公开(公告)号：US3917983A

公开(公告)日：1975-11-04

申请号：US41510273

申请日：1973-11-12

Applicant: BUNKER RAMO

Inventor： KURONEN JOHN MICHAEL

IPC: H05K3/10 ,  H05K3/44 ,  H05K3/46 ,  H05K5/00

CPC classification number: H05K3/445 ,  H05K3/107 ,  H05K3/4614 ,  H05K2201/09745 ,  H05K2201/09809 ,  H05K2203/0369 ,  Y10T428/12264 ,  Y10T428/12271 ,  Y10T428/12347

Abstract: A construction and method of fabricating a multiwafer electrical circuit structure comprised of a plurality of malleable electrically conductive wafers providing X, Y and Z coaxial connections. The wafers are stacked together under pressure with deformable integral malleable contacts being provided between adjacent wafers for providing wafer-to-wafer Z-axis electrical connections as well as wafer-to-wafer ground connections. The wafers are fabricated from conductive sheets of appropriate malleability in a manner so that the deformable integral malleable Z-axis and ground contacts required between adjacent wafers are fabricated directly from the wafer material.

Abstract translation: 一种制造多晶片电路结构的结构和方法，包括提供X，Y和Z同轴连接的多个可延展的导电晶片。 晶片在压力下堆叠在一起，可变形的整体可延展的触点设置在相邻晶片之间，用于提供晶圆到晶片的Z轴电连接以及晶圆到晶片的接地连接。 晶片由具有合适延展性的导电片制成，使得相邻晶片之间所需的可变形的整体可延展的Z轴和接地触点直接从晶片材料制造。