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公开(公告)号：US07144755B2
公开(公告)日：2006-12-05
申请号：US10921156
申请日：2004-08-19
IPC分类号： H01L21/44
CPC分类号： H01L21/565 , H01L24/97 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48471 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/4554
摘要： At the time of performing resin molding for a matrix frame in the fabrication of semiconductor integrated circuit devices, a predetermined amount of air is fed into each of first cavities in a first row and second cavities in a second row, the first and second cavities being formed in a matrix arrangement in a lower mold of a molding die, so as to pressurize the interiors of the cavities, and a sealing resin is charged into the cavities, while the pressure therein is regulated in such a manner that the charging speeds of the sealing resin become equal in all of the cavities, whereby it is possible to stabilize the quality of the product being obtained.
摘要翻译： 在制造半导体集成电路器件时对矩阵框架进行树脂模制时，将预定量的空气馈送到第一排中的第一空腔和第二排中的第二空腔中的每一个中，第一和第二空腔为 在成型模具的下模具中以矩阵形式形成，以便对空腔的内部进行加压，并且将密封树脂装入空腔中，同时其中的压力以这样的方式被调节： 密封树脂在所有空腔中变得相等，由此可以稳定所获得的产品的质量。
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公开(公告)号：US06797542B2
公开(公告)日：2004-09-28
申请号：US10364503
申请日：2003-02-12
IPC分类号： H01L2144
CPC分类号： H01L21/565 , H01L24/97 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48471 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/4554
摘要： At the time of performing resin molding for a matrix frame in the fabrication of semiconductor integrated circuit devices, a predetermined amount of air is fed into each of first cavities in a first row and second cavities in a second row, the first and second cavities being formed in a matrix arrangement in a lower mold of a molding die, so as to pressurize the interiors of the cavities, and a sealing resin is charged into the cavities, while the pressure therein is regulated in such a manner that the charging speeds of the sealing resin become equal in all of the cavities, whereby it is possible to stabilize the quality of the product being obtained.
摘要翻译： 在制造半导体集成电路器件时对矩阵框架进行树脂模制时，将预定量的空气馈送到第一排中的第一空腔和第二排中的第二空腔中的每一个中，第一和第二空腔为 在成型模具的下模具中以矩阵形式形成，以便对空腔的内部进行加压，并且将密封树脂装入空腔中，同时其中的压力以这样的方式被调节： 密封树脂在所有空腔中变得相等，由此可以稳定所获得的产品的质量。
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公开(公告)号：US20050019979A1
公开(公告)日：2005-01-27
申请号：US10921156
申请日：2004-08-19
CPC分类号： H01L21/565 , H01L24/97 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48471 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/4554
摘要： At the time of performing resin molding for a matrix frame in the fabrication of semiconductor integrated circuit devices, a predetermined amount of air is fed into each of first cavities in a first row and second cavities in a second row, the first and second cavities being formed in a matrix arrangement in a lower mold of a molding die, so as to pressurize the interiors of the cavities, and a sealing resin is charged into the cavities, while the pressure therein is regulated in such a manner that the charging speeds of the sealing resin become equal in all of the cavities, whereby it is possible to stabilize the quality of the product being obtained.
摘要翻译： 在制造半导体集成电路器件时对矩阵框架进行树脂模制时，将预定量的空气馈送到第一排中的第一空腔和第二排中的第二空腔中的每一个中，第一和第二空腔为 在成型模具的下模具中以矩阵形式形成，以便对空腔的内部进行加压，并且将密封树脂装入空腔中，同时其中的压力以这样的方式被调节： 密封树脂在所有空腔中变得相等，由此可以稳定所获得的产品的质量。
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公开(公告)号：US07465609B2
公开(公告)日：2008-12-16
申请号：US11213771
申请日：2005-08-30
申请人： Fumio Murakami , Kenichi Imura , Makoto Araki
发明人： Fumio Murakami , Kenichi Imura , Makoto Araki
CPC分类号： H01L24/97 , H01L21/565 , H01L23/3128 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2223/54486 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/49171 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/0102 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/15311 , H01L2924/181 , H01L2924/3511 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： In the method of manufacturing a semiconductor device that semiconductor chips are mounted facing-up on the printed wiring board on which a protective insulation film is formed by means of a film-like resist and a plurality of the semiconductor chips are collectively molded by a transfer mold technology, when transfer molding is performed, among the adsorption face of the printed wiring board and the lower die to make adsorb the printed wiring board, the through holes reaching the exterior space of the lower die from the vicinity of the end portion opposing the gate to pour mold resin of a mold cavity are formed as many as possible in order to prevent a short circuit and an open circuit by big deformation of a bonding wire connecting an electrode of the semiconductor chip and an conductor pattern of the printed wiring board.
