Reconfigurable Ultrasound Array with Low Noise CW Processing
    1.
    发明申请
    Reconfigurable Ultrasound Array with Low Noise CW Processing 审中-公开
    具有低噪声CW处理的可重构超声阵列

    公开(公告)号:US20110028845A1

    公开(公告)日:2011-02-03

    申请号:US12534099

    申请日:2009-07-31

    IPC分类号: A61B8/14

    摘要: An ultrasound transducer probe is disclosed comprising: an array of ultrasound transducer elements, each ultrasound transducer element associated with a corresponding unit transducer cell for providing transmit and receive functions, each unit transducer cell including a cell transmit/receive switch connected to a low voltage switch matrix via a low voltage transmit path; and a plurality of microelectronic cross-point switches for switching an externally generated analog transmit signal to one or more of the low voltage transmit paths.

    摘要翻译: 公开了一种超声换能器探头,其包括:超声波换能器元件阵列,每个超声换能器元件与相应的单元换能器单元相关联,用于提供发射和接收功能,每个单位换能器单元包括连接到低压开关的单元发射/接收开关 矩阵通过低电压发射路径; 以及用于将外部产生的模拟发射信号切换到一个或多个低电压发射路径的多个微电子交叉点开关。

    Ultrasound imaging system
    2.
    发明授权
    Ultrasound imaging system 有权
    超声成像系统

    公开(公告)号:US07952260B2

    公开(公告)日:2011-05-31

    申请号:US12725536

    申请日:2010-03-17

    IPC分类号: H01L41/09 G01N24/00 A61B8/14

    摘要: An ultrasound imaging system (100). An exemplary system (100) includes a plurality of transducer elements (136) formed in subarrays (140) and a plurality of subarray circuit units (160′), with each circuit unit (160′) connected to a subarray (140) of the transducer elements (136). The circuitry in each unit (160′) comprises a plurality of integrated circuits (330, 340, 350), with at least a first (340) of the integrated circuits formed over a second (330) of the integrated circuits in a stacked configuration. In an example illustration the first integrated circuit (340) includes a first plurality of first bond pads (345) along a surface (342) thereof and the second integrated circuit (330) includes a second plurality of second bond pads (335) along a surface (331) thereof, with bond wires (344) extending between pairs of first and second bond pads to provide input/output signal connections therebetween.

    摘要翻译: 超声成像系统(100)。 示例性系统(100)包括形成在子阵列(140)中的多个换能器元件(136)和多个子阵列电路单元(160'),每个电路单元(160')连接到子阵列 换能器元件(136)。 每个单元(160')中的电路包括多个集成电路(330,340,350),其中至少第一(340)个集成电路以堆叠配置形成在第二(330)集成电路上 。 在示例图中,第一集成电路(340)包括沿着其表面(342)的第一多个第一接合焊盘(345),并且第二集成电路(330)包括沿着第一多个第二接合焊盘 其具有在成对的第一和第二接合焊盘之间延伸的接合线(344),以在它们之间提供输入/输出信号连接。

    Ultrasound imaging system
    3.
    发明授权
    Ultrasound imaging system 有权
    超声成像系统

    公开(公告)号:US07687976B2

    公开(公告)日:2010-03-30

    申请号:US11669235

    申请日:2007-01-31

    IPC分类号: H01L41/09 G01N24/00 A61B8/14

    摘要: An ultrasound imaging system (100). An exemplary system (100) includes a plurality of transducer elements (136) formed in subarrays (140) and a plurality of subarray circuit units (160′), with each circuit unit (160′) connected to a subarray (140) of the transducer elements (136). The circuitry in each unit (160′) comprises a plurality of integrated circuits (330, 340, 350), with at least a first (340) of the integrated circuits formed over a second (330) of the integrated circuits in a stacked configuration. In an example illustration the first integrated circuit (340) includes a first plurality of first bond pads (345) along a surface (342) thereof and the second integrated circuit (330) includes a second plurality of second bond pads (335) along a surface (331) thereof, with bond wires (344) extending between pairs of first and second bond pads to provide input/output signal connections therebetween.

    摘要翻译: 超声成像系统(100)。 示例性系统(100)包括形成在子阵列(140)中的多个换能器元件(136)和多个子阵列电路单元(160'),每个电路单元(160')连接到子阵列 换能器元件(136)。 每个单元(160')中的电路包括多个集成电路(330,340,350),其中至少第一(340)个集成电路以堆叠配置形成在第二(330)集成电路上 。 在示例图中,第一集成电路(340)包括沿着其表面(342)的第一多个第一接合焊盘(345),并且第二集成电路(330)包括沿着第一多个第二接合焊盘 其具有在成对的第一和第二接合焊盘之间延伸的接合线(344),以在它们之间提供输入/输出信号连接。

    ULTRASOUND PROBE AND ULTRASOUND IMAGING SYSTEM
    4.
    发明申请
    ULTRASOUND PROBE AND ULTRASOUND IMAGING SYSTEM 有权
    超声探头和超声成像系统

    公开(公告)号:US20110295119A1

    公开(公告)日:2011-12-01

    申请号:US12786950

    申请日:2010-05-25

    IPC分类号: A61B8/14 A61B8/00

    摘要: An ultrasound probe and an ultrasound imaging system include a plurality of transducer elements arranged in an array. The plurality of transducer elements are organized to form a transmit aperture and a receive aperture. The ultrasound probe and ultrasound imaging system include a plurality of summing nodes. The ultrasound probe and ultrasound imaging system include a set of receive switches associated with each of the transducer elements in the receive aperture. Each set of receive switches is configured to selectively connect the associated transducer element to any one of the plurality of summing nodes.

