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公开(公告)号：US20240306306A1
公开(公告)日：2024-09-12
申请号：US18666091
申请日：2024-05-16
发明人： JUN TSUKANO
CPC分类号： H05K3/103 , H05K3/361 , H05K2203/0278
摘要： A manufacturing method of an electronic component includes preparing a first structure in which a first electrode is arranged on a first main surface of a first substrate, preparing a second structure in which a second electrode is arranged on a first main surface of a second substrate, and curing a bonding member while making the first main surface of the first substrate and the first main surface of the second substrate face each other via the bonding member and applying a force to the first structure and the second structure so as to pressurize the bonding member. At least one of the first electrode and the second electrode includes a window portion. In the curing, the bonding member is cured by irradiating the bonding member with light through the window portion.
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公开(公告)号：US20230247768A1
公开(公告)日：2023-08-03
申请号：US18152237
申请日：2023-01-10
发明人： JUN TSUKANO
CPC分类号： H05K3/103 , H05K3/361 , H05K2203/0278
摘要： A manufacturing method of an electronic component includes preparing a first structure in which a first electrode is arranged on a first main surface of a first substrate, preparing a second structure in which a second electrode is arranged on a first main surface of a second substrate, and curing a bonding member while making the first main surface of the first substrate and the first main surface of the second substrate face each other via the bonding member and applying a force to the first structure and the second structure so as to pressurize the bonding member. At least one of the first electrode and the second electrode includes a window portion. In the curing, the bonding member is cured by irradiating the bonding member with light through the window portion.
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公开(公告)号：US20240107670A1
公开(公告)日：2024-03-28
申请号：US18475060
申请日：2023-09-26
发明人： JUN TSUKANO
CPC分类号： H05K1/14 , H01R12/62 , H01R12/65 , H04N23/53 , H05K3/361 , H01R4/70 , H05K2201/041 , H05K2201/09045
摘要： An electronic component includes first and second electrodes, first and second substrates having first and second principal surfaces, respectively, and a connection member to connect the first and second electrodes, wherein the first and second electrodes are arranged on the first and second principal surfaces, respectively, a height of the connection member is greater than those of the first and second electrodes in the direction perpendicular to the first principal surface, a distance between a portion of the first principal surface not in contact with the first electrode and a portion of the second principal surface not in contact with the second electrode is shorter than a distance between a portion of the first principal surface in contact with the first electrode and a portion of the second principal surface in contact with the second electrode, and an intermediary body is arranged between the second electrode and the connection member.
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