公开(公告)号：US20190136009A1

公开(公告)日：2019-05-09

申请号：US16178243

申请日：2018-11-01

Applicant: BOREALIS AG

Inventor： Takashi UEMATSU ,  Christer SVANBERG ,  Karl-Michael JÄGER ,  Fredrik SKOGMAN ,  Koenraad NOYENS ,  Peter WALTER ,  Malin JOHANSSON

IPC: C08K3/04 ,  H01B7/02 ,  B29B9/12 ,  B29B9/10

Abstract: The invention provides a novel semiconductive polymer composition with improved smoothness and dispersibility of carbon black when compounding the polymer composition and feasible balance with other properties such as volume resistivity. The semiconductive polymer composition comprises (a) from 30 to 90 wt % of a polymer component, (b) from 10 to 70 wt % of carbon black and the carbon black (b) has a mass pellet strength (MPS) according to ASTM D1937-13 of from 50 to 250 N. The invention further relates to a process for preparing the semiconductive polymer composition comprising the steps of: i) introducing 30-90 wt % of a polymer component as defined above and 0-8 wt % additives in a mixer device and mixing the polymer component and additives at elevated temperature such that a polymer melt is obtained; ii) adding 10-70 wt % of a carbon black as defined above to the polymer melt and further mixing of the polymer melt.

公开(公告)号：US20160311998A1

公开(公告)日：2016-10-27

申请号：US15106227

申请日：2014-12-18

Applicant: BOREALIS AG

Inventor： Takashi UEMATSU ,  Christer SVANBERG ,  Karl-Michael JÄGER ,  Fredrik SKOGMAN ,  Koenraad NOYENS ,  Peter WALTER ,  Malin JOHANSSON

IPC: C08K3/04 ,  B29B9/12 ,  B29B9/10 ,  H01B7/02

CPC classification number: C08K3/04 ,  B29B9/10 ,  B29B9/12 ,  B29K2023/0633 ,  B29K2105/16 ,  B29K2507/04 ,  B29K2995/0005 ,  C08L2203/202 ,  H01B7/0216 ,  C08L23/0846

Abstract: The invention provides a novel semiconductive polymer composition with improved smoothness and dispersibility of carbon black when compounding the polymer composition and feasible balance with other properties such as volume resistivity. The semiconductive polymer composition comprises (a) from 30 to 90 wt % of a polymer component, (b) from 10 to 70 wt % of carbon black and the carbon black (b) has a mass pellet strength (MPS) according to ASTM D1937-13 of from 50 to 250 N. The invention further relates to a process for preparing the semiconductive polymer composition comprising the steps of: i) introducing 30-90 wt % of a polymer component as defined above and 0-8 wt % additives in a mixer device and mixing the polymer component and additives at elevated temperature such that a polymer melt is obtained; ii) adding 10-70 wt % of a carbon black as defined above to the polymer melt and further mixing of the polymer melt.

Abstract translation: 本发明提供了一种新型的半导体聚合物组合物，其在混合聚合物组合物时具有改善的炭黑的平滑性和分散性，并且与诸如体积电阻率的其它性质可行平衡。 半导电聚合物组合物包含（a）30至90重量％的聚合物组分，（b）10至70重量％的炭黑，并且炭黑（b）具有根据ASTM D1937的质量颗粒强度（MPS） -13为50至250N。本发明还涉及一种制备半导体聚合物组合物的方法，包括以下步骤：i）将30-90重量％的上述聚合物组分和0-8重量％的添加剂引入 混合装置，并在升高的温度下混合聚合物组分和添加剂，从而获得聚合物熔体; ii）将10-70重量％的如上定义的炭黑加入到聚合物熔体中并进一步混合聚合物熔体。

公开(公告)号：US20170011817A1

公开(公告)日：2017-01-12

申请号：US15120721

申请日：2015-02-20

Applicant: BOREALIS AG

Inventor： Takashi UEMATSU ,  Ola FAGRELL ,  Asa HERMANSSON ,  Asa LINDER

IPC: H01B3/44 ,  C08L23/08 ,  H01B7/02

CPC classification number: H01B3/441 ,  C08K3/04 ,  C08L23/0815 ,  C08L23/0869 ,  C08L43/04 ,  C08L2203/202 ,  C08L2205/02 ,  C08L2205/03 ,  C08L2207/04 ,  C08L2666/04 ,  H01B1/24 ,  H01B7/0216 ,  H01B7/0275

Abstract: This invention relates to silane moisture curable polymer composition and more particularly, to such a polymer composition that is highly diluted by a non-silane containing component, while retaining good high temperatures properties. The invention is a polymer composition comprising a base resin comprising less than 59 wt % of a silane crosslinkable polyethylene (A), an thermoplastic polyolefin free from silane groups (B) wherein the polymer composition comprise a filler with a BET Nitrogen Surface Area larger than 3 m2/g (C). The invention also relates to a cable layer of such polymer composition suitably a semiconducting layer of a power cable.

Abstract translation: 本发明涉及硅烷可湿固化的聚合物组合物，更具体地说，涉及这样一种由非含硅烷组分高度稀释的聚合物组合物，同时保持良好的高温性能。 本发明是一种聚合物组合物，其包含基础树脂，其包含小于59重量％的硅烷可交联聚乙烯（A），不含硅烷基团的热塑性聚烯烃（B），其中所述聚合物组合物包含BET比表面积大于 3m 2 / g（℃）。 本发明还涉及这种聚合物组合物的电缆层，适当地是电力电缆的半导体层。