Method of using a flexible circuit
    1.
    发明授权
    Method of using a flexible circuit 有权
    使用柔性电路的方法

    公开(公告)号:US07658470B1

    公开(公告)日:2010-02-09

    申请号:US11118200

    申请日:2005-04-28

    IPC分类号: B41J2/14 B41J2/175 B41J2/05

    摘要: A method of using a flexible circuit, including attaching a first portion of the flexible circuit, via an attaching surface of the flexible circuit, to a first surface of a chip carrier. Statically bending a bending portion of the flexible circuit around an edge formed at the intersection of the first surface of the chip carrier, and a second surface of the chip carrier. Adhesively attaching a second portion of the flexible circuit, via the attaching surface, to the second surface of the chip carrier, where the second portion of the flexible circuit has at least one first anchor structure formed in the attaching surface, where the at least one first anchor structure is adapted to accept an adhesive.

    摘要翻译: 一种使用柔性电路的方法,包括通过柔性电路的附接表面将柔性电路的第一部分附接到芯片载体的第一表面。 围绕形成在芯片载体的第一表面的交点处的边缘和芯片载体的第二表面静态弯曲柔性电路的弯曲部分。 将柔性电路的第二部分经由附接表面粘附到芯片载体的第二表面,其中柔性电路的第二部分具有形成在附接表面中的至少一个第一锚定结构,其中至少一个 第一锚结构适于接受粘合剂。

    Bending a tab flex circuit via cantilevered leads
    2.
    发明授权
    Bending a tab flex circuit via cantilevered leads 有权
    通过悬臂导线弯曲接头柔性电路

    公开(公告)号:US06626518B2

    公开(公告)日:2003-09-30

    申请号:US10003876

    申请日:2001-10-25

    申请人: Si-Lam Choy

    发明人: Si-Lam Choy

    IPC分类号: B41J205

    摘要: A method of manufacturing an electronic device is provided comprising steps of providing a circuit having at least one cantilever lead, providing a die having at least one bonding region, bonding the at least one cantilever lead to the at least one bonding region, and bending the at least one bonded cantilever lead. Preferably, the electronic device comprises an inkjet cartridge.

    摘要翻译: 提供一种制造电子设备的方法,包括以下步骤:提供具有至少一个悬臂引线的电路,提供具有至少一个接合区域的管芯,将所述至少一个悬臂引线接合到所述至少一个接合区域, 至少一个粘结的悬臂引线。 优选地,电子设备包括喷墨盒。