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公开(公告)号：US08447157B2
公开(公告)日：2013-05-21
申请号：US11424770
申请日：2006-06-16
IPC分类号： G02B6/00
CPC分类号： G02B6/3652 , G02B6/30 , G02B6/3636 , G02B6/368 , G02B6/3692 , G02B6/3839
摘要： A fiber alignment device comprises a base having at least one alignment groove, a stripped portion of an optical fiber positioned in the at least one alignment groove, where a terminal end of the fiber extends beyond at least one of an end face of the base, and an end face of a cover bonded to the base to secure the optical fiber between the base and the cover, where an end face of the cover and the end face of the base are substantially non-parallel.
摘要翻译： 光纤对准装置包括具有至少一个对准凹槽的基座，位于所述至少一个对准凹槽中的光纤的剥离部分，其中所述光纤的末端延伸超出所述基底的端面中的至少一个， 以及盖子的端面，其结合到基座以将光纤固定在基座和盖之间，其中盖的端面和基座的端面基本上不平行。
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2.发明授权公开(公告)号：US07587108B2
公开(公告)日：2009-09-08
申请号：US11424755
申请日：2006-06-16
CPC分类号： G02B6/3652 , G02B6/30 , G02B6/3636 , G02B6/368 , G02B6/3692 , G02B6/3839
摘要： An optical device comprises a cantilevered fiber array coupled to a planar lightwave circuit. The cantilevered fiber array comprises a base supporting at least a portion of at least one optical fiber in a fiber guiding channel and a cover bonded to the base and/or the at least one optical fiber, where a terminal end of the at least one optical fiber extends beyond an end of at least one of the base and cover. The planar lightwave circuit comprises a planar waveguide formed on a substrate, the planar waveguide including a waveguide core. The terminal end of the fiber of the cantilevered fiber array is disposed in an alignment groove formed in a portion of the planar lightwave circuit substrate. A transverse channel is formed in the planar lightwave circuit substrate at an optical interface of the waveguide core and the terminal end of the at least one optical fiber.
摘要翻译： 光学装置包括耦合到平面光波电路的悬臂光纤阵列。 悬臂纤维阵列包括支撑纤维引导通道中的至少一个光纤的至少一部分的基座和结合到基座和/或至少一个光纤的盖，其中至少一个光学器件的末端 纤维延伸超过基底和盖子中的至少一个的端部。 平面光波电路包括形成在基板上的平面波导，平面波导包括波导芯。 悬臂式光纤阵列的纤维的末端设置在形成在平面光波导电路基板的一部分中的对准槽内。 在所述平面光波电路基板中，在所述波导芯和所述至少一个光纤的终端的光学界面处形成横向通道。
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公开(公告)号：US20130221393A1
公开(公告)日：2013-08-29
申请号：US13876373
申请日：2011-10-25
申请人： Guoping Mao , Stephen J. Znameroski , Yu Yang , Terry L. Smith
发明人： Guoping Mao , Stephen J. Znameroski , Yu Yang , Terry L. Smith
IPC分类号： H01L33/50
CPC分类号： H01L33/502 , H01L33/0079 , H01L33/44 , H01L2924/0002 , H01L2933/0025 , H01L2933/0041 , H01L2924/00
摘要： In one embodiment, a semiconductor component, such as a wavelength converter wafer, is described wherein the wavelength converter is bonded to an adjacent inorganic component with a cured bonding layer comprising polysilazane polymer. The wavelength converter may be a multilayer semiconductor wavelength converter or an inorganic matrix comprising embedded phosphor particles. In another embodiment, the semiconductor component is a pump LED component bonded to an adjacent component with a cured bonding layer comprising polysilazane polymer. The adjacent component may the described wavelength converter(s) or another component comprised of inorganic material(s) such as a lens or a prism. Also described are methods of making semiconductor components such as wavelength converters and LED's.
摘要翻译： 在一个实施例中，描述了诸如波长转换器晶片的半导体部件，其中波长转换器通过具有包含聚硅氮烷聚合物的固化粘合层结合到相邻的无机部件。 波长转换器可以是多层半导体波长转换器或包含嵌入的荧光体颗粒的无机基质。 在另一个实施例中，半导体部件是与包含聚硅氮烷聚合物的固化粘合层粘合到相邻部件上的泵浦LED部件。 相邻部件可以是所描述的波长转换器或由诸如透镜或棱镜的无机材料构成的另一部件。 还描述了制造诸如波长转换器和LED的半导体部件的方法。
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公开(公告)号：US09041034B2
公开(公告)日：2015-05-26
申请号：US13876373
申请日：2011-10-25
申请人： Guoping Mao , Stephen J. Znameroski , Yu Yang , Terry L. Smith
发明人： Guoping Mao , Stephen J. Znameroski , Yu Yang , Terry L. Smith
CPC分类号： H01L33/502 , H01L33/0079 , H01L33/44 , H01L2924/0002 , H01L2933/0025 , H01L2933/0041 , H01L2924/00
摘要： In one embodiment, a semiconductor component, such as a wavelength converter wafer, is described wherein the wavelength converter is bonded to an adjacent inorganic component with a cured bonding layer comprising polysilazane polymer. The wavelength converter may be a multilayer semiconductor wavelength converter or an inorganic matrix comprising embedded phosphor particles. In another embodiment, the semiconductor component is a pump LED component bonded to an adjacent component with a cured bonding layer comprising polysilazane polymer. The adjacent component may the described wavelength converter(s) or another component comprised of inorganic material(s) such as a lens or a prism. Also described are methods of making semiconductor components such as wavelength converters and LED's.
摘要翻译： 在一个实施例中，描述了诸如波长转换器晶片的半导体部件，其中波长转换器通过具有包含聚硅氮烷聚合物的固化粘合层结合到相邻的无机部件。 波长转换器可以是多层半导体波长转换器或包含嵌入的荧光体颗粒的无机基质。 在另一个实施例中，半导体部件是与包含聚硅氮烷聚合物的固化粘合层粘合到相邻部件上的泵浦LED部件。 相邻部件可以是所描述的波长转换器或由诸如透镜或棱镜的无机材料构成的另一部件。 还描述了制造诸如波长转换器和LED的半导体部件的方法。
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