PIXEL CIRCUIT, ARRAY SUBSTRATE AND DISPLAY PANEL

    公开(公告)号:US20240395993A1

    公开(公告)日:2024-11-28

    申请号:US18648499

    申请日:2024-04-29

    Abstract: A pixel circuit includes a pixel driving circuit and a bonding unit connected thereto. The bonding unit includes a first bonding terminal group and at least one second bonding terminal group that are arranged in parallel, and the first bonding terminal group and a second bonding terminal group are configured to bond light-emitting devices. The first bonding terminal group includes a first terminal and a second terminal, and the second bonding terminal group includes a third terminal and a fourth terminal. The first terminal and the third terminal are connected, and are both connected to the pixel driving circuit; the second terminal and the fourth terminal are connected, and are both connected to a set voltage signal line.

    Display Panel and Display Apparatus

    公开(公告)号:US20250081764A1

    公开(公告)日:2025-03-06

    申请号:US18279217

    申请日:2022-11-28

    Abstract: A display panel and a display apparatus. The display panel includes a substrate, and pixel islands (Pi) arranged in an array on the substrate, and at least one pixel island (Pi) includes a plurality of pixel drive circuits (10) and a plurality of light emitting devices, wherein a light emitting device includes a first electrode (20), and at least one pixel drive circuit (10) is electrically connected with at least one light emitting device; first electrodes (20) of a plurality of light emitting devices on a same pixel island are arranged in a first direction, and an orthographic projection of a first electrode (20) of at least one light emitting device on the substrate is at least partially overlapped with an orthographic projection of at least two pixel drive circuits (10) on the substrate.

    ULTRASONIC TRANSDUCER, FABRICATION METHOD THEREOF AND ELECTRONIC DEVICE

    公开(公告)号:US20240267680A1

    公开(公告)日:2024-08-08

    申请号:US18021544

    申请日:2022-05-27

    CPC classification number: H04R7/10 H04R31/003

    Abstract: Provides are an ultrasonic transducer, a fabrication method thereof and an electronic device. The ultrasonic transducer includes: an array substrate having a groove, a bottom electrode and an insulation layer, wherein an orthographic projection of the groove on the array substrate is within an orthographic projection of the bottom electrode on the array substrate, and the insulation layer covers the bottom electrode; and an opposite substrate, the opposite substrate and the array substrate are oppositely arranged and are attached to each other, the opposite substrate and the array substrate form a cavity in the groove, the opposite substrate has a top electrode and a vibrating diaphragm layer which are arranged in stack, and an orthographic projection of the top electrode on the array substrate is within the orthographic projection of the bottom electrode on the array substrate.

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