公开(公告)号：US20030219541A1

公开(公告)日：2003-11-27

申请号：US10411046

申请日：2003-04-09

Applicant: Brewer Science, Inc.

Inventor： Ram W. Sabnis ,  Wu-Sheng Shih ,  Douglas J. Guerrero

IPC: B05D003/02 ,  H01L021/31

CPC classification number: G02B1/11 ,  G02B1/111 ,  G03F7/091

Abstract: An improved method for applying polymeric antireflective coatings to substrate surfaces and the resulting precursor structures are provided. Broadly, the methods comprise plasma enhanced chemical vapor depositing (PECVD) a polymer on the substrate surfaces. The most preferred starting monomers are 4-fluorostyrene, 2,3,4,5,6-pentafluorostyrene, and allylpentafluorobenzene. The PECVD processes comprise subjecting the monomers to sufficient electric current and pressure so as to cause the monomers to sublime to form a vapor which is then changed to the plasma state by application of an electric current. The vaporized monomers are subsequently polymerized onto a substrate surface in a deposition chamber. The inventive methods are useful for providing highly conformal antireflective coatings on large surface substrates having super submicron (0.25 nullm or smaller) features. The process provides a much faster deposition rate than conventional chemical vapor deposition (CVD) methods, is environmentally friendly, and is economical

Abstract translation: 提供了一种用于将聚合物抗反射涂层施加到基底表面和所得前体结构的改进方法。 广泛地，这些方法包括在衬底表面上的等离子体增强化学气相沉积（PECVD）聚合物。 最优选的起始单体是4-氟苯乙烯，2,3,4,5,6-五氟苯乙烯和烯丙基五氟苯。 PECVD方法包括使单体经受足够的电流和压力，以使单体升华以形成蒸汽，然后通过施加电流将其转化为等离子体状态。 蒸发的单体随后在沉积室中聚合到基底表面上。 本发明的方法可用于在具有超亚微米（0.25μm或更小）特征的大表面基底上提供高保形抗反射涂层。 该方法提供比常规化学气相沉积（CVD）方法更快的沉积速率，是环境友好的并且是经济的

公开(公告)号：US20030203320A1

公开(公告)日：2003-10-30

申请号：US10378435

申请日：2003-03-03

Applicant: BREWER SCIENCE, INC.

Inventor： Ram W. Sabnis ,  James E. Lamb III

IPC: G03F007/16 ,  G03F007/40 ,  B32B003/10

CPC classification number: H01L21/02274 ,  G03F7/40 ,  H01L21/02118 ,  H01L21/0212 ,  H01L21/312 ,  H01L21/76816 ,  H01L21/76885 ,  Y10T428/24331 ,  Y10T428/24562

Abstract: Novel processes of applying a thin, uniform, conformal organic polymeric film by a wide variety of deposition processes into lithography pattern substrates are provided. The inventive processes result in shrinking of the gaps in the lithography pattern equally, thus producing a smaller dimension. The amount of pattern shrinkage is selectively controlled by controlling the deposition rate to provide the desired final structure dimension. A wide variety of organic films is used as materials for these films. The inventive methods are applicable to any patterning technique used in lithography to provide a reduction in pattern sizes. Examples of the applicable device levels include the production of gate layers, ion implantation of active device layers and substantive metal layers, dielectric patterning, interconnect processes produced by damascene, dual damascene, backend packaging layers, and devices requiring multiple layers deposited by electrodeposition, CVD or sputtering. The inventive methods are useful for providing highly conformal coatings on large surface substrates having super submicron (i.e., 0.15 nullm or smaller) features. The process is environmentally friendly and relatively low cost compared to other options.

Abstract translation: 提供了通过各种各样的沉积工艺将薄的，均匀的共形有机聚合物膜应用于光刻图案衬底的新方法。 本发明的方法导致平版印刷图案中间隙的缩小，从而产生更小的尺寸。 通过控制沉积速率以提供期望的最终结构尺寸来选择性地控制图案收缩量。 使用各种有机薄膜作为这些薄膜的材料。 本发明的方法适用于在光刻中使用的任何图案化技术以提供图案尺寸的减小。 可应用的器件级别的实例包括栅极层的生产，有源器件层的离子注入和实质金属层，电介质图案化，由镶嵌生成的互连工艺，双镶嵌，后端封装层以及需要通过电沉积沉积多层的器件 或溅射。 本发明的方法可用于在具有超亚微米（即0.15μm或更小）特征的大表面基底上提供高保形涂层。 与其他选项相比，该过程是环保的，成本相对较低。

公开(公告)号：US20030224586A1

公开(公告)日：2003-12-04

申请号：US10423618

申请日：2003-04-24

Applicant: Brewer Science, Inc.

