Organic device and method of manufacturing the same

    公开(公告)号:US11018316B2

    公开(公告)日:2021-05-25

    申请号:US16366435

    申请日:2019-03-27

    摘要: A device comprising a first layer, a sealing layer and a resin layer stacked in that order and an organic layer arranged between the first layer and the sealing layer in a pixel region is provided. The first, sealing and resin layers have openings for exposing an electrode in a peripheral region. The sealing layer includes second and third layers each having a water permeability lower than the first layer, and a fourth layer arranged between the second layer and the third layer and having a defect density lower than the second layer. A step of the second layer arranged above the end of the opening of the first layer is covered with the fourth layer and a step of the third layer arranged above the end of the opening of the first layer is covered with the resin layer.

    ORGANIC DEVICE AND METHOD OF MANUFACTURING THE SAME

    公开(公告)号:US20210265591A1

    公开(公告)日:2021-08-26

    申请号:US17238320

    申请日:2021-04-23

    摘要: A device comprising a first layer, a sealing layer and a resin layer stacked in that order and an organic layer arranged between the first layer and the sealing layer in a pixel region is provided. The first, sealing and resin layers have openings for exposing an electrode in a peripheral region. The sealing layer includes second and third layers each having a water permeability lower than the first layer, and a fourth layer arranged between the second layer and the third layer and having a defect density lower than the second layer. A step of the second layer arranged above the end of the opening of the first layer is covered with the fourth layer and a step of the third layer arranged above the end of the opening of the first layer is covered with the resin layer.

    MANUFACTURING METHOD OF SOLID-STATE IMAGING APPARATUS
    5.
    发明申请
    MANUFACTURING METHOD OF SOLID-STATE IMAGING APPARATUS 有权
    固态成像装置的制造方法

    公开(公告)号:US20140199801A1

    公开(公告)日:2014-07-17

    申请号:US14148063

    申请日:2014-01-06

    IPC分类号: H01L27/146

    摘要: A color filter 5 is formed above a semiconductor substrate SB, in an area above a predetermined light receiving portion among a plurality of light receiving portions 1. A sacrificial layer 8 is formed on upper and side of the first color filter 5. Color filters 6 and 7 are formed above the semiconductor substrate SB, in areas above other light receiving portions adjacent to the predetermined light receiving portion, to expose at least part of the upper surface area of the first color filter 5 on the sacrificial layer 8. The sacrificial layer 8 is etched to remove the upper and side areas of the color filter 5 on the sacrificial layer 8 to form hollow portions 9 between the color filter 5 and the color filter 6 and between the color filter 5 and the color filter 7.

    摘要翻译: 在多个光接收部分1中的预定光接收部分上方的区域中,在半导体衬底SB上方形成滤色器5.在第一滤色器5的上侧和第二侧形成牺牲层8.滤色器6 和7形成在半导体衬底SB上方,在与预定光接收部分相邻的其他光接收部分上方的区域中,以在牺牲层8上露出第一滤色器5的上表面区域的至少一部分。牺牲层 蚀刻8以去除牺牲层8上的滤色器5的上部和侧部区域,以在滤色器5和滤色器6之间以及滤色器5和滤色器7之间形成中空部分9。

    SOLID-STATE IMAGING APPARATUS AND METHOD OF MANUFACTURING THE SAME
    6.
    发明申请
    SOLID-STATE IMAGING APPARATUS AND METHOD OF MANUFACTURING THE SAME 有权
    固态成像装置及其制造方法

    公开(公告)号:US20140191349A1

    公开(公告)日:2014-07-10

    申请号:US14147279

    申请日:2014-01-03

    IPC分类号: H01L27/146

    摘要: The present invention provides a solid-state imaging apparatus which has hollow portions provided around each of color filters and achieves the prevention of the peeling of each of the color filters. The solid-state imaging apparatus having a plurality of light receiving portions provided on a semiconductor substrate includes: a plurality of color filters arranged correspondingly to each of the plurality of light receiving portions; and hollow portions formed around each of the plurality of color filters, wherein each of the color filters has one peripheral part contacting with adjacent one or more of the color filters.

    摘要翻译: 本发明提供了一种固态成像装置,其具有设置在每个滤色器周围的中空部分,并且可以防止每个滤色器的剥离。 具有设置在半导体基板上的多个受光部的固体摄像装置具备:与多个受光部中的每一个对应配置的多个滤色器, 以及围绕所述多个滤色器中的每一个形成的中空部分,其中每个所述滤色器具有与相邻的一个或多个滤色器接触的一个周边部分。

    Solid-state imaging apparatus and method of manufacturing the same
    8.
    发明授权
    Solid-state imaging apparatus and method of manufacturing the same 有权
    固态成像装置及其制造方法

    公开(公告)号:US09305965B2

    公开(公告)日:2016-04-05

    申请号:US14147279

    申请日:2014-01-03

    IPC分类号: H01L27/146

    摘要: The present invention provides a solid-state imaging apparatus which has hollow portions provided around each of color filters and achieves the prevention of the peeling of each of the color filters. The solid-state imaging apparatus having a plurality of light receiving portions provided on a semiconductor substrate includes: a plurality of color filters arranged correspondingly to each of the plurality of light receiving portions; and hollow portions formed around each of the plurality of color filters, wherein each of the color filters has one peripheral part contacting with adjacent one or more of the color filters.

    摘要翻译: 本发明提供了一种固态成像装置,其具有设置在每个滤色器周围的中空部分,并且可以防止每个滤色器的剥离。 具有设置在半导体基板上的多个受光部的固体摄像装置具备:与多个受光部中的每一个对应配置的多个滤色器, 以及围绕所述多个滤色器中的每一个形成的中空部分,其中每个所述滤色器具有与相邻的一个或多个滤色器接触的一个周边部分。

    Manufacturing method of solid-state imaging apparatus
    10.
    发明授权
    Manufacturing method of solid-state imaging apparatus 有权
    固态成像装置的制造方法

    公开(公告)号:US09269744B2

    公开(公告)日:2016-02-23

    申请号:US14148077

    申请日:2014-01-06

    IPC分类号: H01L21/00 H01L27/146

    摘要: To realize simplification of a process of forming hollow portions in a solid-state imaging apparatus, a plurality of light receiving portions is formed on a semiconductor substrate, and color filter layers as hollow portion forming layers are formed above the semiconductor substrate (FIG. 1A). A sealable layer for opening boundary portions of the color filter layers is formed on the color filter layers (FIG. 1B). Hollow portions are formed on side surfaces of the color filter layer by etching using the sealable layer as a mask (FIG. 1C). The sealable layer is heated and softened to connect mutually adjacent sealable layers to form a sealing layer for sealing the aperture regions of the hollow portions (FIG. 1D).

    摘要翻译: 为了简化在固态成像装置中形成中空部分的工艺,在半导体衬底上形成多个光接收部分,并且在半导体衬底上形成作为中空部分形成层的滤色器层(图1A )。 用于打开滤色器层的边界部分的可密封层形成在滤色器层上(图1B)。 通过使用可密封层作为掩模进行蚀刻,在滤色器层的侧表面上形成空心部分(图1C)。 可密封层被加热和软化以连接相互相邻的可密封层,以形成用于密封中空部分的孔区域的密封层(图1D)。