Unlocking computing resources for decomposable data centers

    公开(公告)号:US11824793B2

    公开(公告)日:2023-11-21

    申请号:US18107343

    申请日:2023-02-08

    CPC classification number: H04L47/722 H04L67/568 H04L69/08

    Abstract: Techniques for sending Compute Express Link (CXL) packets over Ethernet (CXL-E) in a composable data center that may include disaggregated, composable servers. The techniques may include receiving, from a first server device, a request to bind the first server device with a multiple logical device (MLD) appliance. Based at least in part on the request, a first CXL-E connection may be established for the first server device to export a computing resource to the MLD appliance. The techniques may also include receiving, from the MLD appliance, an indication that the computing resource is available, and receiving, from a second server device, a second request for the computing resource. Based at least in part on the second request, a second CXL-E connection may be established for the second server device to consume or otherwise utilize the computing resource of the first server device via the MLD appliance.

    AGGREGATION OF MULTIPLEXED OPTICAL TRANSCEIVERS IN SERVER CHASSIS TO ESTABLISH FABRIC TOPOLOGY

    公开(公告)号:US20230362519A1

    公开(公告)日:2023-11-09

    申请号:US18098616

    申请日:2023-01-18

    Abstract: This disclosure describes multiplexed optical transceivers, such as DWDM multiplexer/demultiplexers, which are aggregated in a server chassis to establish a fabric topology interconnecting blade servers to a dedicated switch module. Blade servers installed in the server chassis can utilize not just Ethernet interfaces to connect to network segments, but also PCIe interfaces as well as a combination of Ethernet and PCIe interfaces. The aggregated optical transceivers multiplex and demultiplex wavelength-specific optical signals using a laser source, reducing power consumption over switched fabric ASICs. Servicing of the multiplexed optical transceivers is facilitated by installation and replacement of a laser source. Scaling and redundancy of fabric topology interconnects can be facilitated by selection of laser sources generating expanded ranges of discrete wavelengths. Furthermore, chassis management can be facilitated by configuring network controllers of blade servers to transport chassis management instructions over the fabric topology in-band over a network interface, rather than by an out-of-band pathway.

    UNLOCKING COMPUTING RESOURCES FOR DECOMPOSABLE DATA CENTERS

    公开(公告)号:US20230188474A1

    公开(公告)日:2023-06-15

    申请号:US18107343

    申请日:2023-02-08

    CPC classification number: H04L47/722 H04L67/568 H04L69/08

    Abstract: Techniques for sending Compute Express Link (CXL) packets over Ethernet (CXL-E) in a composable data center that may include disaggregated, composable servers. The techniques may include receiving, from a first server device, a request to bind the first server device with a multiple logical device (MLD) appliance. Based at least in part on the request, a first CXL-E connection may be established for the first server device to export a computing resource to the MLD appliance. The techniques may also include receiving, from the MLD appliance, an indication that the computing resource is available, and receiving, from a second server device, a second request for the computing resource. Based at least in part on the second request, a second CXL-E connection may be established for the second server device to consume or otherwise utilize the computing resource of the first server device via the MLD appliance.

    Closed loop hybrid cooling
    5.
    发明授权

    公开(公告)号:US11119543B2

    公开(公告)日:2021-09-14

    申请号:US16871620

    申请日:2020-05-11

    Abstract: A hybrid cooling server assembly can have a printed circuit board (PCB) with a processor socket disposed thereon and a hybrid cooling plate can be operably coupled with the processor socket. A radiator can having a working fluid received therein and be in fluidic communication with the radiator and the hybrid cooling plate by one or more tubular members. One or more cooling fans can be proximal to the radiator. The working fluid can be operable to receive heat from the cooling plate and reject heat at the radiator and the one or more cooling fans can be operable to produce an airflow across the hybrid cooling plate, thereby allowing the hybrid cooling plate transfer thermal energy to the airflow.

    PEER DIRECT MECHANISM FOR DIRECT MEMORY ACCESS ACROSS HOST DEVICES

    公开(公告)号:US20200301873A1

    公开(公告)日:2020-09-24

    申请号:US16356581

    申请日:2019-03-18

    Abstract: In one example, at least one peripheral interconnect switch obtains, from a first endpoint device, a message initiating a direct memory access data transfer between the first endpoint device and a second endpoint device. The message indicates an address assigned to the second endpoint device by a host device as a destination of the message. Based on the address assigned to the second endpoint device by the host device, the at least one peripheral interconnect switch identifies an address assigned to the second endpoint device by the at least one peripheral interconnect switch. In response to identifying the address assigned to the second endpoint device by the at least one peripheral interconnect switch, the at least one peripheral interconnect switch provides the message to the second endpoint device.

    Closed loop hybrid cooling
    7.
    发明授权

    公开(公告)号:US10684661B1

    公开(公告)日:2020-06-16

    申请号:US16358525

    申请日:2019-03-19

    Abstract: A hybrid cooling server assembly can have a printed circuit board (PCB) with a processor socket disposed thereon and a hybrid cooling plate can be operably coupled with the processor socket. A radiator can having a working fluid received therein and be in fluidic communication with the radiator and the hybrid cooling plate by one or more tubular members. One or more cooling fans can be proximal to the radiator. The working fluid can be operable to receive heat from the cooling plate and reject heat at the radiator and the one or more cooling fans can be operable to produce an airflow across the hybrid cooling plate, thereby allowing the hybrid cooling plate transfer thermal energy to the airflow.

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