Ultrasound imaging system
    1.
    发明授权
    Ultrasound imaging system 有权
    超声成像系统

    公开(公告)号:US07687976B2

    公开(公告)日:2010-03-30

    申请号:US11669235

    申请日:2007-01-31

    IPC分类号: H01L41/09 G01N24/00 A61B8/14

    摘要: An ultrasound imaging system (100). An exemplary system (100) includes a plurality of transducer elements (136) formed in subarrays (140) and a plurality of subarray circuit units (160′), with each circuit unit (160′) connected to a subarray (140) of the transducer elements (136). The circuitry in each unit (160′) comprises a plurality of integrated circuits (330, 340, 350), with at least a first (340) of the integrated circuits formed over a second (330) of the integrated circuits in a stacked configuration. In an example illustration the first integrated circuit (340) includes a first plurality of first bond pads (345) along a surface (342) thereof and the second integrated circuit (330) includes a second plurality of second bond pads (335) along a surface (331) thereof, with bond wires (344) extending between pairs of first and second bond pads to provide input/output signal connections therebetween.

    摘要翻译: 超声成像系统(100)。 示例性系统(100)包括形成在子阵列(140)中的多个换能器元件(136)和多个子阵列电路单元(160'),每个电路单元(160')连接到子阵列 换能器元件(136)。 每个单元(160')中的电路包括多个集成电路(330,340,350),其中至少第一(340)个集成电路以堆叠配置形成在第二(330)集成电路上 。 在示例图中,第一集成电路(340)包括沿着其表面(342)的第一多个第一接合焊盘(345),并且第二集成电路(330)包括沿着第一多个第二接合焊盘 其具有在成对的第一和第二接合焊盘之间延伸的接合线(344),以在它们之间提供输入/输出信号连接。

    Ultrasound Imaging System
    2.
    发明申请
    Ultrasound Imaging System 有权
    超声成像系统

    公开(公告)号:US20080183078A1

    公开(公告)日:2008-07-31

    申请号:US11669235

    申请日:2007-01-31

    IPC分类号: A61B8/00

    摘要: An ultrasound imaging system (100). An exemplary system (100) includes a plurality of transducer elements (136) formed in subarrays (140) and a plurality of subarray circuit units (160′), with each circuit unit (160′) connected to a subarray (140) of the transducer elements (136). The circuitry in each unit (160′) comprises a plurality of integrated circuits (330, 340, 350), with at least a first (340) of the integrated circuits formed over a second (330) of the integrated circuits in a stacked configuration. In an example illustration the first integrated circuit (340) includes a first plurality of first bond pads (345) along a surface (342) thereof and the second integrated circuit (330) includes a second plurality of second bond pads (335) along a surface (331) thereof, with bond wires (344) extending between pairs of first and second bond pads to provide input/output signal connections therebetween.

    摘要翻译: 超声成像系统(100)。 示例性系统(100)包括形成在子阵列(140)中的多个换能器元件(136)和多个子阵列电路单元(160'),每个电路单元(160')连接到子阵列 换能器元件(136)。 每个单元(160')中的电路包括多个集成电路(330,340,350),其中至少第一(340)个集成电路以堆叠配置形成在第二(330)集成电路上 。 在示例图中,第一集成电路(340)包括沿着其表面(342)的第一多个第一接合焊盘(345),并且第二集成电路(330)包括沿着第一多个第二接合焊盘 其具有在成对的第一和第二接合焊盘之间延伸的接合线(344),以在它们之间提供输入/输出信号连接。

    ULTRASOUND IMAGING SYSTEM
    3.
    发明申请
    ULTRASOUND IMAGING SYSTEM 有权
    超声成像系统

    公开(公告)号:US20100174195A1

    公开(公告)日:2010-07-08

    申请号:US12725536

    申请日:2010-03-17

    IPC分类号: A61B8/14

    摘要: An ultrasound imaging system (100). An exemplary system (100) includes a plurality of transducer elements (136) formed in subarrays (140) and a plurality of subarray circuit units (160′), with each circuit unit (160′) connected to a subarray (140) of the transducer elements (136). The circuitry in each unit (160′) comprises a plurality of integrated circuits (330, 340, 350), with at least a first (340) of the integrated circuits formed over a second (330) of the integrated circuits in a stacked configuration. In an example illustration the first integrated circuit (340) includes a first plurality of first bond pads (345) along a surface (342) thereof and the second integrated circuit (330) includes a second plurality of second bond pads (335) along a surface (331) thereof, with bond wires (344) extending between pairs of first and second bond pads to provide input/output signal connections therebetween.

