Low Phase Noise Voltage Controlled Oscillators
    1.
    发明申请
    Low Phase Noise Voltage Controlled Oscillators 有权
    低相位噪声电压控制振荡器

    公开(公告)号:US20150084708A1

    公开(公告)日:2015-03-26

    申请号:US14561799

    申请日:2014-12-05

    Abstract: A voltage controlled oscillator (VCO) with low phase noise and a sharp output spectrum is desirable. The present disclosure provides embodiments of LC tank VCOs that generate output signals with less phase noise compared with conventional LC tank VCOs, while at the same time limiting additional cost, size, and/or power. The embodiments of the present disclosure can be used, for example, in wired or wireless communication systems that require low-phase noise oscillator signals for performing up-conversion and/or down-conversion.

    Abstract translation: 具有低相位噪声和尖锐输出频谱的压控振荡器(VCO)是理想的。 本公开提供了与常规LC箱VCO相比产生具有较少相位噪声的输出信号的LC槽VCO的实施例,同时限制了额外的成本,尺寸和/或功率。 本公开的实施例可以用于例如需要用于执行上变频和/或下变频的低相位噪声振荡器信号的有线或无线通信系统。

    Reflective Beamforming For Performing Chip-to-Chip And Other Communications
    2.
    发明申请
    Reflective Beamforming For Performing Chip-to-Chip And Other Communications 有权
    用于执行芯片到芯片和其他通信的反射波束形成

    公开(公告)号:US20150145737A1

    公开(公告)日:2015-05-28

    申请号:US14613982

    申请日:2015-02-04

    CPC classification number: H01Q3/00 H01Q1/2283 H01Q15/006 H04B1/00 H04B15/00

    Abstract: A transmitter front-end for wireless chip-to-chip communication, and for other, longer-range (e.g., several meters or several tens of meters) device-to-device communication is disclosed. The transmitter front-end can include a plurality of reflector power amplifiers implemented on an IC chip and an on-chip or on-package antenna for wireless transmitting a signal to another IC chip or device. The plurality of reflector power amplifiers can reflect the radiation of the on-chip or on-package antenna in a particular pattern such that the effective radiation pattern is reinforced in a desired direction and suppressed in an undesired direction. This helps to reduce the required output power of the transmitter front-end and mitigate interference with other potential wireless chip-to-chip or longer-range communications.

    Abstract translation: 公开了用于无线芯片到芯片通信的发射机前端,以及用于其他更长距离(例如,几米或几十米)设备到设备通信的发射机前端。 发射机前端可以包括实现在IC芯片上的多个反射器功率放大器和用于将信号无线发射到另一个IC芯片或设备的片上或封装天线。 多个反射器功率放大器可以以特定图案反映片上或封装内天线的辐射,使得有效辐射图案在期望的方向上被加强并且在不期望的方向上被抑制。 这有助于减少发射机前端的所需输出功率,并减轻与其他潜在的无线芯片到芯片或更远距离通信的干扰。

    On-Chip Distributed Power Amplifier and On-Chip or In-Package Antenna for Performing Chip-To-Chip and Other Communications
    4.
    发明申请
    On-Chip Distributed Power Amplifier and On-Chip or In-Package Antenna for Performing Chip-To-Chip and Other Communications 有权
    片上分布式功率放大器和片上或嵌入式天线,用于执行芯片到芯片和其他通信

    公开(公告)号:US20140087676A1

    公开(公告)日:2014-03-27

    申请号:US13628488

    申请日:2012-09-27

    CPC classification number: H04B1/0483 H04B1/0458

    Abstract: A transmitter front-end for wireless chip-to-chip communication, and potentially for other, longer range (e.g., several meters or several tens of meters) device-to-device communication, is disclosed. The transmitter front-end includes a distributed power amplifier capable of providing an output signal with sufficient power for wireless transmission by an on-chip or on-package antenna to another nearby IC chip or device located several meters or several tens of meters away. The distributed power amplifier can be fully integrated (i.e., without using external components, such as bond wire inductors) on a monolithic silicon substrate using, for example, a complementary metal oxide semiconductor (CMOS) process.

    Abstract translation: 公开了一种用于无线芯片到芯片通信的发射机前端,并且潜在地用于其他较长距离(例如,几米或几十米)的设备到设备通信。 发射机前端包括分布式功率放大器,其能够提供具有足够功率的输出信号,用于通过片上或封装内天线到距离几米或几十米远的另外附近的IC芯片或设备的无线传输。 分布式功率放大器可以使用例如互补金属氧化物半导体(CMOS)工艺,在单片硅衬底上完全集成(即,不使用外部组件,例如接合线电感器)。

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