公开(公告)号：US09662423B2

公开(公告)日：2017-05-30

申请号：US14184019

申请日：2014-02-19

申请人： C.R. BARD, INC.

发明人： Richard Terry ,  Fungbor Chen ,  Zhihui Yin

IPC分类号： A61L31/08 ,  A61L27/34 ,  A61L27/54 ,  A61L29/08 ,  A61L29/16 ,  A61L31/10 ,  A61L31/16 ,  B05D7/02 ,  A61L29/10 ,  A61M25/00 ,  C23C18/18 ,  C23C18/20 ,  C23C18/42 ,  B05D5/06

CPC分类号： A61L31/088 ,  A61L27/34 ,  A61L27/54 ,  A61L29/085 ,  A61L29/106 ,  A61L29/16 ,  A61L31/10 ,  A61L31/16 ,  A61L2300/104 ,  A61L2300/404 ,  A61M25/0017 ,  B05D5/067 ,  B05D7/02 ,  C23C18/1882 ,  C23C18/1893 ,  C23C18/2066 ,  C23C18/2086 ,  C23C18/42 ,  Y10T428/31692 ,  Y10T428/31707

摘要： Methods for the deposition of silver-comprising films on nonconducting substrates, and, more particularly, to deposition of such films that are very thin, are provided. The surface of nonconducting substrates is modified with a superabsorbent polymer to increase silver deposition when compared to a non-modified surface. Also provided are films produced using a swelling agent, whereby porosity of the surface of the nonconducting substrate is increased, thereby permitting increased silver deposition when compared to an unmodified surface.

公开(公告)号：US20140170298A1

公开(公告)日：2014-06-19

申请号：US14184019

申请日：2014-02-19

申请人： C.R. BARD, INC.

发明人： Richard N. Terry ,  Fung Bor Chen ,  Zhihui Yin

IPC分类号： A61L31/08

CPC分类号： A61L31/088 ,  A61L27/34 ,  A61L27/54 ,  A61L29/085 ,  A61L29/106 ,  A61L29/16 ,  A61L31/10 ,  A61L31/16 ,  A61L2300/104 ,  A61L2300/404 ,  A61M25/0017 ,  B05D5/067 ,  B05D7/02 ,  C23C18/1882 ,  C23C18/1893 ,  C23C18/2066 ,  C23C18/2086 ,  C23C18/42 ,  Y10T428/31692 ,  Y10T428/31707

摘要： Methods for the deposition of silver-comprising films on nonconducting substrates, and, more particularly, to deposition of such films that are very thin, are provided. The surface of nonconducting substrates is modified with a superabsorbent polymer to increase silver deposition when compared to a non-modified surface. Also provided are films produced using a swelling agent, whereby porosity of the surface of the nonconducting substrate is increased, thereby permitting increased silver deposition when compared to an unmodified surface.

摘要翻译： 提供了用于在非导电基底上沉积含银膜的方法，更具体地说，涉及非常薄的这种薄膜的沉积。 当与非改性表面相比时，用超吸收聚合物改性非导电衬底的表面以增加银沉积。 还提供了使用溶胀剂制备的膜，由此使非导电基材的表面的孔隙率增加，从而与未改性表面相比允许增加的银沉积。