形成具有台阶结构的最外层的阻焊剂。

公开(公告)号：US20130192018A1

公开(公告)日：2013-08-01

申请号：US13878461

申请日：2011-10-26

Applicant: Akihiro Fuchigami ,  Yoichi Okamoto ,  Kohji Tsukahara ,  Yuusuke Taneda ,  Shozo Murata

Inventor： Akihiro Fuchigami ,  Yoichi Okamoto ,  Kohji Tsukahara ,  Yuusuke Taneda ,  Shozo Murata

IPC: B08B5/04

CPC classification number: B08B5/04 ,  B08B7/02 ,  B24C1/04 ,  B24C1/086 ,  B24C3/067 ,  H05K3/0073 ,  H05K3/3489

Abstract: A dry type cleaning case is for cleaning an object with a medium that flies by a revolving airflow. The dry type cleaning case includes a case unit and a leakage prevention unit. The case unit includes a space in which the medium flies, an opening that contacts the object so that the medium collides with the object, a ventilation path through which air flows into the space from outside, a suction opening that suctions the air that has been guided into the space through the ventilation path, to generate the revolving airflow in the space, and a porous unit through which a substance removed from the object is passed to the suction opening. The leakage prevention unit prevents the medium from leaking outside through the opening from the space, by causing outer air to flow in when the case unit is separated from the object.

Abstract translation: 干式清洁盒用于通过旋转气流飞行的介质来清洁物体。 干式清洁盒包括外壳单元和防漏单元。 壳体单元包括介质飞行的空间，与物体接触的开口，使得介质与物体碰撞;空气从外部流入空间的通风路径，吸入已经被空气的空气的吸入口 通过通气路径被引导到空间中，以在空间中产生旋转气流，并且通过该多孔单元将从物体移除的物质通过该多孔单元被传递到吸入口。 泄漏防止单元防止介质从外部通过开口从外部泄漏，当壳体单元与物体分离时，使外部空气流入。

公开(公告)号：US20130176691A1

公开(公告)日：2013-07-11

申请号：US13737709

申请日：2013-01-09

Applicant: Blake Stevens ,  Max Sorenson ,  Sidney Edward Martin, III

Inventor： Blake Stevens ,  Max Sorenson ,  Sidney Edward Martin, III

IPC: H05K3/28 ,  B05C21/00 ,  H05K1/02

CPC classification number: H01L21/02299 ,  B05C21/005 ,  H01L21/027 ,  H01L23/564 ,  H01L2924/0002 ,  H05K1/02 ,  H05K3/0073 ,  H05K3/28 ,  H05K3/284 ,  Y10T29/49002 ,  H01L2924/00

Abstract: One or more masks may be used to control the application of protective (e.g., moisture-resistant, etc.) coatings to one or more portions of various components of an electronic device during assembly of the electronic device. A method for applying a protective coating to an electronic device includes assembling two or more components of the electronic device with one another. A mask may then be applied to the resulting electronic assembly. The mask may shield selected portions of the electronic assembly, while other portions of the electronic assembly, i.e., those to which a protective coating is to be applied, may remain exposed through the mask. With the mask in place, application of a protective coating to portions of the electronic assembly exposed through the mask may commence. After application of the protective coating, the mask may be removed from the electronic assembly. Embodiments of masked electronic assemblies are also disclosed.

Abstract translation: 可以使用一个或多个掩模来控制在组装电子设备期间将电子设备的各种部件的保护（例如防潮等）涂层施加到电子设备的各个部件的一个或多个部分。 将保护涂层施加到电子设备的方法包括将电子设备的两个或更多个部件彼此组装在一起。 然后可以将掩模应​​用于所得到的电子组件。 掩模可以屏蔽电子组件的选定部分，而电子组件的其它部分，即要施加保护涂层的那些部分，可以通过掩模保持暴露。 在面罩就位的情况下，可以开始对通过面罩暴露的电子组件的部分施加保护涂层。 在施加保护涂层之后，可以从电子组件移除掩模。 还公开了掩模电子组件的实施例。

公开(公告)号：US07553457B2

公开(公告)日：2009-06-30

申请号：US10855982

申请日：2004-05-27

Applicant: Tsugio Gomi

Inventor： Tsugio Gomi

IPC: H01L21/306

CPC classification number: G03F7/30 ,  G03F7/3042 ,  H05K1/0393 ,  H05K3/0073 ,  H05K3/0085 ,  H05K3/064 ,  H05K3/068 ,  H05K2203/1545

Abstract: A chemical processing apparatus includes a chemical tank that stores a chemical, means for transferring an object to be processed into the chemical and a lid disposed to cover a liquid surface of the chemical and to float on the chemical.

Abstract translation: 一种化学处理设备包括：储存化学品的化学容器，用于将待处理物体转移到化学品中的装置;以及设置成覆盖化学品的液体表面并漂浮在化学品上的盖子。

公开(公告)号：US20040173463A1

公开(公告)日：2004-09-09

申请号：US10483557

申请日：2004-01-13

Inventor： Jin-ichi Itoh ,  Yasuaki Nishio

IPC: H01M004/86

CPC classification number: G03F7/322 ,  C02F1/4618 ,  G03F7/3057 ,  G03F7/3092 ,  H05K3/0073

Abstract: The present invention provides the development of techniques for development and removal of a resist in place of conventional chemicals, and the techniques to present pollution-free treatment of discharged water involved in this removal technique. Namely, the removal of an uncured resist after exposure of a board 40 is conducted by preferably immersing the board in a sodium carbonate solution tank 42, and then using an electrolyzed alkaline water by a showering apparatus 44, etc.; and the removal of a cured resist after etching is conducted by preferably swelling the cured resist by means of a sodium hydroxide solution and then using an electrolyzed alkaline water. Further, to a resist discharged water containing resist residues removed from the board 40 by means of the electrolyzed alkaline water, the electrolyzed acidic water is mixed to acidify the discharged water to a neutral to weekly acidic range, and then the resist residues are collected and recovered by means of a filter.

Abstract translation: 本发明提供代替常规化学品的抗蚀剂的开发和除去技术的开发，以及涉及该去除技术的排出水的无污染处理技术。 即，通过优选将板浸渍在碳酸钠溶液罐42中，然后通过淋浴装置44等使用电解碱性水，进行板40暴露后的未固化的抗蚀剂的除去。 并且通过优选地通过氢氧化钠溶液使固化的抗蚀剂溶胀，然后使用电解的碱性水来进行蚀刻后去除固化的抗蚀剂。 此外，通过电解碱性水将含有从板40除去的抗蚀剂残留物的抗蚀剂排出水混合，将排出的水酸化至中性至酸性范围，然后收集抗蚀剂残渣， 通过过滤器回收。