PLASMA TREATMENT APPARATUS AND SUBSTRATE TREATMENT SYSTEM
    1.
    发明申请
    PLASMA TREATMENT APPARATUS AND SUBSTRATE TREATMENT SYSTEM 审中-公开
    等离子体处理设备和基板处理系统

    公开(公告)号:US20150107516A1

    公开(公告)日:2015-04-23

    申请号:US14501300

    申请日:2014-09-30

    Abstract: In a substrate treatment system including multiple treatment chambers around a substrate transfer chamber, an increase in apparatus floor area due to installation of additional treatment chambers is reduced. A plasma treatment apparatus according to one embodiment of the present invention includes: a treatment chamber; a substrate holder for holding the substrate; plasma generation unit for forming plasma; multiple gate valves for installation and removal of the substrate; a shield for surrounding the plasma formed by the plasma generation unit; and substrate transfer unit for transferring the substrate through the gate valves. The substrate transfer unit is shielded from the plasma by the shield.

    Abstract translation: 在包括在基板传送室周围的多个处理室的基板处理系统中,减少了由于安装附加的处理室而导致的设备底板面积的增加。 根据本发明的一个实施例的等离子体处理装置包括:处理室; 用于保持基板的基板保持器; 用于形成等离子体的等离子体发生单元; 用于安装和移除基板的多个闸阀; 用于围绕由等离子体产生单元形成的等离子体的屏蔽; 以及用于通过闸阀传送衬底的衬底转移单元。 衬底转印单元通过屏蔽件与等离子体屏蔽。

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