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公开(公告)号：US20190139456A1
公开(公告)日：2019-05-09
申请号：US16087193
申请日：2017-03-21
发明人： Sidlgata V. Sreenivasan , Shrawan Singhal , Ovadia Abed , Lawrence Dunn , Aseem Sayal , Benjamin Eynon
摘要： A portable system to enable broad access to micro- and nano-scale technologies. The portable system includes a fabrication module configured to enable creation of a small tech device or structure or to enable demonstration of a small tech process. The portable system further includes a metrology module configured to allow measuring, testing or characterizing a property of the small tech device, structure or process. Furthermore, the portable system includes a quality control module configured to validate results from the metrology module against a set of expected results measured independently.
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公开(公告)号：US11669009B2
公开(公告)日：2023-06-06
申请号：US16322842
申请日：2017-08-03
发明人： Sidlgata V. Sreenivasan , Shrawan Singhal , Ovadia Abed , Lawrence Dunn , Paras Ajay , Ofodike Ezekoye
CPC分类号： G03F7/0002 , B82Y40/00 , G01Q60/24
摘要： A method for fabricating patterns on a flexible substrate in a roll-to-roll configuration. Drops of a monomer diluted in a solvent are dispensed on a substrate, where the drops spontaneously spread and merge with one another to form a liquid resist formulation. The solvent is evaporated (e.g., blanket evaporation) from the liquid resist formulation followed by selective multi-component resist film evaporation resulting in a non-uniform and substantially continuous film on the substrate. The gap between the film on the substrate and a template is closed such that the film fills the features of the template. After cross-linking the film to polymerize the film, the template is separated from the substrate thereby leaving the polymerized film on the substrate.
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公开(公告)号：US11469131B2
公开(公告)日：2022-10-11
申请号：US16472766
申请日：2017-12-22
发明人： Sidlgata V. Sreenivasan , Paras Ajay , Aseem Sayal , Mark McDermott , Shrawan Singhal , Ovadia Abed , Lawrence Dunn , Vipul Goyal , Michael Cullinan
IPC分类号： H01L21/683 , G06F30/392 , G06F30/398 , G06F30/396 , B81C99/00 , H01L23/544 , G06F117/10
摘要： A method for assembling heterogeneous components. The assembly process includes using a vacuum based pickup mechanism in conjunction with sub-nm precise more alignment techniques resulting in highly accurate, parallel assembly of feedstocks.
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4.发明申请公开(公告)号：US20210389666A1
公开(公告)日：2021-12-16
申请号：US16322882
申请日：2017-08-03
摘要： A method for fabricating patterns. An inverse optimization scheme is implemented to determine process parameters used to obtain a desired film thickness of a liquid resist formulation, where the liquid resist formulation includes a solvent and one or more non-solvent components. A substrate is covered with a substantially continuous film of the liquid resist formulation using one or more of the following techniques: dispensing discrete drops of a diluted monomer on the substrate using an inkjet and allowing the dispensed drops to spontaneously spread and merge, slot die coating and spin-coating. The liquid resist formulation is diluted in the solvent. The solvent is then substantially evaporated from the liquid resist formulation forming a film. A gap between a template and the substrate is then closed. The film is cured to polymerize the film and the substrate is separated from the template leaving the polymerized film on the substrate.
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公开(公告)号：US20210134640A1
公开(公告)日：2021-05-06
申请号：US16472766
申请日：2017-12-22
发明人： Sidlgata V. Sreenivasan , Paras Ajay , Aseem Sayal , Mark McDermott , Shrawan Singhal , Ovadia Abed , Lawrence Dunn , Vipul Goyal , Michael Cullinan
IPC分类号： H01L21/683 , B81C99/00 , G06F30/398 , G06F30/396 , G06F30/392 , H01L23/544
摘要： A method for assembling heterogeneous components. The assembly process includes using a vacuum based pickup mechanism in conjunction with sub-nm precise more alignment techniques resulting in highly accurate, parallel assembly of feedstocks.
