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公开(公告)号：US11770630B2
公开(公告)日：2023-09-26
申请号：US17590634
申请日：2022-02-01
发明人： Masaki Sato , Masahiro Kobayashi , Tatsuya Ryoki , Kohichi Nakamura , Daisuke Kobayashi , Hiroaki Kameyama , Yasuhiro Oguro
IPC分类号： H04N25/672 , H01L27/146
CPC分类号： H04N25/672 , H01L27/14623
摘要： A photoelectric conversion apparatus includes a second substrate including a signal processing circuit configured to perform signal processing using machine learning on a signal output from the first substrate. The second substrate is disposed on the first substrate in a multilayer structure. The signal processing circuit is so disposed to overlap with a pixel array but not overlap with a light-shielded pixel area as seen in a plan view.
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2.发明申请公开(公告)号：US20220294922A1
公开(公告)日：2022-09-15
申请号：US17689717
申请日：2022-03-08
发明人： Tatsuya Ryoki , Naoki Isoda
摘要： There is provide a photoelectric conversion device. In a first mode, a control unit performs control such that a signal output from each of a plurality of pixels is held in a corresponding holding unit. In a second mode, the control unit performs control of outputting a signal from the holding unit corresponding to a pixel in a first column and control of holding a signal based on a pixel in the first column in the holding unit corresponding to a pixel in a second column in parallel in the same period.
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公开(公告)号：US20220247948A1
公开(公告)日：2022-08-04
申请号：US17590634
申请日：2022-02-01
发明人： Masaki Sato , Masahiro Kobayashi , Tatsuya Ryoki , Kohichi Nakamura , Daisuke Kobayashi , Hiroaki Kameyama , Yasuhiro Oguro
IPC分类号： H04N5/365
摘要： A photoelectric conversion apparatus includes a second substrate including a signal processing circuit configured to perform signal processing using machine learning on a signal output from the first substrate. The second substrate is disposed on the first substrate in a multilayer structure. The signal processing circuit is so disposed to overlap with a pixel array but not overlap with a light-shielded pixel area as seen in a plan view.
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公开(公告)号：US20220247947A1
公开(公告)日：2022-08-04
申请号：US17586243
申请日：2022-01-27
发明人： Tetsuya Itano , Tatsuya Ryoki , Yu Arishima , Taro Muraki
摘要： Since a failure related to an output from a sensor is not detected from an image signal and a failure of the sensor is not detected from an output from the sensor in a system including the sensor for abnormality detection, it is not possible to perform the abnormality detection and to indicate the abnormality to the outside of the system.
An apparatus includes a pixel area including multiple pixels, multiple sensors, a processing unit that compares signals based on outputs from the multiple sensors with each other, an output unit that outputs information based on a result of comparison.-
公开(公告)号：US11385561B2
公开(公告)日：2022-07-12
申请号：US17010476
申请日：2020-09-02
发明人： Tatsuya Suzuki , Tatsuya Ryoki
IPC分类号： G03G15/04 , G03G15/043
摘要： A driving apparatus is provided. The driving apparatus comprises a plurality of driving circuits configured to generate a current according to an inputted voltage. The plurality of driving circuits are formed on a single semiconductor chip, and each of the plurality of driving circuits comprises a plurality of output circuits configured to supply the current to a plurality of load elements arranged in at least one load element array.
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公开(公告)号：US20210167113A1
公开(公告)日：2021-06-03
申请号：US17175447
申请日：2021-02-12
IPC分类号： H01L27/146 , H01L27/148
摘要： A semiconductor device in which a first chip and a second chip are stacked including a first wiring line and a second wiring line by which the first chip and the second chip are electrically connected. The first wiring line and the second wiring line each include a bonding portion for bonding one of a plurality of conductive patterns placed in the first chip and one of a plurality of conductive patterns placed in the second chip. The number of bonding portions included in the first wiring line is larger than the number of bonding portions included in the second wiring line.
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公开(公告)号：US10057529B2
公开(公告)日：2018-08-21
申请号：US15630013
申请日：2017-06-22
IPC分类号： H04N3/14 , H04N5/335 , H04N5/378 , H03M1/12 , H01L27/146
CPC分类号： H04N5/378 , H01L27/14634 , H01L27/14636 , H03M1/12 , H03M1/123 , H03M1/56 , H04M1/026 , H04N5/379
摘要： A device has stacked first and second substrates. The first substrate includes pixel array having pixels arranged along surface, the second substrate includes readout circuit having first AD-conversion circuit for generating first digital signals corresponding to first signals from the pixels, first parallel-serial conversion circuit for outputting first serial signal by performing parallel-serial conversion on the first digital signals, and processing circuit for processing the first serial signal. In orthogonal projection to the surface, part of the pixel array and part of the processing circuit overlap with each other. The first AD-conversion circuit is arranged between edge of the second substrate and the processing circuit. The first parallel-serial conversion circuit is arranged between the first AD-conversion circuit and the processing circuit.
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公开(公告)号：US20180175103A1
公开(公告)日：2018-06-21
申请号：US15824053
申请日：2017-11-28
IPC分类号： H01L27/148 , H04N5/378 , H01L27/146
CPC分类号： H01L27/14812 , H01L27/14609 , H01L27/14643 , H04N5/378
摘要： An imaging device includes pixels each including a photoelectric converter generating charges, a holding portion holding charges transferred from the photoelectric converter, and an amplifier unit outputting a signal based on charges transferred from the holding portion. Each pixel outputs, to an output line, a signal based on charges generated by the photoelectric converter during an exposure period including a first period during which the photoelectric converter holds charges generated in the first period and a second period during which the photoelectric converter or the holding portion holds charges generated in the second period while the holding portion is holding charges generated in the first period, and resets the holding portion after outputting a signal based on charges held in the holding portion in the first period and before transferring charges generated in the first period from the photoelectric converter to the holding portion.
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公开(公告)号：US11838660B2
公开(公告)日：2023-12-05
申请号：US17586243
申请日：2022-01-27
发明人： Tetsuya Itano , Tatsuya Ryoki , Yu Arishima , Taro Muraki
IPC分类号： H04N25/671 , H04N25/75 , H04N25/60
CPC分类号： H04N25/671 , H04N25/60 , H04N25/75
摘要： Since a failure related to an output from a sensor is not detected from an image signal and a failure of the sensor is not detected from an output from the sensor in a system including the sensor for abnormality detection, it is not possible to perform the abnormality detection and to indicate the abnormality to the outside of the system.
An apparatus includes a pixel area including multiple pixels, multiple sensors, a processing unit that compares signals based on outputs from the multiple sensors with each other, an output unit that outputs information based on a result of comparison.-
10.发明授权公开(公告)号：US11652940B2
公开(公告)日：2023-05-16
申请号：US17689717
申请日：2022-03-08
发明人： Tatsuya Ryoki , Naoki Isoda
CPC分类号： H04N1/00822 , H04N1/00933 , H04N1/02805
摘要： There is provide a photoelectric conversion device. In a first mode, a control unit performs control such that a signal output from each of a plurality of pixels is held in a corresponding holding unit. In a second mode, the control unit performs control of outputting a signal from the holding unit corresponding to a pixel in a first column and control of holding a signal based on a pixel in the first column in the holding unit corresponding to a pixel in a second column in parallel in the same period.
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