摘要:
Systems, methods and apparatuses may provide for a flexible display assembly including a flexible display and a backplane coupled to the flexible display, wherein at least a portion of the backplane comprises a super elastic sheet. In one example, the backplane includes a first rigid sheet metal portion and a second rigid sheet metal portion, wherein the super-elastic sheet is joined between the first and second rigid sheet metal portions.
摘要:
Disclosed is a mobile device. The mobile device may be located proximate a mobile terminal and controlled by the mobile terminal. The mobile device may include a processor and a memory. The memory may store instructions that, when executed by the processor, cause the processor to: determine a mode of operation of the mobile device, determine a thermal profile for the mode of operation of the mobile device, and implement a power profile to achieve the thermal profile.
摘要:
Apparatuses, systems and methods associated with flexible heat spreader design are disclosed herein. In embodiments, an electronic device may include a component, a heat dissipation member, and a flexible member. The heat dissipation member may be coupled to the component via a flexible portion of the electronic device, the component located on a first side of the flexible portion and the heat dissipation member located on a second side of the flexible portion. The flexible member may be thermally coupled to the component and the heat dissipation member, wherein the flexible member extends along the flexible portion from the first side to the second side and is to transfer heat from the component to the heat dissipation member. Other embodiments may be described and/or claimed.
摘要:
Crosstalk in a piezo printhead is reduced by selecting an actuation signal for a nozzle, determining a time delay and a pulse width extension based on adjacent actuation signals of adjacent nozzles, and applying the time delay and pulse width extension to the actuation signal.
摘要:
Systems and methods may provide for a device including a housing, one or more electronic components positioned within the housing, and a first cured resin composition positioned within the housing, the first cured resin composition including a thermal energy storage material and a first filler material. The device may also include a second cured resin composition positioned within the housing, the second cured resin composition including the thermal energy storage material and a second filler material. The first filler material and the second filler material may be different, wherein the first cured resin composition and the second cured resin composition may encompass at least one of the one or more electronic components. In other examples, the electronic components include a power supply and the device complies with an ATEX equipment directive for explosive atmospheres. Moreover, component underfill and/or assembly overmold processes may be used to fabricate the device.
摘要:
Systems and methods may provide for a device including a housing, one or more electronic components positioned within the housing, and a first cured resin composition positioned within the housing, the first cured resin composition including a thermal energy storage material and a first filler material. The device may also include a second cured resin composition positioned within the housing, the second cured resin composition including the thermal energy storage material and a second filler material. The first filler material and the second filler material may be different, wherein the first cured resin composition and the second cured resin composition may encompass at least one of the one or more electronic components. In other examples, the electronic components include a power supply and the device complies with an ATEX equipment directive for explosive atmospheres. Moreover, component underfill and/or assembly overmold processes may be used to fabricate the device.
摘要:
A printhead is disclosed herein. The printhead includes a die substrate having a surface. A trench is defined in the die substrate surface, and a support is positioned in the trench. A compliant membrane is attached to the die substrate surface, and a gap is defined between a distal end of the support and the compliant membrane.
摘要:
A high resolution printer includes a printhead having optimized features including 12 to 14 micron diameter orifices spaced apart from adjacent orifices by a distance of between 76 to 94 microns. The orifice plate is electroformed and plated to a thickness ranging from 20 to 25 microns. A polymeric barrier layer secures the orifice plate to a printhead substrate.
摘要:
A printhead is disclosed herein. The printhead includes a die substrate having a surface. A trench is defined in the die substrate surface, and a support is positioned in the trench. A compliant membrane is attached to the die substrate surface, and a gap is defined between a distal end of the support and the compliant membrane.