公开(公告)号：US20140291835A1

公开(公告)日：2014-10-02

申请号：US13852411

申请日：2013-03-28

Applicant: BROADCOM CORPORATION

Inventor： Sergei DEMIN ,  Shaul Klein ,  Igal Yehuda Kushnir

IPC: H01L23/498

CPC classification number: H01L23/66 ,  H01L24/73 ,  H01L2223/6627 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01P3/00 ,  H01P5/107 ,  H05K1/0243 ,  H05K2201/09072 ,  H01L2924/00012 ,  H01L2924/00

Abstract: Embodiments described herein include an integrated circuit (IC) device. For example, the IC device can include a substrate configured to be coupled to a printed circuit board (PCB), an IC die attached to the substrate, and a waveguide launcher formed on the substrate. The waveguide launcher is electrically coupled to the IC die through the substrate.

Abstract translation: 本文描述的实施例包括集成电路（IC）装置。 例如，IC器件可以包括被配置为耦合到印刷电路板（PCB）的基板，附着到基板的IC芯片和形成在基板上的波导发射器。 波导发射器通过衬底电耦合到IC管芯。