公开(公告)号：US20200257202A1

公开(公告)日：2020-08-13

申请号：US16785163

申请日：2020-02-07

Applicant: Brewer Science, Inc.

Inventor： Tony D. Flaim ,  Gu Xu ,  Jennifer S. See

IPC: G03F7/20 ,  C08G16/02 ,  C08F222/32 ,  G03F7/16

Abstract: Methods of preparing poly(cyanocinnamate)s are provided, with those involving mild conditions and resulting in a soluble polymer that is stable at room temperature and can be coated onto microelectronic substrates. The polymer includes at least one bis(cyanoacetate) monomer and at least one aromatic dialdehyde monomer. The polymer exhibits good thermal and structural properties and high absorbance in the UV range.

公开(公告)号：US20170040200A1

公开(公告)日：2017-02-09

申请号：US15332581

申请日：2016-10-24

Applicant: Brewer Science Inc.

Inventor： Dongshun Bai ,  Gu Xu ,  Debbie Blumenshine ,  Baron Huang ,  Andy Wong

IPC: H01L21/683 ,  C08G77/14 ,  C08G77/20 ,  C09J7/02 ,  C08G77/26 ,  C09J5/04 ,  C09J145/00 ,  C09J183/06 ,  H01L21/50 ,  C08G77/18

CPC classification number: H01L21/6835 ,  B32B7/06 ,  B32B7/12 ,  B32B9/045 ,  B32B27/08 ,  B32B27/16 ,  B32B27/283 ,  B32B27/325 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2457/14 ,  C08G77/14 ,  C08G77/18 ,  C08G77/20 ,  C08G77/26 ,  C09J5/06 ,  C09J145/00 ,  C09J183/06 ,  C09J2203/326 ,  C09J2205/302 ,  C09J2423/00 ,  H01L21/50 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381

Abstract: The invention broadly relates to cyclic olefin polymer bonding compositions and release compositions, to be used independently or together, that enable thin wafer handling during microelectronics manufacturing, especially during a full-wafer mechanical debonding process. The release compositions comprise compositions made from siloxane polymers and copolymers blended in a polar solvent, and that are stable at room temperature for longer than one month. The cyclic olefin polymer bonding compositions provide high thermal stability, can be bonded to fully-treated carrier wafers, can be mechanically or laser debonded after high-temperature heat treatment, and are easily removed with an industrially-acceptable solvent. Wafers bonded according to the invention demonstrate lower overall post-grind stack TTV compared to other commercial bonding materials and can survive 200° C. PECVD processing.

Abstract translation: 本发明广泛地涉及单独或一起使用的环烯烃聚合物粘合组合物和释放组合物，其能够在微电子制造期间实现薄晶片处理，特别是在全晶片机械剥离过程中。 释放组合物包含由硅氧烷聚合物和共聚物在极性溶剂中共混制成的组合物，并且在室温下稳定长达一个月以上。 环状烯烃聚合物粘合组合物提供高热稳定性，可以结合到完全处理的载体晶片上，可以在高温热处理后机械或激光脱粘，并且易于用工业上可接受的溶剂除去。 根据本发明结合的晶片与其他商业粘合材料相比表现出更低的整体后研磨堆叠TTV，并且可以在200℃下进行PECVD处理。

公开(公告)号：US09865490B2

公开(公告)日：2018-01-09

申请号：US15332581

申请日：2016-10-24

Applicant: Brewer Science Inc.

Inventor： Dongshun Bai ,  Gu Xu ,  Debbie Blumenshine ,  Baron Huang ,  Andrew Wong

IPC: H01L21/00 ,  H01L21/683 ,  H01L21/50 ,  C08G77/14 ,  C08G77/20 ,  C08G77/18 ,  C08G77/26 ,  C09J145/00 ,  C09J183/06 ,  B32B7/06 ,  B32B7/12 ,  B32B27/08 ,  B32B27/28 ,  B32B27/32 ,  C09J5/06

CPC classification number: H01L21/6835 ,  B32B7/06 ,  B32B7/12 ,  B32B9/045 ,  B32B27/08 ,  B32B27/16 ,  B32B27/283 ,  B32B27/325 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2457/14 ,  C08G77/14 ,  C08G77/18 ,  C08G77/20 ,  C08G77/26 ,  C09J5/06 ,  C09J145/00 ,  C09J183/06 ,  C09J2203/326 ,  C09J2205/302 ,  C09J2423/00 ,  H01L21/50 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381

Abstract: The invention broadly relates to cyclic olefin polymer bonding compositions and release compositions, to be used independently or together, that enable thin wafer handling during microelectronics manufacturing, especially during a full-wafer mechanical debonding process. The release compositions comprise compositions made from siloxane polymers and copolymers blended in a polar solvent, and that are stable at room temperature for longer than one month. The cyclic olefin polymer bonding compositions provide high thermal stability, can be bonded to fully-treated carrier wafers, can be mechanically or laser debonded after high-temperature heat treatment, and are easily removed with an industrially-acceptable solvent. Wafers bonded according to the invention demonstrate lower overall post-grind stack TTV compared to other commercial bonding materials and can survive 200° C. PECVD processing.

