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公开(公告)号:US20140207284A1
公开(公告)日:2014-07-24
申请号:US14159223
申请日:2014-01-20
IPC分类号: H01L21/68
CPC分类号: H01L21/681 , B65G25/02 , B65G37/00 , G05B19/02 , H01L21/67259 , H01L21/67742 , H01L21/67748 , H01L21/68 , Y10S901/09 , Y10S901/47
摘要: A device is provided having a robotic arm for handling a wafer, the robotic arm including one or more encoders that provide encoder data identifying a position of one or more components of the robotic arm. The device also having a processor adapted to apply an extended Kalman Filter to the encoder data to estimate a position of the wafer.
摘要翻译: 提供一种具有用于处理晶片的机器人手臂的装置,所述机器人臂包括一个或多个编码器,所述编码器提供识别所述机器人臂的一个或多个部件的位置的编码器数据。 该装置还具有适于将扩展卡尔曼滤波器应用于编码器数据以估计晶片的位置的处理器。
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公开(公告)号:US20140199138A1
公开(公告)日:2014-07-17
申请号:US14216829
申请日:2014-03-17
发明人: Peter van der Meulen , Christopher C. Kiley , Patrick D. Pannese , Raymond S. Ritter , Thomas A. Schaefer
IPC分类号: H01L21/677
CPC分类号: B65G25/02 , B65G37/00 , H01L21/67161 , H01L21/67196 , H01L21/67742 , H01L21/67745 , H01L21/67748 , H01L21/68792 , Y10S414/139
摘要: Modular wafer transport and handling facilities are combined in a variety of ways deliver greater levels of flexibility, utility, efficiency, and functionality in a vacuum semiconductor processing system. Various processing and other modules may be interconnected with tunnel-and-cart transportation systems to extend the distance and versatility of the vacuum environment. Other improvements such as bypass thermal adjusters, buffering aligners, batch processing, multifunction modules, low particle vents, cluster processing cells, and the like are incorporated to expand functionality and improve processing efficiency.
摘要翻译: 模块化晶片输送和处理设备以各种方式组合,在真空半导体处理系统中提供更高水平的灵活性,效用,效率和功能。 各种加工和其他模块可以与隧道和车辆运输系统相互连接,以延长真空环境的距离和通用性。 引入诸如旁路热调节器,缓冲对准器,批处理,多功能模块,低粒子通风口,集束处理单元等的其它改进以扩展功能并提高处理效率。
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公开(公告)号:US09884726B2
公开(公告)日:2018-02-06
申请号:US14216829
申请日:2014-03-17
发明人: Peter van der Meulen , Christopher C. Kiley , Patrick D. Pannese , Raymond S. Ritter , Thomas A. Schaefer
IPC分类号: H01L21/677 , B65G25/02 , B65G37/00 , H01L21/67 , H01L21/687
CPC分类号: B65G25/02 , B65G37/00 , H01L21/67161 , H01L21/67196 , H01L21/67742 , H01L21/67745 , H01L21/67748 , H01L21/68792 , Y10S414/139
摘要: Modular wafer transport and handling facilities are combined in a variety of ways deliver greater levels of flexibility, utility, efficiency, and functionality in a vacuum semiconductor processing system. Various processing and other modules may be interconnected with tunnel-and-cart transportation systems to extend the distance and versatility of the vacuum environment. Other improvements such as bypass thermal adjusters, buffering aligners, batch processing, multifunction modules, low particle vents, cluster processing cells, and the like are incorporated to expand functionality and improve processing efficiency.
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公开(公告)号:US08934706B2
公开(公告)日:2015-01-13
申请号:US14159223
申请日:2014-01-20
IPC分类号: G06K9/00 , G06K9/40 , H01L21/68 , G05B19/02 , B65G25/02 , B65G37/00 , H01L21/67 , H01L21/677
CPC分类号: H01L21/681 , B65G25/02 , B65G37/00 , G05B19/02 , H01L21/67259 , H01L21/67742 , H01L21/67748 , H01L21/68 , Y10S901/09 , Y10S901/47
摘要: A device is provided having a robotic arm for handling a wafer, the robotic arm including one or more encoders that provide encoder data identifying a position of one or more components of the robotic arm. The device also having a processor adapted to apply an extended Kalman Filter to the encoder data to estimate a position of the wafer.
摘要翻译: 提供一种具有用于处理晶片的机器人手臂的装置,所述机器人臂包括一个或多个编码器,所述编码器提供识别所述机器人臂的一个或多个部件的位置的编码器数据。 该装置还具有适于将扩展卡尔曼滤波器应用于编码器数据以估计晶片的位置的处理器。
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