公开(公告)号：US20180047601A1

公开(公告)日：2018-02-15

申请号：US15673242

申请日：2017-08-09

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Xiaolong HE ,  Zhifu LI ,  Zhiyuan JI ,  Jikai YAO ,  Feng GUAN

IPC: H01L21/677 ,  H01L21/687 ,  H01L21/67

CPC classification number: B65G47/846 ,  B08B3/022 ,  B65G29/02 ,  B65G45/22 ,  H01L21/67132 ,  H01L21/67259 ,  H01L21/67742 ,  H01L21/67781 ,  H01L21/68707

Abstract: The disclosure provides a transfer device and a transfer method using the same. The transfer device comprises a first conveyance roller, a transfer roller and a second conveyance roller. The transfer roller includes a roller body and stamp contacts formed on and protruded from the roller body. The stamp contacts can absorb elements, axes of the first conveyance roller. The transfer roller and the second conveyance roller are arranged in parallel with each other. The transfer roller is interposed between the first and second conveyance rollers. A first roll gap is formed between the first conveyance roller and the transfer roller to convey a medium substrate, and a second roll gap is formed between the second conveyance roller and the transfer roller to convey a target substrate. The transfer device and method can be used to transfer a great amount of elements to the substrate having large size.

公开(公告)号：US20200090586A1

公开(公告)日：2020-03-19

申请号：US15750816

申请日：2017-08-10

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Xiaolong HE ,  Zhifu LI ,  Zhiyuan JI ,  Jikai YAO

IPC: G09G3/3233 ,  G09G3/3266 ,  G09G3/3275

Abstract: The present disclosure provides a pixel circuit and a driving method thereof, a corresponding array substrate and display device. The pixel circuit comprises: an inorganic electroluminescent device, a scan terminal, a data write terminal, a first level input terminal, a second level input terminal, a gating circuit, a drive circuit, and an energy storage circuit.

公开(公告)号：US20180315775A1

公开(公告)日：2018-11-01

申请号：US15772304

申请日：2017-08-16

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Xiaolong HE ,  Zhifu LI ,  Zhiyuan JI ,  Jikai YAO

IPC: H01L27/12 ,  G09G3/32 ,  H01L29/417 ,  H01L29/423

Abstract: An array substrate, a method for fabricating the same, and a display device are disclosed. The array substrate includes a substrate and a plurality of pixel units on the substrate. Each pixel unit comprises at least a thin film transistor and an ILED. A drain of each thin film transistor is connected with a first pole of each ILED through a first electrode line, and a second pole of each ILED is connected with a second electrode line. Since the ILEDs have the advantages of small size, high brightness, high contrast, lightness of weight, low consumption, wide gamut, high efficiency, long lifetime, quick response or the like, the array substrate onto which the ILEDs are applied by transferring has a high resolution, an improved display effect or the like.

公开(公告)号：US20180061687A1

公开(公告)日：2018-03-01

申请号：US15673688

申请日：2017-08-10

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Xiaolong HE ,  Zhifu LI ,  Zhiyuan JI ,  Jikai YAO

IPC: H01L21/67 ,  B65G43/00 ,  B08B7/00 ,  H01L21/68

CPC classification number: H01L21/67144 ,  B08B7/0028 ,  B65G43/00 ,  H01L21/67 ,  H01L21/67259 ,  H01L21/681 ,  H01L24/75 ,  H01L24/95 ,  H01L25/0753 ,  H01L2224/75753 ,  H01L2224/75801 ,  H01L2224/75821 ,  H01L2224/7598 ,  H01L2224/95121

Abstract: This disclosure provides a transfer device and a transfer method thereof. The transfer device comprises: a first machine base that carries a substrate; and at least one transfer assembly that is located above the first machine base, wherein the at least one transfer assembly comprises: a second machine base that carries a target device; a third machine base that is located above the second machine base; and a transfer head that is disposed on the third machine base for acquiring the target device from the second machine base and transferring the target device to a prescribed location on the substrate. In this disclosure, since the transfer assembly is located above the first machine base, a path that the transfer head needs to move along to complete the transfer process is shorter, thereby improving the production efficiency.