Abstract:
A voltage controlled oscillator (VCO) with low phase noise and a sharp output spectrum is desirable. The present disclosure provides embodiments of LC tank VCOs that generate output signals with less phase noise compared with conventional LC tank VCOs, while at the same time limiting additional cost, size, and/or power. The embodiments of the present disclosure can be used, for example, in wired or wireless communication systems that require low-phase noise oscillator signals for performing up-conversion and/or down-conversion.
Abstract:
A transmitter front-end for wireless chip-to-chip communication, and for other, longer-range (e.g., several meters or several tens of meters) device-to-device communication is disclosed. The transmitter front-end can include a plurality of reflector power amplifiers implemented on an IC chip and an on-chip or on-package antenna for wireless transmitting a signal to another IC chip or device. The plurality of reflector power amplifiers can reflect the radiation of the on-chip or on-package antenna in a particular pattern such that the effective radiation pattern is reinforced in a desired direction and suppressed in an undesired direction. This helps to reduce the required output power of the transmitter front-end and mitigate interference with other potential wireless chip-to-chip or longer-range communications.
Abstract:
A voltage controlled oscillator (VCO) with low phase noise and a sharp output spectrum is desirable. The present disclosure provides embodiments of LC tank VCOs that generate output signals with less phase noise compared with conventional LC tank VCOs, while at the same time limiting additional cost, size, and/or power. The embodiments of the present disclosure can be used, for example, in wired or wireless communication systems that require low-phase noise oscillator signals for performing up-conversion and/or down-conversion.
Abstract:
A transmitter front-end for wireless chip-to-chip communication, and potentially for other, longer range (e.g., several meters or several tens of meters) device-to-device communication, is disclosed. The transmitter front-end includes a distributed power amplifier capable of providing an output signal with sufficient power for wireless transmission by an on-chip or on-package antenna to another nearby IC chip or device located several meters or several tens of meters away. The distributed power amplifier can be fully integrated (i.e., without using external components, such as bond wire inductors) on a monolithic silicon substrate using, for example, a complementary metal oxide semiconductor (CMOS) process.