公开(公告)号：US20160372326A1

公开(公告)日：2016-12-22

申请号：US15188620

申请日：2016-06-21

申请人： Brewer Science Inc.

发明人： Xing-Fu Zhong ,  Runhui Huang ,  Boyu Zhang

IPC分类号： H01L21/033 ,  C09D179/08 ,  C09D131/02

CPC分类号： H01L21/0337 ,  C09D125/08 ,  C09D131/02 ,  C09D179/08 ,  H01L21/02118 ,  H01L21/02282

摘要： Planarizing and spin-on-carbon (SOC) compositions that fill vias and/or trenches on a substrate while planarizing the surface in a single thin layer coating process are provided. The compositions can planarize wide ranges of substrates with vias or trenches of from about 20 nm to about 220 nm wide, and up to about 700 nm deep. These extraordinary properties come from the low molecular weight of the polymers used in the materials, thermally-labile protecting groups on the polymers, and a delayed crosslinking reaction.

摘要翻译： 提供了在单个薄层涂覆工艺中平坦化表面的同时在基板上填充过孔和/或沟槽的平面化和旋涂碳（SOC）组合物。 组合物可以通过具有约20nm至约220nm宽和高达约700nm深的通孔或沟槽来平坦化宽范围的衬底。 这些非凡的性质来自材料中使用的聚合物的低分子量，聚合物上的热不稳定保护基团和延迟的交联反应。

公开(公告)号：US10854451B2

公开(公告)日：2020-12-01

申请号：US15188620

申请日：2016-06-21

申请人： Brewer Science Inc.

发明人： Xing-Fu Zhong ,  Runhui Huang ,  Boyu Zhang

IPC分类号： H01L21/033 ,  H01L21/02 ,  C09D125/08 ,  C09D131/02 ,  C09D179/08

摘要： Planarizing and spin-on-carbon (SOC) compositions that fill vias and/or trenches on a substrate while planarizing the surface in a single thin layer coating process are provided. The compositions can planarize wide ranges of substrates with vias or trenches of from about 20 nm to about 220 nm wide, and up to about 700 nm deep. These extraordinary properties come from the low molecular weight of the polymers used in the materials, thermally-labile protecting groups on the polymers, and a delayed crosslinking reaction.