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公开(公告)号：US3588425A
公开(公告)日：1971-06-28
申请号：US3588425D
申请日：1969-07-03
Applicant: CONTROL DATA CORP
Inventor： ERICKSON KEITH O
CPC classification number: H05K3/3494 , B23K1/0053 , B23K2201/42 , H05K3/3421 , H05K2203/1581
Abstract: A MANUFACTURING METHOD AND APPARATUS FOR SOLDERING THE LEADS OF INTEGRATED CIRCUIT FLAT PACKS TO THE CONTACT PADS OF PRINTED CIRCUIT BOARDS. A PAIR OF INFRARED LAMPS, FOCUSED BY CYLINDROIDAL REFLECTORS ON BOTH SIDES OF THE CIRCUIT BOARDS ARE USED TO SUPPLY HEAT. EACH CIRCUIT BOARD MAY CONTAIN CONTACT PADS OF WIDELY VARYING HEAT SINK CHARACTERISTICS. ADDITION OF THE SECOND LAMP AS A HEAT SOURCE ALLOWS WIDE USAGE OF THE SYSTEM BECAUSE ALL POSSIBLE HEAT REQUIREMENTS CAN BE SATISFIED WITHOUT THE RISKS OF HIGH HEAT CONCENTRATIONS WHICH MAY DAMAGE COMPONENTS AND CIRCUIT BOARDS.
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