    摘要翻译: 超声成像系统(100)。 示例性系统(100)包括形成在子阵列(140)中的多个换能器元件(136)和多个子阵列电路单元(160'),每个电路单元(160')连接到子阵列 换能器元件(136)。 每个单元(160')中的电路包括多个集成电路(330,340,350),其中至少第一(340)个集成电路以堆叠配置形成在第二(330)集成电路上 。 在示例图中,第一集成电路(340)包括沿着其表面(342)的第一多个第一接合焊盘(345),并且第二集成电路(330)包括沿着第一多个第二接合焊盘 其具有在成对的第一和第二接合焊盘之间延伸的接合线(344),以在它们之间提供输入/输出信号连接。

    Ultrasound imaging system
    4.
    发明授权
    Ultrasound imaging system 有权
    超声成像系统

    公开(公告)号:US07952260B2

    公开(公告)日:2011-05-31

    申请号:US12725536

    申请日:2010-03-17

    IPC分类号: H01L41/09 G01N24/00 A61B8/14

    摘要: An ultrasound imaging system (100). An exemplary system (100) includes a plurality of transducer elements (136) formed in subarrays (140) and a plurality of subarray circuit units (160′), with each circuit unit (160′) connected to a subarray (140) of the transducer elements (136). The circuitry in each unit (160′) comprises a plurality of integrated circuits (330, 340, 350), with at least a first (340) of the integrated circuits formed over a second (330) of the integrated circuits in a stacked configuration. In an example illustration the first integrated circuit (340) includes a first plurality of first bond pads (345) along a surface (342) thereof and the second integrated circuit (330) includes a second plurality of second bond pads (335) along a surface (331) thereof, with bond wires (344) extending between pairs of first and second bond pads to provide input/output signal connections therebetween.

    摘要翻译: 超声成像系统(100)。 示例性系统(100)包括形成在子阵列(140)中的多个换能器元件(136)和多个子阵列电路单元(160'),每个电路单元(160')连接到子阵列 换能器元件(136)。 每个单元(160')中的电路包括多个集成电路(330,340,350),其中至少第一(340)个集成电路以堆叠配置形成在第二(330)集成电路上 。 在示例图中,第一集成电路(340)包括沿着其表面(342)的第一多个第一接合焊盘(345),并且第二集成电路(330)包括沿着第一多个第二接合焊盘 其具有在成对的第一和第二接合焊盘之间延伸的接合线(344),以在它们之间提供输入/输出信号连接。

    ULTRASOUND PROBE AND ULTRASOUND IMAGING SYSTEM
    6.
    发明申请
    ULTRASOUND PROBE AND ULTRASOUND IMAGING SYSTEM 有权
    超声探头和超声成像系统

    公开(公告)号:US20110295119A1

    公开(公告)日:2011-12-01

    申请号:US12786950

    申请日:2010-05-25

    IPC分类号: A61B8/14 A61B8/00

    摘要: An ultrasound probe and an ultrasound imaging system include a plurality of transducer elements arranged in an array. The plurality of transducer elements are organized to form a transmit aperture and a receive aperture. The ultrasound probe and ultrasound imaging system include a plurality of summing nodes. The ultrasound probe and ultrasound imaging system include a set of receive switches associated with each of the transducer elements in the receive aperture. Each set of receive switches is configured to selectively connect the associated transducer element to any one of the plurality of summing nodes.

    摘要翻译: 超声波探头和超声成像系统包括以阵列布置的多个换能器元件。 多个换能器元件被组织以形成发射孔和接收孔。 超声探头和超声成像系统包括多个求和节点。 超声探头和超声成像系统包括与接收孔中的每个换能器元件相关联的一组接收开关。 每组接收开关被配置为选择性地将相关联的换能器元件连接到多个求和节点中的任何一个。

    Reconfigurable Ultrasound Array with Low Noise CW Processing
    7.
    发明申请
    Reconfigurable Ultrasound Array with Low Noise CW Processing 审中-公开
    具有低噪声CW处理的可重构超声阵列

    公开(公告)号:US20110028845A1

    公开(公告)日:2011-02-03

    申请号:US12534099

    申请日:2009-07-31

    IPC分类号: A61B8/14

    摘要: An ultrasound transducer probe is disclosed comprising: an array of ultrasound transducer elements, each ultrasound transducer element associated with a corresponding unit transducer cell for providing transmit and receive functions, each unit transducer cell including a cell transmit/receive switch connected to a low voltage switch matrix via a low voltage transmit path; and a plurality of microelectronic cross-point switches for switching an externally generated analog transmit signal to one or more of the low voltage transmit paths.

    摘要翻译: 公开了一种超声换能器探头,其包括:超声波换能器元件阵列,每个超声换能器元件与相应的单元换能器单元相关联,用于提供发射和接收功能,每个单位换能器单元包括连接到低压开关的单元发射/接收开关 矩阵通过低电压发射路径; 以及用于将外部产生的模拟发射信号切换到一个或多个低电压发射路径的多个微电子交叉点开关。