Method for manufacturing a motor vehicle structural component from an extruded multichamber hollow profile

    公开(公告)号:US11999413B2

    公开(公告)日:2024-06-04

    申请号:US17539239

    申请日:2021-12-01

    IPC分类号: B62D29/00 B21C23/12 B21C23/14

    摘要: The invention concerns a method for manufacturing a motor vehicle structural component (1) from an extruded multichamber hollow profile, with the following steps:



    a) provision of an extruded profile (2) with at least two precursor hollow chambers (8, 9) which are separated from one another by an inner wall (7), wherein at least one outer wall (3, 4) of at least one precursor hollow chamber (8, 9), in cross-section perpendicularly to the longitudinal extent of the extruded profile (2), has a region (16) with non-linear course,
    b) forming of the extruded profile (2) in at least one of its end regions into the motor vehicle structural component (1), wherein at least the region (16) with non-linear course of the at least one outer wall (3, 4) of the at least one precursor hollow chamber (8, 9), with non-linear course in cross-section, is at least partially straightened, with a change in cross-section of the respective precursor hollow chamber (8, 9) into the cross-section of the corresponding hollow chamber (14, 15) of the motor vehicle structural component (1).

    Process for producing a plate heat exchanger and plate heat exchanger

    公开(公告)号:US11633796B2

    公开(公告)日:2023-04-25

    申请号:US17544653

    申请日:2021-12-07

    摘要: A plate heat exchanger has two metal plates brought into abutment, with a solder material between the plates. The plates are heated up to a first temperature. The plates are placed into a mold, the mold surfaces of which have cavities for envisaged channel structures. Channel structures are formed by local internal pressure forming of at least one plate under pressurization by the tool. The plates are heated up to a second temperature. The plates are solder bonded at the abuted surfaces. A plate heat exchanger has two metal plates, wherein channel structures have been formed in at least one plate and the plates are bonded to one another by soldering away from the channel structures. Eutectic microstructures having a longest extent of less than 50 micrometers are formed in the solder layer.