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公开(公告)号：US20180092253A1
公开(公告)日：2018-03-29
申请号：US15280746
申请日：2016-09-29
申请人： Bo Qiu , Xi Guo , James C. Raupp , Michael Ahrens , David Pidwerbecki , Steven J. Lofland , George H. Daskalakis , Stacy L. Yee , Mark MacDonald
发明人： Bo Qiu , Xi Guo , James C. Raupp , Michael Ahrens , David Pidwerbecki , Steven J. Lofland , George H. Daskalakis , Stacy L. Yee , Mark MacDonald
CPC分类号： H05K7/20509 , G06F1/1681 , G06F1/203 , H05K1/0203 , H05K1/0204 , H05K1/0209 , H05K1/181 , H05K5/0017 , H05K5/0226 , H05K7/20409 , H05K7/20963 , H05K2201/066
摘要： Apparatuses, systems and methods associated with flexible heat spreader design are disclosed herein. In embodiments, an electronic device may include a component, a heat dissipation member, and a flexible member. The heat dissipation member may be coupled to the component via a flexible portion of the electronic device, the component located on a first side of the flexible portion and the heat dissipation member located on a second side of the flexible portion. The flexible member may be thermally coupled to the component and the heat dissipation member, wherein the flexible member extends along the flexible portion from the first side to the second side and is to transfer heat from the component to the heat dissipation member. Other embodiments may be described and/or claimed.
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公开(公告)号：US20180091987A1
公开(公告)日：2018-03-29
申请号：US15280986
申请日：2016-09-29
申请人： Ralph V. Miele , Eduardo Escamilla , James Utz , James M. Yoder , Tongyan Zhai , Baomin Liu , Meenakshi Gupta , Brian R. Peil , Venkat R. Gaurav , Drew G. Damm , Andrew Larson , Ricky O. Branner , Steven J. Lofland , George H. Daskalakis , James C. Raupp , Michael Ahrens , David Pidwerbecki , Bo Qiu , Stacy L. Yee
发明人： Ralph V. Miele , Eduardo Escamilla , James Utz , James M. Yoder , Tongyan Zhai , Baomin Liu , Meenakshi Gupta , Brian R. Peil , Venkat R. Gaurav , Drew G. Damm , Andrew Larson , Ricky O. Branner , Steven J. Lofland , George H. Daskalakis , James C. Raupp , Michael Ahrens , David Pidwerbecki , Bo Qiu , Stacy L. Yee
CPC分类号： H04W4/50 , G06F1/1613
摘要： Disclosed is a mobile device. The mobile device may be located proximate a mobile terminal and controlled by the mobile terminal. The mobile device may include a processor and a memory. The memory may store instructions that, when executed by the processor, cause the processor to: determine a mode of operation of the mobile device, determine a thermal profile for the mode of operation of the mobile device, and implement a power profile to achieve the thermal profile.
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公开(公告)号：US20180004252A1
公开(公告)日：2018-01-04
申请号：US15201097
申请日：2016-07-01
申请人： Michael Ahrens , George H. Daskalakis , Steven J. Lofland , David Pidwerbecki , Bo Qiu , James C. Raupp , Stacy L. Yee
发明人： Michael Ahrens , George H. Daskalakis , Steven J. Lofland , David Pidwerbecki , Bo Qiu , James C. Raupp , Stacy L. Yee
CPC分类号： G06F1/1652 , E05D3/022 , E05Y2900/606 , G06F1/1616 , G06F1/1641 , G06F1/1681 , H04M1/0214 , H04M1/0247 , H04M1/0268 , H04M2250/16 , H05K5/0226
摘要： Systems, methods and apparatuses may provide for a flexible display assembly including a flexible display and a backplane coupled to the flexible display, wherein at least a portion of the backplane comprises a super elastic sheet. In one example, the backplane includes a first rigid sheet metal portion and a second rigid sheet metal portion, wherein the super-elastic sheet is joined between the first and second rigid sheet metal portions.
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