摘要翻译： 在制造半导体器件的方法中，半导体芯片通过薄膜状抗蚀剂面向上安装在其上形成保护绝缘膜的印刷线路板上，并且多个半导体芯片通过转印共同模制 模具技术，当进行传递成型时，在印刷线路板的吸附面和下模之间，使得吸附印刷电路板，通孔从相对的端部附近到达下模的外部空间 为了防止连接半导体芯片的电极和印刷电路板的导体图案的接合线的大变形，防止短路和开路，模具腔的浇注模塑树脂形成为尽可能多的浇口。
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公开(公告)号：US07803660B2
公开(公告)日：2010-09-28
申请号：US12330739
申请日：2008-12-09
申请人： Fumio Murakami , Kenichi Imura , Makoto Araki
发明人： Fumio Murakami , Kenichi Imura , Makoto Araki
IPC分类号： H01L21/00
CPC分类号： H01L24/97 , H01L21/565 , H01L23/3128 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2223/54486 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/49171 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/0102 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/15311 , H01L2924/181 , H01L2924/3511 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： In the method of manufacturing a semiconductor device that semiconductor chips are mounted facing-up on the printed wiring board on which a protective insulation film is formed by means of a film-like resist and a plurality of the semiconductor chips are collectively molded by a transfer mold technology, when transfer molding is performed, among the adsorption face of the printed wiring board and the lower die to make adsorb the printed wiring board, the through holes reaching the exterior space of the lower die from the vicinity of the end portion opposing the gate to pour mold resin of a mold cavity are formed as many as possible in order to prevent a short circuit and an open circuit by big deformation of a bonding wire connecting an electrode of the semiconductor chip and an conductor pattern of the printed wiring board.
摘要翻译： 在制造半导体器件的方法中，半导体芯片通过薄膜状抗蚀剂面向上安装在其上形成保护绝缘膜的印刷线路板上，并且多个半导体芯片通过转印共同模制 模具技术，当进行传递成型时，在印刷线路板的吸附面和下模之间，使得吸附印刷电路板，通孔从相对的端部附近到达下模的外部空间 为了防止连接半导体芯片的电极和印刷电路板的导体图案的接合线的大变形，防止短路和开路，模具腔的浇注模塑树脂形成为尽可能多的浇口。
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公开(公告)号：US20060046340A1
公开(公告)日：2006-03-02
申请号：US11213771
申请日：2005-08-30
申请人： Fumio Murakami , Kenichi Imura , Makoto Araki
发明人： Fumio Murakami , Kenichi Imura , Makoto Araki
IPC分类号： H01L21/00
CPC分类号： H01L24/97 , H01L21/565 , H01L23/3128 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2223/54486 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/49171 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/0102 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/15311 , H01L2924/181 , H01L2924/3511 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： In the method of manufacturing a semiconductor device that semiconductor chips are mounted facing-up on the printed wiring board on which a protective insulation film is formed by means of a film-like resist and a plurality of the semiconductor chips are collectively molded by a transfer mold technology, when transfer molding is performed, among the adsorption face of the printed wiring board and the lower die to make adsorb the printed wiring board, the through holes reaching the exterior space of the lower die from the vicinity of the end portion opposing the gate to pour mold resin of a mold cavity are formed as many as possible in order to prevent a short circuit and an open circuit by big deformation of a bonding wire connecting an electrode of the semiconductor chip and an conductor pattern of the printed wiring board.
摘要翻译： 在制造半导体器件的方法中，半导体芯片通过薄膜状抗蚀剂面向上安装在其上形成保护绝缘膜的印刷线路板上，并且多个半导体芯片通过转印共同模制 模具技术，当进行传递成型时，在印刷线路板的吸附面和下模之间，使得吸附印刷电路板，通孔从相对的端部附近到达下模的外部空间 为了防止连接半导体芯片的电极和印刷电路板的导体图案的接合线的大变形，防止短路和开路，模具腔的浇注模塑树脂形成为尽可能多的浇口。
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公开(公告)号：US5016677A
公开(公告)日：1991-05-21
申请号：US443609
申请日：1989-11-29
IPC分类号： D03D45/20
CPC分类号： D03D45/20
摘要： An automatic cop changing device for a weaving machine in which a shuttle carrying a cop consisting of a bobbin around which a weft is wound is reciprocated between warps so as to weave the weft between the warps, comprising: a cop positioning unit for securing the shuttle stationary near a terminal point of its reciprocating movement when the weft of a current cop mounted on the shuttle is consumed by more than a precribed amount; a cop storage unit for storing a plurlaity of new cops; a robot arm carrying a weft gripping hand for drawing the weft from the current cop and a weft from one of the new cops stored in the cop storage unit, and crossing the two wefts, a cop engaging hand for moving the cop in the shuttle between its upright position and its retracted position, and a cop gripping hand for removing the old cop from the shuttle and carrying the new cop into the shuttle; a weft tying unit for tying the crossed part of the wefts; and a weft trimming unit for trimming an extraneous part of the tied weft. This device permits quick replacement of cops without causing undue strain on the weft. The advantageous use of a robot arm permits a compact and simple design of the entire device.
