公开(公告)号：US20100102439A1

公开(公告)日：2010-04-29

申请号：US12605169

申请日：2009-10-23

申请人： Bruno Dehos ,  Bruno Lagoguez

发明人： Bruno Dehos ,  Bruno Lagoguez

IPC分类号： H01L23/52

CPC分类号： H01L23/552 ,  H01L23/5389 ,  H01L25/16 ,  H01L2924/1532 ,  H05K1/0218 ,  H05K1/0298 ,  H05K1/141 ,  H05K1/185 ,  H05K3/3436 ,  H05K2201/0723 ,  H05K2201/10674

摘要： A multi-layer substrate has a front face with external pads. An integrated-circuit chip is positioned inside of the multi-layer substrate. An electronic and/or electric component is also positioned inside of the substrate above the integrated-circuit chip. An electrical connection network is formed in the multi-layer substrate to selectively connect the integrated-circuit chip and component together and to the external pads. A first screen is positioned within the multi-layer substrate between the integrated-circuit chip and the electrical connection network, this first screen being connected by vias to the external pads. A second screen is position on a top (external) surface of the multi-layer substrate above the component and electrical connection network, this second screen being connected by vias to the external pads. The integrated-circuit chip is position to be inside the first and second screens.

摘要翻译： 多层基板具有带有外部焊盘的正面。 集成电路芯片位于多层基板的内部。 电子和/或电气部件也位于集成电路芯片上方的衬底的内部。 电连接网络形成在多层基板中，以将集成电路芯片和部件选择性地连接在一起并连接到外部焊盘。 第一屏幕位于集成电路芯片和电连接网络之间的多层基板内，该第一屏幕通过通孔连接到外部焊盘。 第二屏幕位于组件和电连接网络上方的多层基板的顶部（外部）表面上，该第二屏幕通过通孔连接到外部焊盘。 集成电路芯片位于第一和第二屏幕的内部。

公开(公告)号：US08592969B2

公开(公告)日：2013-11-26

申请号：US12605169

申请日：2009-10-23

申请人： Bruno Dehos ,  Bruno Lagoguez

发明人： Bruno Dehos ,  Bruno Lagoguez

IPC分类号： H01L23/52

CPC分类号： H01L23/552 ,  H01L23/5389 ,  H01L25/16 ,  H01L2924/1532 ,  H05K1/0218 ,  H05K1/0298 ,  H05K1/141 ,  H05K1/185 ,  H05K3/3436 ,  H05K2201/0723 ,  H05K2201/10674

摘要： A multi-layer substrate has a front face with external pads. An integrated-circuit chip is positioned inside of the multi-layer substrate. An electronic and/or electric component is also positioned inside of the substrate above the integrated-circuit chip. An electrical connection network is formed in the multi-layer substrate to selectively connect the integrated-circuit chip and component together and to the external pads. A first screen is positioned within the multi-layer substrate between the integrated-circuit chip and the electrical connection network, this first screen being connected by vias to the external pads. A second screen is position on a top (external) surface of the multi-layer substrate above the component and electrical connection network, this second screen being connected by vias to the external pads. The integrated-circuit chip is position to be inside the first and second screens.

摘要翻译： 多层基板具有带有外部焊盘的正面。 集成电路芯片位于多层基板的内部。 电子和/或电气部件也位于集成电路芯片上方的衬底的内部。 电连接网络形成在多层基板中，以将集成电路芯片和部件选择性地连接在一起并连接到外部焊盘。 第一屏幕位于集成电路芯片和电连接网络之间的多层基板内，该第一屏幕通过通孔连接到外部焊盘。 第二屏幕位于组件和电连接网络上方的多层基板的顶部（外部）表面上，该第二屏幕通过通孔连接到外部焊盘。 集成电路芯片位于第一和第二屏幕的内部。

公开(公告)号：US07477494B2

公开(公告)日：2009-01-13

申请号：US10440495

申请日：2003-05-15

申请人： François Icher ,  Bruno Dehos

发明人： François Icher ,  Bruno Dehos

IPC分类号： H02H9/00

CPC分类号： H02H9/044 ,  H02H7/16

摘要： An electrical device includes two supports for electronic components. A first support bears at least one input terminal, an electric circuit connected to the input terminal and a voltage limiter. A second support bears at least one external connection terminal. The external connection terminal is connected to the input terminal by a capacitor, and the link between the capacitor and the external connection terminal includes a node connected to the voltage limiter device so as to limit a voltage between said node and a reference point of the electric circuit.

摘要翻译： 电气设备包括用于电子部件的两个支撑件。 第一支撑件具有至少一个输入端子，连接到输入端子的电路和限压器。 至少有一个外部连接端子。 外部连接端子通过电容器连接到输入端子，并且电容器和外部连接端子之间的连接包括连接到限压器装置的节点，以便限制所述节点和电气的参考点之间的电压 电路。

公开(公告)号：US07221549B2

公开(公告)日：2007-05-22

申请号：US10724012

申请日：2003-11-26

申请人： François Icher ,  Bruno Dehos

发明人： François Icher ,  Bruno Dehos

IPC分类号： H02H9/00

CPC分类号： H01L23/60 ,  H01L27/0255 ,  H01L2924/0002 ,  H01L2924/00

摘要： A device for protecting an electronic circuit against electrostatic discharges comprises a connection terminal linked to one terminal of the electronic circuit, two tracks respectively linked to two terminals of an electrical power source supplying the electronic circuit, and two diodes each one linked to one of the two tracks and to the connection terminal. The two diodes are placed on a surface of a substrate. The connection terminal is carried by the substrate and is located above part of at least one of the two diodes with respect to the substrate.

摘要翻译： 用于保护电子电路免受静电放电的装置包括连接到电子电路的一个端子的连接端子，分别连接到提供电子电路的电源的两个端子的两个磁道，以及连接到电子电路中的一个的两个二极管 两个轨道和连接终端。 两个二极管放置在基板的表面上。 连接端子由衬底承载，并且相对于衬底位于两个二极管中的至少一个的一部分上方。