MODELING MEMORY CELL SKEW SENSITIVITY
    1.
    发明申请
    MODELING MEMORY CELL SKEW SENSITIVITY 有权
    建模记忆细胞灵敏度

    公开(公告)号:US20130332136A1

    公开(公告)日:2013-12-12

    申请号:US13490096

    申请日:2012-06-06

    IPC分类号: G06G7/62

    CPC分类号: G06F17/5063 G06F17/5036

    摘要: A method includes designating a cell mismatch parameter of a memory cell including a plurality of transistors and an initial value of a transistor mismatch parameter for each of the plurality of transistors. A critical current sensitivity parameter is determined for each of the plurality of transistors based on the transistor mismatch parameters in a computing apparatus. The cell mismatch parameter is distributed across the plurality of transistors in the computing apparatus to update the individual transistor mismatch parameters for each of the plurality of transistors based on the critical current sensitivity parameters and the cell mismatch parameter. The memory cell is simulated based on the individual transistor mismatch parameters to generate a simulation result.

    摘要翻译: 一种方法包括指定包括多个晶体管的存储单元的单元不匹配参数以及多个晶体管中的每一个的晶体管失配参数的初始值。 基于计算装置中的晶体管失配参数,为多个晶体管中的每一个确定临界电流灵敏度参数。 单元不匹配参数分布在计算设备中的多个晶体管上,以基于临界电流灵敏度参数和单元不匹配参数来更新多个晶体管中的每一个的各个晶体管失配参数。 基于单个晶体管失配参数来模拟存储单元以产生模拟结果。

    Modeling memory cell skew sensitivity
    2.
    发明授权
    Modeling memory cell skew sensitivity 有权
    建模记忆体偏移灵敏度

    公开(公告)号:US09069922B2

    公开(公告)日:2015-06-30

    申请号:US13490096

    申请日:2012-06-06

    IPC分类号: G06F17/50

    CPC分类号: G06F17/5063 G06F17/5036

    摘要: A method includes designating a cell mismatch parameter of a memory cell including a plurality of transistors and an initial value of a transistor mismatch parameter for each of the plurality of transistors. A critical current sensitivity parameter is determined for each of the plurality of transistors based on the transistor mismatch parameters in a computing apparatus. The cell mismatch parameter is distributed across the plurality of transistors in the computing apparatus to update the individual transistor mismatch parameters for each of the plurality of transistors based on the critical current sensitivity parameters and the cell mismatch parameter. The memory cell is simulated based on the individual transistor mismatch parameters to generate a simulation result.

    摘要翻译: 一种方法包括指定包括多个晶体管的存储单元的单元不匹配参数以及多个晶体管中的每一个的晶体管失配参数的初始值。 基于计算装置中的晶体管失配参数,为多个晶体管中的每一个确定临界电流灵敏度参数。 单元不匹配参数分布在计算设备中的多个晶体管上,以基于临界电流灵敏度参数和单元不匹配参数来更新多个晶体管中的每一个的各个晶体管失配参数。 基于单个晶体管失配参数来模拟存储单元以产生模拟结果。

    Integrated circuit with a fin-based fuse, and related fabrication method
    3.
    发明授权
    Integrated circuit with a fin-based fuse, and related fabrication method 有权
    具有鳍式保险丝的集成电路及相关制造方法

    公开(公告)号:US08569116B2

    公开(公告)日:2013-10-29

    申请号:US13171228

    申请日:2011-06-28

    摘要: Methods of fabricating an integrated circuit with a fin-based fuse, and the resulting integrated circuit with a fin-based fuse are provided. In the method, a fin is created from a layer of semiconductor material and has a first end and a second end. The method provides for forming a conductive path on the fin from its first end to its second end. The conductive path is electrically connected to a programming device that is capable of selectively directing a programming current through the conductive path to cause a structural change in the conductive path to increase resistance across the conductive path.

