专利检索 ap:("Bohan Shan" OR "Dingying Xu" OR "Kristof Darmawikarta" OR "Srinivas Venkata Ramanuja Pietambaram" OR "Hongxia Feng" OR "Gang Duan" OR "Jung Kyu Han" OR "Xiaoying Guo" OR "Jeremy D. Ecton" OR "Santosh Tripathi" OR "Bai Nie" OR "Haobo Chen" OR "Kyle Jordan Arrington" OR "Yue Deng" OR "Wei Wei") AND inv:"Haobo Chen" 第 1 页

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发明申请
OMNI DIRECTIONAL INTERCONNECT WITH MAGNETIC FILLERS IN MOLD MATRIX 有权

公开(公告)号：US20230101629A1

公开(公告)日：2023-03-30

申请号：US17484315

申请日：2021-09-24

申请人： Bohan Shan , Dingying Xu , Kristof Darmawikarta , Srinivas Venkata Ramanuja Pietambaram , Hongxia Feng , Gang Duan , Jung Kyu Han , Xiaoying Guo , Jeremy D. Ecton , Santosh Tripathi , Bai Nie , Haobo Chen , Kyle Jordan Arrington , Yue Deng , Wei Wei

发明人： Bohan Shan , Dingying Xu , Kristof Darmawikarta , Srinivas Venkata Ramanuja Pietambaram , Hongxia Feng , Gang Duan , Jung Kyu Han , Xiaoying Guo , Jeremy D. Ecton , Santosh Tripathi , Bai Nie , Haobo Chen , Kyle Jordan Arrington , Yue Deng , Wei Wei

IPC分类号： H01L21/48 , H01L23/538 , H01L23/29 , H01L23/26 , H01L21/56 , H01L23/24

摘要： Various embodiments disclosed relate to methods of making omni-directional semiconductor interconnect bridges. The present disclosure includes semiconductor assemblies including a mold layer having mold material, a first filler material dispersed in the mold material, and a second filler material dispersed in the mold material, wherein the second filler material is heterogeneously dispersed.