公开(公告)号：US09496164B2

公开(公告)日：2016-11-15

申请号：US14590531

申请日：2015-01-06

Applicant: Brewer Science Inc.

Inventor： Dongshun Bai ,  Gu Xu ,  Debbie Blumenshine

IPC: H01L21/00 ,  H01L21/683 ,  B32B7/06 ,  B32B7/12 ,  B32B27/08 ,  B32B27/28 ,  B32B27/32

CPC classification number: H01L21/6835 ,  B32B7/06 ,  B32B7/12 ,  B32B27/08 ,  B32B27/283 ,  B32B27/325 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2457/14 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381

Abstract: The invention broadly relates to cyclic olefin polymer bonding compositions and release compositions, to be used independently or together, that enable thin wafer handling during microelectronics manufacturing, especially during a full-wafer mechanical debonding process. The release compositions comprise compositions made from siloxane polymers and copolymers blended in a polar solvent, and that are stable at room temperature for longer than one month. The cyclic olefin polymer bonding compositions provide high thermal stability, can be bonded to fully-treated carrier wafers, can be mechanically or laser debonded after high-temperature heat treatment, and are easily removed with an industrially-acceptable solvent. Wafers bonded according to the invention demonstrate lower overall post-grind stack TTV compared to other commercial bonding materials and can survive 200° C. PECVD processing.

Abstract translation: 本发明广泛地涉及单独或一起使用的环烯烃聚合物粘合组合物和释放组合物，其能够在微电子制造期间实现薄晶片处理，特别是在全晶片机械剥离过程中。 释放组合物包含由硅氧烷聚合物和共聚物在极性溶剂中共混制成的组合物，并且在室温下稳定长达一个月以上。 环状烯烃聚合物粘合组合物提供高热稳定性，可以结合到完全处理的载体晶片上，可以在高温热处理后机械或激光脱粘，并且易于用工业上可接受的溶剂除去。 根据本发明结合的晶片与其他商业粘合材料相比表现出更低的整体后研磨堆叠TTV，并且可以在200℃下进行PECVD处理。

公开(公告)号：US20150194331A1

公开(公告)日：2015-07-09

申请号：US14590531

申请日：2015-01-06

Applicant: Brewer Science Inc.

Inventor： Dongshun Bai ,  Gu Xu ,  Debbie Blumenshine

IPC: H01L21/683 ,  H01L21/50

CPC classification number: H01L21/6835 ,  B32B7/06 ,  B32B7/12 ,  B32B27/08 ,  B32B27/283 ,  B32B27/325 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2457/14 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381

Abstract: The invention broadly relates to cyclic olefin polymer bonding compositions and release compositions, to be used independently or together, that enable thin wafer handling during microelectronics manufacturing, especially during a full-wafer mechanical debonding process. The release compositions comprise compositions made from siloxane polymers and copolymers blended in a polar solvent, and that are stable at room temperature for longer than one month. The cyclic olefin polymer bonding compositions provide high thermal stability, can be bonded to fully-treated carrier wafers, can be mechanically or laser debonded after high-temperature heat treatment, and are easily removed with an industrially-acceptable solvent. Wafers bonded according to the invention demonstrate lower overall post-grind stack TTV compared to other commercial bonding materials and can survive 200° C. PECVD processing.

Abstract translation: 本发明广泛地涉及单独或一起使用的环烯烃聚合物粘合组合物和释放组合物，其能够在微电子制造期间实现薄晶片处理，特别是在全晶片机械剥离过程中。 释放组合物包含由硅氧烷聚合物和共聚物在极性溶剂中共混制成的组合物，并且在室温下稳定长达一个月以上。 环状烯烃聚合物粘合组合物提供高热稳定性，可以结合到完全处理的载体晶片上，可以在高温热处理后机械或激光脱粘，并且易于用工业上可接受的溶剂除去。 根据本发明结合的晶片与其他商业粘合材料相比表现出更低的整体后研磨堆叠TTV，并且可以在200℃下进行PECVD处理。

公开(公告)号：US20130201635A1

公开(公告)日：2013-08-08

申请号：US13763251

申请日：2013-02-08

Applicant: BREWER SCIENCE INC.

Inventor： Gu Xu

IPC: B32B7/06 ,  H05K1/18

CPC classification number: B32B7/06 ,  B32B7/12 ,  B32B2255/26 ,  B32B2457/00 ,  C09J5/00 ,  C09J2203/326 ,  H05K1/18 ,  Y10T428/24174 ,  Y10T428/24612 ,  Y10T428/3154 ,  Y10T428/31544

Abstract: This invention is related to compositions that prepare substrate surfaces to enable temporary wafer bonding during microelectronics manufacturing, especially using a zonal bonding process. This invention, which comprises compositions made from fluorinated silanes blended in a polar solvent, can be used to form surface coatings or treatments having a high contact angle with water (>85°). The resulting silane solutions are stable at room temperature for longer than one month.

Abstract translation: 本发明涉及制备衬底表面以在微电子制造期间实现临时晶片接合的组合物，特别是使用带状粘合工艺。 包含由在极性溶剂中共混的氟化硅烷制成的组合物的本发明可用于形成与水（> 85°）高接触角的表面涂层或处理。 得到的硅烷溶液在室温下稳定超过一个月。