    摘要翻译: 提供了制造具有鳍式保险丝的集成电路的方法,以及所得到的具有鳍式保险丝的集成电路。 在该方法中,由半导体材料层产生翅片并具有第一端和第二端。 该方法提供了在翅片上从其第一端到其第二端形成导电路径。 导电路径电连接到编程设备,该编程设备能够选择性地将编程电流引导通过导电路径,从而导致导电路径中的结构变化,以增加穿过导电路径的电阻。

    MEMORY CELL WITH ASYMMETRIC READ PORT TRANSISTORS
    4.
    发明申请
    MEMORY CELL WITH ASYMMETRIC READ PORT TRANSISTORS 审中-公开
    具有非对称读端口晶体管的存储单元

    公开(公告)号:US20130341723A1

    公开(公告)日:2013-12-26

    申请号:US13531969

    申请日:2012-06-25

    IPC分类号: H01L27/088 H01L21/336

    摘要: A memory cell includes a storage element and a read port. The read port includes a first transistor having a first gate coupled to the storage element, a first source region, and a first drain region. The second transistor includes a second gate, a second source region coupled to the first drain region, and a second drain region. A first dopant profile of the first and second source regions is asymmetric with respect to a second dopant profile of the first and second drain regions.

    摘要翻译: 存储单元包括存储元件和读取端口。 读端口包括第一晶体管,其具有耦合到存储元件的第一栅极,第一源极区域和第一漏极区域。 第二晶体管包括第二栅极,耦合到第一漏极区域的第二源极区域和第二漏极区域。 第一和第二源极区域的第一掺杂物分布相对于第一和第二漏极区域的第二掺杂物分布是不对称的。

    Finfet SRAM cell using low mobility plane for cell stability and method for forming
    6.
    发明授权
    Finfet SRAM cell using low mobility plane for cell stability and method for forming 有权
    Finfet SRAM单元使用低迁移率平面进行电池稳定性和形成方法

    公开(公告)号:US06967351B2

    公开(公告)日:2005-11-22

    申请号:US10011351

    申请日:2001-12-04

    摘要: The present invention provides a device design and method for forming the same that results in Fin Field Effect Transistors having different gains without negatively impacting device density. The present invention forms relatively low gain FinFET transistors in a low carrier mobility plane and relatively high gain FinFET transistors in a high carrier mobility plane. Thus formed, the FinFETs formed in the high mobility plane have a relatively higher gain than the FinFETs formed in the low mobility plane. The embodiments are of particular application to the design and fabrication of a Static Random Access Memory (SRAM) cell. In this application, the bodies of the n-type FinFETs used as transfer devices are formed along the {110} plane. The bodies of the n-type FinFETs and p-type FinFETs used as the storage latch are formed along the {100}. Thus formed, the transfer devices will have a gain approximately half that of the n-type storage latch devices, facilitating proper SRAM operation.

    摘要翻译: 本发明提供了一种用于形成它的器件设计和方法,其导致Fin场效应晶体管具有不同的增益而不会不利地影响器件密度。 本发明在低载流子迁移率平面中形成相对较低的增益FinFET晶体管,并在高载流子迁移率平面内形成相对较高的增益FinFET晶体管。 如此形成的,在高迁移率平面中形成的FinFET具有比在低迁移率平面中形成的FinFET更高的增益。 这些实施例特别适用于静态随机存取存储器(SRAM)单元的设计和制造。 在这种应用中,用作转移装置的n型FinFET的主体沿{110}平面形成。 用作存储锁存器的n型FinFET和p型FinFET的主体沿{100}形成。 如此形成的,传送装置的增益大约是n型存储锁存装置的增益的一半,有利于适当的SRAM操作。

    Selective silicide blocking
    7.
    发明授权
    Selective silicide blocking 失效
    选择性硅化物封闭

    公开(公告)号:US06881672B2

    公开(公告)日:2005-04-19

    申请号:US10723700

    申请日:2003-11-26

    IPC分类号: H01L21/8238 H01L21/44

    摘要: A selectively silicided semiconductor structure and a method for fabricating same is disclosed herein. The semiconductor structure has silicide present on the polysilicon line between the N+ diffusion or N+ active area and the P+ diffusion or active area at the N+/P+ junction of the polysilicon line, and silicide is not present on the N+ active area and the P+ active area. The presence of this selective silicidation creates a beneficial low-resistance connection between the N+ region of the polysilicon line and the P+ region of the polysilicon line. The absence of silicidation on the N+ and P+ active areas, specifically on the PFET and NFET structures, prevents current leakage associated with the silicidation of devices.

