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公开(公告)号：US20240062330A1
公开(公告)日：2024-02-22
申请号：US18240021
申请日：2023-08-30
发明人： Anthony George , Thomas Kent , Blaine Miller , Katie Liszewski , Russell Gilabert , Timothy McDonley
CPC分类号： G06T3/4038 , G01S17/86 , G01S13/865 , G01S13/89 , G01S17/89 , G06T3/0068
摘要： A multimodal inspection system (MIS) is disclosed herein. The MIS may use one or more modalities to inspect a sample. Some of the modalities include, but are not limited to, Raman, visible (VIS), terahertz (THz) spectroscopy, longwave infrared (LWIR), shortwave infrared (SWIR), laser profilometry (LP), electromagnetic interference (EMI) near field probing, and/or, Millimeter Wave (MMW) radar.
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公开(公告)号：US11756157B2
公开(公告)日：2023-09-12
申请号：US17216304
申请日：2021-03-29
发明人： Anthony George , Thomas Kent , Blaine Miller , Katie Liszewski , Russell Gilabert , Timothy McDonley
CPC分类号： G06T3/4038 , G01S13/865 , G01S13/89 , G01S17/86 , G01S17/89 , G06T3/0068
摘要： A multimodal inspection system (MIS) is disclosed herein. The MIS may use one or more modalities to inspect a sample. Some of the modalities include, but are not limited to, Raman, visible (VIS), terahertz (THz) spectroscopy, longwave infrared (LWIR), shortwave infrared (SWIR), laser profilometry (LP), electromagnetic interference (EMI) near field probing, and/or, Millimeter Wave (MMW) radar.
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公开(公告)号：US20230044517A1
公开(公告)日：2023-02-09
申请号：US17817904
申请日：2022-08-05
发明人： Timothy A. McDonley , Andrew Elliott , Adam Kimura , Katie T. Liszewski , Thomas Kent , Josh Delozier , Benjamin Hayden
IPC分类号： G06F30/327 , G06F30/337
摘要： The present disclosure provides a method for generating a spatially resolved netlist that includes generating a netlist based on integrated circuit (IC) layout data and standard cell library data, the netlist including cell and net definitions associated with the IC; determining position data for respective cells and nets based on the IC layout data; mapping the position data to respective cell and net definitions in the netlist; and generating a spatially resolved netlist that includes the mapped position data to respective cell and net definitions.
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公开(公告)号：US11315840B2
公开(公告)日：2022-04-26
申请号：US16881848
申请日：2020-05-22
IPC分类号： H01L21/66 , H01L21/304 , B23C3/00 , H01L21/67
摘要： An assembly for monitoring a semiconductor device under test comprising a mill configured to mill the device, a sensor configured to measure an electrical characteristic of the device, and a computer configured to determine the amount of strain in the device from the electrical characteristic when the mill is milling the device and detect an endpoint of milling at a circuit within the device. In use the endpoints of the milling process of the semiconductor device are detected measuring an electrical characteristic of the device with a sensor during milling determining the amount of strain in the device from the electrical characteristic and detecting an endpoint of the milling process within the device based on the amount of strain.
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公开(公告)号：US20220020114A1
公开(公告)日：2022-01-20
申请号：US17216304
申请日：2021-03-29
发明人： Anthony George , Thomas Kent , Blaine Miller , Katie Liszewski , Russell Gilabert , Timothy McDonley
摘要： A multimodal inspection system (MIS) is disclosed herein. The MIS may use one or more modalities to inspect a sample. Some of the modalities include, but are not limited to, Raman, visible (VIS), terahertz (THz) spectroscopy, longwave infrared (LWIR), shortwave infrared (SWIR), laser profilometry (LP), electromagnetic interference (EMI) near field probing, and/or, Millimeter Wave (MMW) radar.
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