摘要:
A method and device for driving the word lines of a phase change memory device is provided. The method may include applying a first voltage level to non-selected word lines and a second voltage level to selected word lines during a normal operational mode, and placing the word lines in a floating state during a standby operational mode. The phase change memory device may include a plurality of word line drive circuits for driving corresponding word lines, where each of the plurality of word line drive circuits includes a drive unit which sets a corresponding word line to a first voltage level or a second voltage level in response to a first control signal, and a mode selector which selectively applies the first voltage level to the driving unit according to an operational mode of the phase change memory device.
摘要:
A method and device for driving the word lines of a phase change memory device is provided. The method may include applying a first voltage level to non-selected word lines and a second voltage level to selected word lines during a normal operational mode, and placing the word lines in a floating state during a standby operational mode. The phase change memory device may include a plurality of word line drive circuits for driving corresponding word lines, where each of the plurality of word line drive circuits includes a drive unit which sets a corresponding word line to a first voltage level or a second voltage level in response to a first control signal, and a mode selector which selectively applies the first voltage level to the driving unit according to an operational mode of the phase change memory device.
摘要:
In a semiconductor memory device and method, resistive-change memory cells are provided, each including a plurality of control transistors formed on different layers and variable resistance devices comprising a resistive-change memory. Each resistive-change memory cell includes a plurality of control transistors formed on different layers, and a variable resistance device formed of a resistive-change memory. In one example, the number of the control transistors is two. The semiconductor memory device includes a global bit line; a plurality of local bit lines connected to or disconnected from the global bit line via local bit line selection circuits which correspond to the local bit lines, respectively; and a plurality of resistive-change memory cell groups storing data while being connected to the local bit lines, respectively. Each of the resistive-change memory cells of each of the resistive-change memory cell groups comprises a plurality of control transistors formed on different layers, and a variable resistance device formed of a resistive-change memory. In addition, the semiconductor memory device has a hierarchical bit line structure that uses a global bit line and local bit lines. Accordingly, it is possible to increase both the integration density of the semiconductor memory device and the amount of current flowing through each of the resistive-change memory cells.
摘要:
In a semiconductor memory device and method, resistive-change memory cells are provided, each including a plurality of control transistors formed on different layers and variable resistance devices comprising a resistive-change memory. Each resistive-change memory cell includes a plurality of control transistors formed on different layers, and a variable resistance device formed of a resistive-change memory. In one example, the number of the control transistors is two. The semiconductor memory device includes a global bit line; a plurality of local bit lines connected to or disconnected from the global bit line via local bit line selection circuits which correspond to the local bit lines, respectively; and a plurality of resistive-change memory cell groups storing data while being connected to the local bit lines, respectively. Each of the resistive-change memory cells of each of the resistive-change memory cell groups comprises a plurality of control transistors formed on different layers, and a variable resistance device formed of a resistive-change memory. In addition, the semiconductor memory device has a hierarchical bit line structure that uses a global bit line and local bit lines. Accordingly, it is possible to increase both the integration density of the semiconductor memory device and the amount of current flowing through each of the resistive-change memory cells.
摘要:
In a semiconductor memory device and method, phase-change memory cells are provided, each including a plurality of control transistors formed on different layers and variable resistance devices formed of a phase-change material. Each phase-change memory cell includes a plurality of control transistors formed on different layers, and a variable resistance device formed of a phase-change material. In one example, the number of the control transistors is two. The semiconductor memory device includes a global bit line; a plurality of local bit lines connected to or disconnected from the global bit line via local bit line selection circuits which correspond to the local bit lines, respectively; and a plurality of phase-change memory cell groups storing data while being connected to the local bit lines, respectively. Each of the phase-change memory cells of each of the phase-change memory cell groups comprises a plurality of control transistors formed on different layers, and a variable resistance device formed of a phase-change material. In addition, the semiconductor memory device has a hierarchical bit line structure that uses a global bit line and local bit lines. Accordingly, it is possible to increase both the integration density of the semiconductor memory device and the amount of current flowing through each of the phase-change memory cells.
摘要:
A phase-change random access memory device includes a global bit line connected to a write circuit and a read circuit; a plurality of local bit lines, each of which being connected to a plurality of phase-change memory cells; and a plurality of column select transistors selectively connecting the global bit line with each of the plurality of local bit lines. Each column select transistor has a resistance that depends on distance from the write circuit and the read circuit.
摘要:
A phase-change random access memory device includes a global bit line connected to a write circuit and a read circuit; a plurality of local bit lines, each of which being connected to a plurality of phase-change memory cells; and a plurality of column select transistors selectively connecting the global bit line with each of the plurality of local bit lines. Each column select transistor has a resistance that depends on distance from the write circuit and the read circuit.
摘要:
A channel equalizer and a method of equalizing a channel. The channel equalizer includes a filter unit to filter an input training sequence signal and an input data signal according to a tap coefficient, a first multiplexer to calculate a priori error of each of the training sequence signal and the data signal, a decision unit to generate the training sequence signal and to soft-determine or hard-determine an output signal of the filter unit, an error signal generation unit to generate a priori error signal using an output signal of the decision unit and to generate an estimated posteriori error signal using the priori error signal, a first correction unit to correct a first adaptive step size algorithm using the signal input to the filter unit and the generated priori error signal and to correct a second adaptive step size algorithm using the signal input to the filter unit and the estimated posteriori error signal, and a second multiplexer to select one of the corrected first adaptive step size algorithm and the corrected second adaptive step size algorithm to be applied to the training sequence signal and the data signal, respectively.
摘要:
A phase-change random access memory (PRAM) device includes a plurality of banks, a plurality of column redundancy cell arrays, and a plurality of column redundancy write drivers. Each of the plurality of column redundancy cell arrays corresponds to at least one of the banks. Each of the plurality of column redundancy write drivers corresponds to at least one of the column redundancy cell arrays. The column redundancy write drivers are configured to transmit respective redundancy test data to the corresponding ones of the column redundancy cell arrays in response to a test control signal, which may be activated in response to each program pulse for writing data. Related test and access methods are also discussed.
摘要:
A phase-change random access memory (PRAM) device includes a plurality of banks, a plurality of column redundancy cell arrays, and a plurality of column redundancy write drivers. Each of the plurality of column redundancy cell arrays corresponds to at least one of the banks. Each of the plurality of column redundancy write drivers corresponds to at least one of the column redundancy cell arrays. The column redundancy write drivers are configured to transmit respective redundancy test data to the corresponding ones of the column redundancy cell arrays in response to a test control signal, which may be activated in response to each program pulse for writing data. Related test and access methods are also discussed.