公开(公告)号：US20140199138A1

公开(公告)日：2014-07-17

申请号：US14216829

申请日：2014-03-17

申请人： Brooks Automation, Inc.

发明人： Peter van der Meulen ,  Christopher C. Kiley ,  Patrick D. Pannese ,  Raymond S. Ritter ,  Thomas A. Schaefer

IPC分类号： H01L21/677

CPC分类号： B65G25/02 ,  B65G37/00 ,  H01L21/67161 ,  H01L21/67196 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/68792 ,  Y10S414/139

摘要： Modular wafer transport and handling facilities are combined in a variety of ways deliver greater levels of flexibility, utility, efficiency, and functionality in a vacuum semiconductor processing system. Various processing and other modules may be interconnected with tunnel-and-cart transportation systems to extend the distance and versatility of the vacuum environment. Other improvements such as bypass thermal adjusters, buffering aligners, batch processing, multifunction modules, low particle vents, cluster processing cells, and the like are incorporated to expand functionality and improve processing efficiency.

摘要翻译： 模块化晶片输送和处理设备以各种方式组合，在真空半导体处理系统中提供更高水平的灵活性，效用，效率和功能。 各种加工和其他模块可以与隧道和车辆运输系统相互连接，以延长真空环境的距离和通用性。 引入诸如旁路热调节器，缓冲对准器，批处理，多功能模块，低粒子通风口，集束处理单元等的其它改进以扩展功能并提高处理效率。

公开(公告)号：US09884726B2

公开(公告)日：2018-02-06

申请号：US14216829

申请日：2014-03-17

申请人： Brooks Automation, Inc.

发明人： Peter van der Meulen ,  Christopher C. Kiley ,  Patrick D. Pannese ,  Raymond S. Ritter ,  Thomas A. Schaefer

IPC分类号： H01L21/677 ,  B65G25/02 ,  B65G37/00 ,  H01L21/67 ,  H01L21/687

CPC分类号： B65G25/02 ,  B65G37/00 ,  H01L21/67161 ,  H01L21/67196 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/68792 ,  Y10S414/139

摘要： Modular wafer transport and handling facilities are combined in a variety of ways deliver greater levels of flexibility, utility, efficiency, and functionality in a vacuum semiconductor processing system. Various processing and other modules may be interconnected with tunnel-and-cart transportation systems to extend the distance and versatility of the vacuum environment. Other improvements such as bypass thermal adjusters, buffering aligners, batch processing, multifunction modules, low particle vents, cluster processing cells, and the like are incorporated to expand functionality and improve processing efficiency.