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公开(公告)号：US20060125064A1
公开(公告)日：2006-06-15
申请号：US11344094
申请日：2006-02-01
申请人： Fujio Ito , Hiromichi Suzuki , Hiroyuki Takeno , Hiroshi Shimoji , Fumio Murakami , Keiko Kurakawa
发明人： Fujio Ito , Hiromichi Suzuki , Hiroyuki Takeno , Hiroshi Shimoji , Fumio Murakami , Keiko Kurakawa
IPC分类号： H01L23/495
CPC分类号： H01L24/97 , H01L21/565 , H01L23/49548 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/49171 , H01L2224/78301 , H01L2224/85181 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/01047 , H01L2924/01051 , H01L2924/01055 , H01L2924/01056 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/181 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： It is intended to improve the production yield of QFN (Quad Flat Non-leaded package) and attain a multi-pin structure. After a resin sealing member for sealing a semiconductor chip is formed by molding, a peripheral portion of the resin sealing member and a lead frame are both cut along a cutting line which is positioned inside (on a central side of the resin sealing member) of a line (molding line) extending along an outer edge of the resin sealing member, whereby the whole surface (upper and lower surfaces and both side faces) of each of leads exposed to side faces (cut faces) of the resin sealing member is covered with resin, thus preventing the occurrence of metallic burrs on the cut faces of the leads.
摘要翻译： 旨在提高QFN（四方扁平无铅封装）的生产成本，达到多引脚结构。 在通过模塑形成用于密封半导体芯片的树脂密封构件之后，树脂密封构件的周边部分和引线框架都沿着位于树脂密封构件的内侧（树脂密封构件的中心侧）上的切割线切割 沿着树脂密封构件的外缘延伸的线（成型线），从而覆盖暴露于树脂密封构件的侧面（切割面）的各个引线的整个表面（上下表面和两个侧面） 树脂，从而防止在引线的切割面上发生金属毛刺。
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公开(公告)号：US07019388B2
公开(公告)日：2006-03-28
申请号：US10729950
申请日：2003-12-09
申请人： Fujio Ito , Hiromichi Suzuki , Hiroyuki Takeno , Hiroshi Shimoji , Fumio Murakami , Keiko Kurakawa
发明人： Fujio Ito , Hiromichi Suzuki , Hiroyuki Takeno , Hiroshi Shimoji , Fumio Murakami , Keiko Kurakawa
IPC分类号： H01L23/495
CPC分类号： H01L24/97 , H01L21/565 , H01L23/49548 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/49171 , H01L2224/78301 , H01L2224/85181 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/01047 , H01L2924/01051 , H01L2924/01055 , H01L2924/01056 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/181 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： It is intended to improve the production yield of QFN (Quad Flat Non-leaded package) and attain a multi-pin structure. After a resin sealing member for sealing a semiconductor chip is formed by molding, a peripheral portion of the resin sealing member and a lead frame are both cut along a cutting line which is positioned inside (on a central side of the resin sealing member) of a line (molding line) extending along an outer edge of the resin sealing member, whereby the whole surface (upper and lower surfaces and both side faces) of each of leads exposed to side faces (cut faces) of the resin sealing member is covered with resin, thus preventing the occurrence of metallic burrs on the cut faces of the leads.
摘要翻译： 旨在提高QFN（四方扁平无铅封装）的生产成本，达到多引脚结构。 在通过模塑形成用于密封半导体芯片的树脂密封构件之后，树脂密封构件的周边部分和引线框架都沿着位于树脂密封构件的内侧（树脂密封构件的中心侧）上的切割线切割 沿着树脂密封构件的外缘延伸的线（成型线），从而覆盖暴露于树脂密封构件的侧面（切割面）的各个引线的整个表面（上下表面和两个侧面） 树脂，从而防止在引线的切割面上发生金属毛刺。
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公开(公告)号：US4200796A
公开(公告)日：1980-04-29
申请号：US915773
申请日：1978-06-15
申请人： Fumio Murakami , Takeshi Enya , Yoshinori Ochiai
发明人： Fumio Murakami , Takeshi Enya , Yoshinori Ochiai
摘要： A storage cell type X-ray apparatus uses a storage cell as its power source and operates so that the dc voltage of the power source is converted to an ac voltage, this ac voltage is elevated to a higher voltage and rectified to obtain a high dc voltage. The resulting voltage is applied to an X-ray tube, to cause this X-ray tube to emit X-rays. This apparatus includes means for stabilizing the voltage applied to the X-ray tube.
摘要翻译： 存储单元型X射线装置使用存储单元作为其电源并进行动作，使得电源的直流电压转换为交流电压，将该交流电压提高到更高的电压并整流以获得高直流 电压。 将所得到的电压施加到X射线管，使该X射线管发射X射线。 该装置包括用于稳定施加到X射线管的电压的装置。
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