公开(公告)号：US20210001589A1

公开(公告)日：2021-01-07

申请号：US17018545

申请日：2020-09-11

Applicant: Bell Textron Inc.

Inventor： Suvankar Mishra ,  Robert Mark Chris ,  Michael D. Ishmael ,  Ronald J. Turner

IPC: B32B3/12 ,  B32B37/06 ,  B32B41/00 ,  B32B27/38 ,  B32B27/28 ,  B32B7/04 ,  B32B5/02 ,  B32B3/06 ,  B32B27/16 ,  B32B7/08 ,  B32B7/02 ,  B32B27/12 ,  B32B3/20

Abstract: In accordance with one embodiment of the present disclosure, a method for manufacturing a honeycomb core sandwich panel includes placing a thermoset facesheet in contact with a thermoplastic honeycomb core without using a separate adhesive and attaching the thermoset facesheet to the thermoplastic honeycomb core by using a curing profile comprising a temperature that is lower than a gel point temperature of the thermoset facesheet and higher than a softening point temperature of the thermoplastic honeycomb core.

公开(公告)号：US20230415448A1

公开(公告)日：2023-12-28

申请号：US18464414

申请日：2023-09-11

Applicant: BELL TEXTRON INC.

Inventor： Suvankar Mishra ,  Robert Mark Chris ,  Michael D. Ishmael ,  Ronald J. Turner

IPC: B32B3/12 ,  B32B37/06 ,  B32B41/00 ,  B32B27/38 ,  B32B27/28 ,  B32B7/04 ,  B32B5/02 ,  B32B3/06 ,  B32B27/16 ,  B32B27/12 ,  B32B3/20 ,  B32B37/14

CPC classification number: B32B3/12 ,  B32B37/06 ,  B32B41/00 ,  B32B27/38 ,  B32B27/285 ,  B32B7/04 ,  B32B27/281 ,  B32B5/02 ,  B32B3/06 ,  B32B27/28 ,  B32B27/16 ,  B32B27/12 ,  B32B3/20 ,  B32B37/146 ,  B32B2309/68 ,  B32B2309/02 ,  B32B2605/18 ,  B32B2307/544 ,  B32B2603/00 ,  B32B2307/712 ,  B32B2260/023 ,  B32B2605/12 ,  B32B2307/552 ,  B32B2439/00 ,  B32B2307/546 ,  B32B2607/00 ,  B32B2605/00 ,  B32B2307/558 ,  B32B2307/54 ,  B32B2250/40 ,  B32B2439/62 ,  B32B2307/732 ,  B32B2260/046 ,  B32B2305/024

Abstract: In accordance with one embodiment of the present disclosure, a method for manufacturing a honeycomb core sandwich panel includes placing a thermoset facesheet in contact with a thermoplastic honeycomb core without using a separate adhesive and attaching the thermoset facesheet to the thermoplastic honeycomb core by using a curing profile comprising a temperature that is lower than a gel point temperature of the thermoset facesheet and higher than a softening point temperature of the thermoplastic honeycomb core.

公开(公告)号：US11787148B2

公开(公告)日：2023-10-17

申请号：US17018545

申请日：2020-09-11

Applicant: BELL TEXTRON INC.

Inventor： Suvankar Mishra ,  Robert Mark Chris ,  Michael D. Ishmael ,  Ronald J. Turner

IPC: B32B3/12 ,  B32B37/06 ,  B32B41/00 ,  B32B27/38 ,  B32B27/28 ,  B32B7/04 ,  B32B5/02 ,  B32B3/06 ,  B32B27/16 ,  B32B27/12 ,  B32B3/20 ,  B32B37/14

CPC classification number: B32B3/12 ,  B32B3/06 ,  B32B3/20 ,  B32B5/02 ,  B32B7/04 ,  B32B27/12 ,  B32B27/16 ,  B32B27/28 ,  B32B27/281 ,  B32B27/285 ,  B32B27/38 ,  B32B37/06 ,  B32B37/146 ,  B32B41/00 ,  B32B2250/40 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2305/024 ,  B32B2307/54 ,  B32B2307/544 ,  B32B2307/546 ,  B32B2307/552 ,  B32B2307/558 ,  B32B2307/712 ,  B32B2307/732 ,  B32B2309/02 ,  B32B2309/68 ,  B32B2439/00 ,  B32B2439/62 ,  B32B2603/00 ,  B32B2605/00 ,  B32B2605/12 ,  B32B2605/18 ,  B32B2607/00

Abstract: In accordance with one embodiment of the present disclosure, a method for manufacturing a honeycomb core sandwich panel includes placing a thermoset facesheet in contact with a thermoplastic honeycomb core without using a separate adhesive and attaching the thermoset facesheet to the thermoplastic honeycomb core by using a curing profile comprising a temperature that is lower than a gel point temperature of the thermoset facesheet and higher than a softening point temperature of the thermoplastic honeycomb core.