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公开(公告)号:US20090283313A1
公开(公告)日:2009-11-19
申请号:US12507771
申请日:2009-07-22
申请人: Ben Wei CHEN , Jin S. WANG , David Hong-Dien CHEN
发明人: Ben Wei CHEN , Jin S. WANG , David Hong-Dien CHEN
CPC分类号: B29C45/14647 , B29C45/14655 , B29C45/14836 , B29C45/2708 , H01L21/565 , H01L2224/48091 , H01L2224/48227 , H01L2924/19105 , H01L2924/30107 , H05K1/117 , H05K3/284 , H05K2201/10159 , H05K2201/10689 , H05K2201/10734 , H05K2203/1311 , H05K2203/1316 , H05K2203/304 , H01L2924/00014 , H01L2924/00
摘要: A shape-molding structure of a memory card comprises a circuit substrate, at least one chip, and an encapsulant covering. The upper and lower surfaces of the circuit substrate have a circuit layer and a plurality of electric contacts, respectively. The chip is located on the upper surface of the circuit substrate and electrically connected with the circuit layer. The encapsulant covering is formed by using a mold to press encapsulant entering at least one encapsulant inlet provided on at least one side surface of the circuit substrate. The encapsulant covering encapsulates all the above components with only the electric contacts exposed. A trace mark of the encapsulant inlet remaining on the encapsulant covering is then cut to obtain a shape-molding structure of memory card with an smooth and intact outer appearance.
摘要翻译: 存储卡的形状模制结构包括电路基板,至少一个芯片和密封剂覆盖物。 电路基板的上表面和下表面分别具有电路层和多个电触点。 芯片位于电路基板的上表面并与电路层电连接。 密封剂覆盖物通过使用模具来挤压进入设置在电路基板的至少一个侧表面上的至少一个密封剂入口的密封剂而形成。 密封剂覆盖物仅将电触头暴露在外,将所有上述组件封装起来。 然后切割保留在密封剂覆盖物上的密封剂入口的痕迹,以获得具有平滑和完整外观的存储卡的形状模制结构。
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公开(公告)号:US20100133673A1
公开(公告)日:2010-06-03
申请号:US12702207
申请日:2010-02-08
IPC分类号: H01L23/52
CPC分类号: H01L25/18 , H01L23/5387 , H01L23/5388 , H01L24/48 , H01L24/49 , H01L25/0657 , H01L2224/05553 , H01L2224/32145 , H01L2224/48091 , H01L2224/48137 , H01L2224/48145 , H01L2224/48227 , H01L2224/48235 , H01L2224/49175 , H01L2225/06506 , H01L2225/0651 , H01L2225/06527 , H01L2225/06562 , H01L2225/06572 , H01L2225/06575 , H01L2225/06579 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/10161 , H01L2924/15173 , H01L2924/15192 , H01L2924/19107 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要: A Flash memory card is disclosed comprising a substrate, a Flash memory die on top of the substrate, a controller die on top of the Flash memory die, and an interposer coupled to with the controller die and on top of the Flash memory die wherein the interposer results in substantial reduced wire bonding to the substrate. The interposer can surround or be placed side by side with the controller die. A system and method in accordance with the present invention achieves the following objectives: (1) takes advantage of as large of a Flash memory die as possible, to increase the density of the Flash card by reducing the number of wire bond pads on the substrate and enabling insertion of the largest die possible that can fit inside a given card interior boundary; (2) more efficiently stacks Flash memory dies to increase density of the Flash card; and (3) has a substantially less number of bonding wires to the substrate as possible, to improve production yield.
摘要翻译: 公开了一种闪存卡,其包括衬底,在衬底顶部的闪存存储器管芯,在闪存存储器管芯的顶部上的控制器管芯,以及与控制器管芯连接并在闪存管芯的顶部上的插入器,其中, 插入器导致大大减少了与基板的引线接合。 插入器可以围绕或与控制器管芯并排放置。 根据本发明的系统和方法实现了以下目的:(1)尽可能地利用尽可能大的闪存存储器管芯,通过减少衬底上的引线接合焊盘的数量来增加闪存卡的密度 并且能够插入可以装配在给定卡内部边界内的最大的模具; (2)更有效地堆叠闪存芯片,增加闪存卡的密度; 和(3)尽可能少的与基板的接合线数量,以提高产量。
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