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6.发明公开公开(公告)号：US20240332056A1
公开(公告)日：2024-10-03
申请号：US18739152
申请日：2024-06-10
发明人： Sidlgata V. Sreenivasan , Paras Ajay , Aseem Sayal , Mark McDermott , Shrawan Singhal , Ovadia Abed , Lawrence Dunn , Vipul Goyal , Michael Cullinan
IPC分类号： H01L21/683 , B81C99/00 , G06F30/392 , G06F30/396 , G06F30/398 , G06F117/10 , H01L23/544
CPC分类号： H01L21/6835 , B81C99/002 , G06F30/392 , G06F30/396 , G06F30/398 , H01L21/6838 , H01L23/544 , G06F2117/10 , H01L2221/68309 , H01L2221/68322 , H01L2221/68354 , H01L2221/68368 , H01L2221/68381 , H01L2223/54426 , H01L2223/54473
摘要： A method for assembling heterogeneous components. The assembly process includes using a vacuum based pickup mechanism in conjunction with sub-nm precise moiré alignment techniques resulting in highly accurate, parallel assembly of feedstocks.
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公开(公告)号：US12009247B2
公开(公告)日：2024-06-11
申请号：US17959932
申请日：2022-10-04
发明人： Sidlgata V. Sreenivasan , Paras Ajay , Aseem Sayal , Mark McDermott , Shrawan Singhal , Ovadia Abed , Lawrence Dunn , Vipul Goyal , Michael Cullinan
IPC分类号： H01L21/683 , B81C99/00 , G06F30/392 , G06F30/396 , G06F30/398 , G06F117/10 , H01L23/544
CPC分类号： H01L21/6835 , B81C99/002 , G06F30/392 , G06F30/396 , G06F30/398 , H01L21/6838 , H01L23/544 , G06F2117/10 , H01L2221/68309 , H01L2221/68322 , H01L2221/68354 , H01L2221/68368 , H01L2221/68381 , H01L2223/54426 , H01L2223/54473
摘要： A method for assembling heterogeneous components. The assembly process includes using a vacuum based pickup mechanism in conjunction with sub-nm precise moiré alignment techniques resulting in highly accurate, parallel assembly of feedstocks.
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公开(公告)号：US20230042873A1
公开(公告)日：2023-02-09
申请号：US17959932
申请日：2022-10-04
发明人： Sidlgata V. Sreenivasan , Paras Ajay , Aseem Sayal , Mark McDermott , Shrawan Singhal , Ovadia Abed , Lawrence Dunn , Vipul Goyal , Michael Cullinan
IPC分类号： H01L21/683 , G06F30/392 , G06F30/398 , G06F30/396 , B81C99/00 , H01L23/544
摘要： A method for assembling heterogeneous components. The assembly process includes using a vacuum based pickup mechanism in conjunction with sub-nm precise moiré alignment techniques resulting in highly accurate, parallel assembly of feedstocks.
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9.发明授权公开(公告)号：US11762284B2
公开(公告)日：2023-09-19
申请号：US16322882
申请日：2017-08-03
CPC分类号： G03F7/0002 , B82Y40/00 , G01Q60/24
摘要： A method for fabricating patterns. An inverse optimization scheme is implemented to determine process parameters used to obtain a desired film thickness of a liquid resist formulation, where the liquid resist formulation includes a solvent and one or more non-solvent components. A substrate is covered with a substantially continuous film of the liquid resist formulation using one or more of the following techniques: dispensing discrete drops of a diluted monomer on the substrate using an inkjet and allowing the dispensed drops to spontaneously spread and merge, slot die coating and spin-coating. The liquid resist formulation is diluted in the solvent. The solvent is then substantially evaporated from the liquid resist formulation forming a film. A gap between a template and the substrate is then closed. The film is cured to polymerize the film and the substrate is separated from the template leaving the polymerized film on the substrate.
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公开(公告)号：US20230088746A1
公开(公告)日：2023-03-23
申请号：US17801481
申请日：2021-02-25
摘要： A method and system for nanoscale precision programmable profiling on substrates. Profiling material is dispensed on a substrate or a superstrate. The superstrate is brought in contact with the substrate. The profiling material is then cured after bringing the superstrate in contact with the substrate. The superstrate is separated from the substrate after curing. An optical metrology of points on the substrate corresponding to the final substrate profile is then performed.
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