公开(公告)号：US20140291835A1

公开(公告)日：2014-10-02

申请号：US13852411

申请日：2013-03-28

Applicant: BROADCOM CORPORATION

Inventor： Sergei DEMIN ,  Shaul Klein ,  Igal Yehuda Kushnir

IPC: H01L23/498

CPC classification number: H01L23/66 ,  H01L24/73 ,  H01L2223/6627 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01P3/00 ,  H01P5/107 ,  H05K1/0243 ,  H05K2201/09072 ,  H01L2924/00012 ,  H01L2924/00

Abstract: Embodiments described herein include an integrated circuit (IC) device. For example, the IC device can include a substrate configured to be coupled to a printed circuit board (PCB), an IC die attached to the substrate, and a waveguide launcher formed on the substrate. The waveguide launcher is electrically coupled to the IC die through the substrate.

Abstract translation: 本文描述的实施例包括集成电路（IC）装置。 例如，IC器件可以包括被配置为耦合到印刷电路板（PCB）的基板，附着到基板的IC芯片和形成在基板上的波导发射器。 波导发射器通过衬底电耦合到IC管芯。

公开(公告)号：US09136230B2

公开(公告)日：2015-09-15

申请号：US13852411

申请日：2013-03-28

Applicant: Broadcom Corporation

Inventor： Sergei Demin ,  Shaul Klein ,  Igal Yehuda Kushnir

IPC: H01L23/498 ,  H01L23/66 ,  H01P3/00 ,  H01P5/107 ,  H05K1/02

CPC classification number: H01L23/66 ,  H01L24/73 ,  H01L2223/6627 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01P3/00 ,  H01P5/107 ,  H05K1/0243 ,  H05K2201/09072 ,  H01L2924/00012 ,  H01L2924/00

Abstract: Embodiments described herein include an integrated circuit (IC) device. For example, the IC device can include a substrate configured to be coupled to a printed circuit board (PCB), an IC die attached to the substrate, and a waveguide launcher formed on the substrate. The waveguide launcher is electrically coupled to the IC die through the substrate.

Abstract translation: 本文描述的实施例包括集成电路（IC）装置。 例如，IC器件可以包括被配置为耦合到印刷电路板（PCB）的基板，附着到基板的IC芯片和形成在基板上的波导发射器。 波导发射器通过衬底电耦合到IC管芯。

公开(公告)号：US20150222281A1

公开(公告)日：2015-08-06

申请号：US14191533

申请日：2014-02-27

Applicant: Broadcom Corporation

Inventor： Igal Kushnir ,  Hung-Ming Chien ,  Wei-Hong Chen ,  Theodoros Chalvatzis ,  Seunghwan Yoon ,  Chin-Ming Chien ,  Tirdad Sowlati ,  Moche Cohen ,  Kobi Sturkovich ,  Shaul Klein

IPC: H03L7/18 ,  H03L7/099

CPC classification number: H03L7/18 ,  H03B19/00 ,  H03B21/00 ,  H03L7/099 ,  H03L7/23

Abstract: A stacked synthesizer for wide local oscillator (LO) generation using a dynamic divider. The phase locked loop can include a plurality of voltage controlled oscillators (VCOs), and a selector that can be configured to select an output of one of the plurality of VCOs. The selected output of one of the plurality of VCOs can be provided to an on-chip dynamic divider and to an off-chip dynamic divider for LO sharing. The dynamic dividers can be configured to generate synthesizer outputs based on a multiplication of the selected output of one of the plurality of VCOs by a factor (1+1/M), where M is a variable number.

Abstract translation: 一种用于使用动态分频器进行宽本地振荡器（LO）生成的堆叠合成器。 锁相环可以包括多个压控振荡器（VCO），以及可被配置为选择多个VCO之一的输出的选择器。 可以将多个VCO中的一个VCO的所选择的输出提供给片上动态分频器和用于LO共享的片外动态分频器。 动态分频器可以被配置为基于多个VCO中的一个VCO的所选择的输出乘以因子（1 + 1 / M）来生成合成器输出，其中M是可变数。