公开(公告)号：US20230101629A1

公开(公告)日：2023-03-30

申请号：US17484315

申请日：2021-09-24

申请人： Bohan Shan ,  Dingying Xu ,  Kristof Darmawikarta ,  Srinivas Venkata Ramanuja Pietambaram ,  Hongxia Feng ,  Gang Duan ,  Jung Kyu Han ,  Xiaoying Guo ,  Jeremy D. Ecton ,  Santosh Tripathi ,  Bai Nie ,  Haobo Chen ,  Kyle Jordan Arrington ,  Yue Deng ,  Wei Wei

发明人： Bohan Shan ,  Dingying Xu ,  Kristof Darmawikarta ,  Srinivas Venkata Ramanuja Pietambaram ,  Hongxia Feng ,  Gang Duan ,  Jung Kyu Han ,  Xiaoying Guo ,  Jeremy D. Ecton ,  Santosh Tripathi ,  Bai Nie ,  Haobo Chen ,  Kyle Jordan Arrington ,  Yue Deng ,  Wei Wei

IPC分类号： H01L21/48 ,  H01L23/538 ,  H01L23/29 ,  H01L23/26 ,  H01L21/56 ,  H01L23/24

摘要： Various embodiments disclosed relate to methods of making omni-directional semiconductor interconnect bridges. The present disclosure includes semiconductor assemblies including a mold layer having mold material, a first filler material dispersed in the mold material, and a second filler material dispersed in the mold material, wherein the second filler material is heterogeneously dispersed.

公开(公告)号：US20230089928A1

公开(公告)日：2023-03-23

申请号：US17482351

申请日：2021-09-22

申请人： Ziyin Lin ,  Yiqun Bai ,  Hongxia Feng ,  Dingying Xu ,  Jieying Kong ,  Srinivas Pietambaram

发明人： Ziyin Lin ,  Yiqun Bai ,  Hongxia Feng ,  Dingying Xu ,  Jieying Kong ,  Srinivas Pietambaram

IPC分类号： H01L23/31 ,  H01L23/18 ,  H01L23/29 ,  H01L23/538 ,  H01L23/00 ,  H01L21/56

摘要： Semiconductor devices having hollow filler materials are disclosed. A disclosed example semiconductor device includes at least one of a substrate or an interposer, interconnects extending through the at least one of the substrate or the interposer, and a composite material integral with or covering at least a portion of the semiconductor device, the composite material including a polymer matrix with a hollow filler material having voids therein.

公开(公告)号：US20160122684A1

公开(公告)日：2016-05-05

申请号：US14694133

申请日：2015-04-23

申请人： Lianzhou Jiang ,  Yang Li ,  Xiaonan Sui ,  Baokun Qi ,  Zhongjiang Wang ,  Yan Zhang ,  Hongxia Feng ,  Huan Wang ,  Wenjun Ma

发明人： Lianzhou Jiang ,  Yang Li ,  Xiaonan Sui ,  Baokun Qi ,  Zhongjiang Wang ,  Yan Zhang ,  Hongxia Feng ,  Huan Wang ,  Wenjun Ma

IPC分类号： C11B1/10

CPC分类号： C11B1/10 ,  C11B1/025 ,  C11B1/04 ,  C11B3/16

摘要： The present invention provides a method for aqueous enzymatic extraction of soybean oil, which is in the field of extraction processing technology for plant oil. The method comprises treating crushed and peeled soybeans with an extrusion puffing process and a hydrolysis process with an alkaline proteinase, followed by a liquid nitrogen freezing and a high voltage electrostatic thawing process, and finally obtaining soybean oil by centrifugation. The benefits of the present invention includes short extraction time and high extraction yield. It saves up to 93.1% of time in the freezing and thawing process alone. The total oil yield is up to 95.4%. Furthermore, the method of the invention produces high quality oil with a low peroxide value, a low p-anisidine value and a low TOTOX value.

摘要翻译： 本发明提供一种用于植物油提取加工技术领域的大豆油的水性酶提取方法。 该方法包括用挤出膨化法和用碱性蛋白酶水解过程处理破碎和剥离的大豆，然后进行液氮冷冻和高压静电解冻过程，最后通过离心获得大豆油。 本发明的优点包括提取时间短和萃取率高。 它只能在冻融过程中节省高达93.1％的时间。 总产油率高达95.4％。 此外，本发明的方法生产具有低过氧化值，低对茴香胺值和低TOTOX值的高品质油。