Inventor： Ram W. Sabnis

IPC: H01L021/20

CPC classification number: B05D1/62 ,  C09D4/00 ,  C09D165/00 ,  G02B1/111 ,  G03F7/091 ,  G03F7/167 ,  H01L21/0276 ,  C08F238/00

Abstract: An improved method for applying polymeric antireflective coatings to substrate surfaces and the resulting precursor structures are provided. Broadly, the methods comprise plasma enhanced chemical vapor depositing (PECVD) a polymer on the substrate surfaces. The PECVD processes comprise providing a quantity of a polymer generated by introducing monomer vapors into a plasma state followed by polymerization thereof, with assistance of plasma energy, onto the surface of a substrate. The most preferred starting monomers are phenylacetylene, 4-ethynyltoluene, and 1-ethynyl-2-fluorobenzene. The inventive methods are useful for providing highly conformal antireflective coatings on large surface substrates having super submicron (0.25 nullm or smaller) features. The process provides a much faster deposition rate than conventional chemical vapor deposition (CVD) methods, is environmentally friendly, and is economical.

Abstract translation: 提供了一种用于将聚合物抗反射涂层施加到基底表面和所得前体结构的改进方法。 广泛地，这些方法包括在衬底表面上的等离子体增强化学气相沉积（PECVD）聚合物。 PECVD方法包括提供一定量的聚合物，其通过将单体蒸气引入等离子体状态，然后在等离子体能量的帮助下将其聚合到基底表面上。 最优选的起始单体是苯乙炔，4-乙炔基甲苯和1-乙炔基-2-氟苯。 本发明的方法可用于在具有超亚微米（0.25μm或更小）特征的大表面基底上提供高保形抗反射涂层。 该方法提供比常规化学气相沉积（CVD）方法更快的沉积速率，是环境友好的并且是经济的。

公开(公告)号：US20030054117A1

公开(公告)日：2003-03-20

申请号：US09778980

申请日：2001-02-02

Applicant: BREWER SCIENCE, INC.

Inventor： Ram W. Sabnis ,  Douglas J. Guerrero

IPC: C23C016/00 ,  C08F002/46 ,  C08J007/18 ,  H01L021/469 ,  H01L021/4763

CPC classification number: G02B1/11 ,  G03F7/091 ,  H01L21/0276

Abstract: An improved method for applying polymeric antireflective coatings to substrate surfaces and the resulting precursor structures are provided. Broadly, the methods comprise plasma enhanced chemical vapor depositing (PECVD) a polymer on the substrate surfaces. The most preferred starting monomers are 4-fluorostyrene, 2,3,4,5,6-pentafluorostyrene, and allylpentafluorobenzene. The PECVD processes comprise subjecting the monomers to sufficient electric current and pressure so as to cause the monomers to sublime to form a vapor which is then changed to the plasma state by application of an electric current. The vaporized monomers are subsequently polymerized onto a substrate surface in a deposition chamber. The inventive methods are useful for providing highly conformal antireflective coatings on large surface substrates having super submicron (0.25 nullm or smaller) features. The process provides a much faster deposition rate than conventional chemical vapor deposition (CVD) methods, is environmentally friendly, and is economical.

Abstract translation: 提供了一种用于将聚合物抗反射涂层施加到基底表面和所得前体结构的改进方法。 广泛地，这些方法包括在衬底表面上的等离子体增强化学气相沉积（PECVD）聚合物。 最优选的起始单体是4-氟苯乙烯，2,3,4,5,6-五氟苯乙烯和烯丙基五氟苯。 PECVD方法包括使单体经受足够的电流和压力，以使单体升华以形成蒸汽，然后通过施加电流将其转化为等离子体状态。 蒸发的单体随后在沉积室中聚合到基底表面上。 本发明的方法可用于在具有超亚微米（0.25μm或更小）特征的大表面基底上提供高保形抗反射涂层。 该方法提供比常规化学气相沉积（CVD）方法更快的沉积速率，是环境友好的并且是经济的。