公开(公告)号：US20170243801A1

公开(公告)日：2017-08-24

申请号：US15518942

申请日：2015-09-04

申请人： CALSONIC KANSEI CORPORATION

发明人： Hideki SUNAGA ,  Yuuzou SHIMAMURA ,  Norio FUJII ,  Yuuji DAIMON

IPC分类号： H01L23/367 ,  H05K1/18 ,  H05K3/34 ,  H01L23/31 ,  H05K1/02 ,  H01L23/495 ,  H01L23/29

CPC分类号： H01L23/3675 ,  H01L23/293 ,  H01L23/3114 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49822 ,  H01L2924/0002 ,  H01L2924/181 ,  H05K1/0203 ,  H05K1/181 ,  H05K3/3494 ,  H05K7/20 ,  H05K2201/10628 ,  H05K2201/2081 ,  H01L2924/00012 ,  H01L2924/00

摘要： An electronic component mounting structure includes a terminal of an electronic component package and a chip heat radiating member. The terminal is soldered on a land of an electronic substrate and the chip heat radiating member is soldered on a back surface of the package. The chip heat radiating member is covered by a packaging resin. The metallic heat radiating pattern integrally includes a pattern extension part that is protruded from the package, such that at least a part of the metallic heat radiating pattern in formed to be larger than the package. The pattern extension part guides excessive solder to outside of the package.

公开(公告)号：US20170347491A1

公开(公告)日：2017-11-30

申请号：US15534825

申请日：2015-09-04

申请人： CALSONIC KANSEI CORPORATION

发明人： Yuuji DAIMON ,  Norio FUJII ,  Hideki SUNAGA ,  Haruo SUZUKI ,  Yuuzou SHIMAMURA

IPC分类号： H05K7/20 ,  H05K1/02 ,  H01L23/02 ,  H01L23/28

CPC分类号： H05K7/20445 ,  H01L23/02 ,  H01L23/28 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K5/00 ,  H01L2924/00

摘要： Air in a thermally insulated space, which has been expanded by heat resulting from heating treatment for curing a thermosetting potting material, is prevented from entering the potting material. A casing has a partition wall that partitions an opening into a heat-generating-electronic-component placement section, where a heat generating electronic component is placed, and an adjacent section that is adjacent to the heat-generating-electronic-component placement section, when a heat releasing member is fixed to the opening. The heat-generating-electronic-component placement section is filled with a thermosetting potting material for moisture prevention up to a height which allows at least the heat generating electronic component to be buried in the potting material. The adjacent section has in the casing a communicating portion that communicates with a position which is apart from the heat-generating-electronic-component placement section filled with the potting material.