MEASURING DEVICE FOR PERMEATION RATE OF WATER AND OXYGEN OF PROTECTIVE LAYER IN ORGANIC ELECTRONIC DEVICE AND MEASURING METHOD USING THE DEVICE
    1.
    发明申请
    MEASURING DEVICE FOR PERMEATION RATE OF WATER AND OXYGEN OF PROTECTIVE LAYER IN ORGANIC ELECTRONIC DEVICE AND MEASURING METHOD USING THE DEVICE 审中-公开
    用于有机电子设备中的保护层的水和氧的渗透速率的测量装置和使用该装置的测量方法

    公开(公告)号:US20090205978A1

    公开(公告)日:2009-08-20

    申请号:US12033788

    申请日:2008-02-19

    IPC分类号: G01F1/64 G01N27/26

    CPC分类号: G01N27/041

    摘要: A device and method for measuring water and oxygen permeation rates of a protective layer in an organic electronic device are provided. The device includes: a glass substrate; a pair of electrode layers facing each other and deposited on the glass substrate; a calcium layer deposited on the glass substrate; a water and oxygen permeable substrate deposited on the calcium layer; a target protective layer of an organic electronic device, which is deposited on the water and oxygen permeable substrate; and a sealing material applied along an edge of the target protective layer, wherein one ends of the pair of electrode layers are buried in the calcium layer and the other ends are electrically connected to an external resistance measuring device.Accordingly, high reliability can be achieved, applicability to various processes for the protective layer in the organic electronic device can be enhanced without affecting reflectance or transmittance of the protective layer, and a defect averaging operation does not need to be performed on a calcium layer within the device unlike the conventional art, by using a principle that electrical characteristics of the device are changed when the water or oxygen permeates the protective layer.

    摘要翻译: 提供了一种用于测量有机电子器件中的保护层的水和氧渗透速率的装置和方法。 该装置包括:玻璃基板; 一对彼此面对并沉积在玻璃基板上的电极层; 沉积在玻璃基板上的钙层; 沉积在钙层上的水和氧气可渗透基质; 有机电子器件的目标保护层,其沉积在水和氧气渗透的基底上; 以及沿着目标保护层的边缘施加的密封材料,其中一对电极层的一端被埋在钙层中,另一端电连接到外部电阻测量装置。 因此,可以实现高可靠性,可以在不影响保护层的反射率或透射率的情况下提高对于有机电子器件中的保护层的各种工艺的适用性,并且不需要对内部的钙层进行缺陷平均化操作 该装置不同于传统技术,通过使用当水或氧渗透保护层时装置的电特性改变的原理。