    摘要翻译: 本文公开了选择性硅化半导体结构及其制造方法。 半导体结构在多晶硅线路上存在硅化物,N +扩散区域或N +有源区域与多晶硅线路的N + / P +结处的P +扩散区域或有源区域之间存在硅化物,而N +有源区域和P +活性区域上不存在硅化物 区。 这种选择性硅化的存在在多晶硅线的N +区和多晶硅线的P +区之间产生有益的低电阻连接。 在N +和P +有源区,特别是PFET和NFET结构上不存在硅化,可防止与器件硅化相关的电流泄漏。

    Structure for scalable, low-cost polysilicon DRAM in a planar capacitor
    8.
    发明授权
    Structure for scalable, low-cost polysilicon DRAM in a planar capacitor 失效
    在平面电容器中可扩展的低成本多晶硅DRAM的结构

    公开(公告)号:US06815751B2

    公开(公告)日:2004-11-09

    申请号:US10064301

    申请日:2002-07-01

    IPC分类号: H01L218234

    摘要: Capacitor structures that have increased capacitance without compromising cell area are provided as well as methods for fabricating the same. A first capacitor structure includes insulating material present in holes that are formed in a semiconductor substrate, where the insulating material is thicker on the bottom wall of each capacitor hole as compared to the sidewalls of each hole. In another capacitor structure, deep capacitor holes are provided that have an isolation implant region present beneath each hole.

    Method and design for measuring SRAM array leakage macro (ALM)
    9.
    发明授权
    Method and design for measuring SRAM array leakage macro (ALM) 失效
    SRAM阵列泄漏宏(ALM)测量方法与设计

    公开(公告)号:US06778449B2

    公开(公告)日:2004-08-17

    申请号:US10064302

    申请日:2002-07-01

    IPC分类号: G11C700

    摘要: A method and structure for a test structure that has an array of cells connected together by conductive lines. The conductive lines connect the cells together as if they were a single cell. The conductive lines can include common word line; a common bit line; a common bit line complement line, a common N-well voltage line, a common interior ground line, a common interior voltage line, and/or a common ground line.

    摘要翻译: 用于具有通过导线连接在一起的单元阵列的测试结构的方法和结构。 导线将电池连接在一起,就像它们是单个电池一样。 导线可以包括通用字线; 一个普通的位线 公共位线补码线,公共N阱电压线,公共内部地线,公共内部电压线和/或公共接地线。

    Buried butted contact and method for fabricating
    10.
    发明授权
    Buried butted contact and method for fabricating 失效
    埋地接头和制造方法

    公开(公告)号:US06335272B1

    公开(公告)日:2002-01-01

    申请号:US09637935

    申请日:2000-08-14

    IPC分类号: H01L214763

    摘要: A buried butted contact and method for its fabrication are provided which includes a substrate having dopants of a first conductivity type and having shallow trench isolation. Dopants of a second conductivity type are located in the bottom of an opening in said substrate. Ohmic contact is provided between the dopants in the substrate and the low diffusivity dopants that is located on a side wall of the opening. The contact is a metal silicide, metal and/or metal alloy.

    摘要翻译: 提供了一种用于其制造的埋地对接接触和方法,其包括具有第一导电类型的掺杂剂并且具有浅沟槽隔离的衬底。 第二导电类型的掺杂剂位于所述衬底中的开口的底部。 在衬底中的掺杂剂和位于开口的侧壁上的低扩散性掺杂剂之间提供欧姆接触。 接触是金属硅化物,金属和/或金属合金。