    摘要翻译: 超声波探头和超声成像系统包括以阵列布置的多个换能器元件。 多个换能器元件被组织以形成发射孔和接收孔。 超声探头和超声成像系统包括多个求和节点。 超声探头和超声成像系统包括与接收孔中的每个换能器元件相关联的一组接收开关。 每组接收开关被配置为选择性地将相关联的换能器元件连接到多个求和节点中的任何一个。

    Ultrasound Imaging System
    5.
    发明申请
    Ultrasound Imaging System 有权
    超声成像系统

    公开(公告)号:US20080183078A1

    公开(公告)日:2008-07-31

    申请号:US11669235

    申请日:2007-01-31

    IPC分类号: A61B8/00

    摘要: An ultrasound imaging system (100). An exemplary system (100) includes a plurality of transducer elements (136) formed in subarrays (140) and a plurality of subarray circuit units (160′), with each circuit unit (160′) connected to a subarray (140) of the transducer elements (136). The circuitry in each unit (160′) comprises a plurality of integrated circuits (330, 340, 350), with at least a first (340) of the integrated circuits formed over a second (330) of the integrated circuits in a stacked configuration. In an example illustration the first integrated circuit (340) includes a first plurality of first bond pads (345) along a surface (342) thereof and the second integrated circuit (330) includes a second plurality of second bond pads (335) along a surface (331) thereof, with bond wires (344) extending between pairs of first and second bond pads to provide input/output signal connections therebetween.

    摘要翻译: 超声成像系统(100)。 示例性系统(100)包括形成在子阵列(140)中的多个换能器元件(136)和多个子阵列电路单元(160'),每个电路单元(160')连接到子阵列 换能器元件(136)。 每个单元(160')中的电路包括多个集成电路(330,340,350),其中至少第一(340)个集成电路以堆叠配置形成在第二(330)集成电路上 。 在示例图中,第一集成电路(340)包括沿着其表面(342)的第一多个第一接合焊盘(345),并且第二集成电路(330)包括沿着第一多个第二接合焊盘 其具有在成对的第一和第二接合焊盘之间延伸的接合线(344),以在它们之间提供输入/输出信号连接。

    METHOD AND SYSTEM FOR CORRECTING ULTRASOUND DATA
    9.
    发明申请
    METHOD AND SYSTEM FOR CORRECTING ULTRASOUND DATA 有权
    用于校正超声数据的方法和系统

    公开(公告)号:US20120130246A1

    公开(公告)日:2012-05-24

    申请号:US12950238

    申请日:2010-11-19

    IPC分类号: A61B8/14

    摘要: A method for correcting ultrasound data includes acquiring ultrasound data using an ultrasound probe having a plurality of transducer elements associated with a plurality of channels that include conductive pathways and communicating the ultrasound data as received ultrasound signals along the conductive pathways of the channels. The method further includes determining a crosstalk signal that is generated in one or more of the channels by at least one of communication of the received ultrasound signals along the channels or vibration of one or more of the transducer elements. In one aspect, the method also includes modifying one or more subsequently acquired ultrasound signals that are communicated along the channels based on the crosstalk signal.

    摘要翻译: 用于校正超声数据的方法包括使用具有与包括导电路径的多个通道相关联的多个换能器元件的超声探头获取超声数据,并且将超声波数据作为沿着通道的导电路径的接收超声信号进行通信。 该方法还包括通过沿着通道的一个或多个换能器元件的通道的通信或振动的通信中的至少一个来确定在一个或多个通道中产生的串扰信号。 在一个方面,该方法还包括基于串扰信号修改沿着信道传送的一个或多个随后获取的超声信号。

    TRANSMIT BEAMFORMING IN 3-DIMENSIONAL ULTRASOUND
    10.
    发明申请
    TRANSMIT BEAMFORMING IN 3-DIMENSIONAL ULTRASOUND 有权
    在三维超声波中发射光束

    公开(公告)号:US20090005684A1

    公开(公告)日:2009-01-01

    申请号:US11770126

    申请日:2007-06-28

    IPC分类号: A61B8/00

    摘要: An ultrasound system comprises a probe including a two-dimensional (2D) array of transducer elements that form an aperture having a plurality of receive elements that are configured to receive ultrasound signals. The transducer elements form at least one transmit sub-aperture that is configured to be interconnected with a fixed group of the transducer elements within the aperture. Transmitters generate electrical transmit signals, and at least one transmit sub-aperture processor (tx SAP) maps the transducer elements within the fixed group of the transducer elements to the transmitters in a transmit configuration based on a beam steering direction.

    摘要翻译: 超声系统包括探针,其包括形成具有被配置为接收超声信号的多个接收元件的孔的换能器元件的二维(2D)阵列。 换能器元件形成至少一个发射子孔径,其构造成与孔内的固定的换能器元件组互连。 发射机产生电传输信号,并且至少一个发射子孔径处理器(tx SAP)基于波束转向方向将传感器元件的固定组内的换能器元件映射到发射器。