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公开(公告)号：US20230003459A1
公开(公告)日：2023-01-05
申请号：US17942639
申请日：2022-09-12
Applicant: COOLER MASTER CO., LTD.
Inventor： Chia Yu LIN , Shan-Yin Cheng
Abstract: A heat dissipation device includes a base plate and a plurality of fins arranged on the base plate. Each fin includes a fin body including a first metal sheet and a second metal sheet coupled to each other, wherein the fin body is curved and includes a first portion and a second portion transverse to the first portion, an evaporation channel defined in the first portion, one or more connecting channels disposed in the first portion and in fluid communication with the evaporation channel, a condensation channel defined in the second portion, and one or more auxiliary channels disposed in the second portion and in fluid communication with the one or more connecting channels and the condensation channel.
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公开(公告)号：US11530879B2
公开(公告)日：2022-12-20
申请号：US17147182
申请日：2021-01-12
Applicant: COOLER MASTER CO., LTD.
Inventor： Chia Yu Lin , Shan-Yin Cheng
Abstract: A heat dissipation device includes a base plate and a plurality of fins arranged on the base plate. Each fin includes a fin body including a first metal sheet and a second metal sheet coupled to each other, wherein the fin body is curved and includes a first portion and a second portion transverse to the first portion, an evaporation channel defined in the first portion, one or more connecting channels disposed in the first portion and in fluid communication with the evaporation channel, a condensation channel defined in the second portion, and one or more auxiliary channels disposed in the second portion and in fluid communication with the one or more connecting channels and the condensation channel.
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公开(公告)号：US11686532B2
公开(公告)日：2023-06-27
申请号：US17112741
申请日：2020-12-04
Applicant: COOLER MASTER CO., LTD.
Inventor： Chi-Chuan Wang , Chang-Yu Hsieh , Shan-Yin Cheng , Hsiang-Fen Chou
CPC classification number: F28D15/0266 , F28D15/0233 , F28F3/12 , F28F13/08 , F28D2015/0216 , F28D2021/0028 , H05K7/20 , H05K7/20336
Abstract: The disclosure is related to a heat dissipation structure. The heat dissipation structure is adapted to accommodate a fluid and thermally contact a heat source. The heat dissipation structure includes a heat conductive plate and a channel arrangement. The heat conductive plate is configured to thermally contact the heat source. The channel arrangement is located on the heat conductive plate, and the channel arrangement includes a wider channel portion and a narrower channel portion. The wider channel portion is wider than the narrower channel portion, and the wider channel portion is connected to the narrower channel portion so that the channel arrangement forms a loop. The channel arrangement is configured to accommodate the fluid and allow the fluid to absorb heat generated by the heat source through the heat conductive plate so as to at least partially change phase of the fluid.
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公开(公告)号：US11384999B2
公开(公告)日：2022-07-12
申请号：US16821259
申请日：2020-03-17
Applicant: COOLER MASTER CO., LTD.
Inventor： Chia-Yu Lin , Chang-Yu Hsieh , Shan-Yin Cheng , Hsiang-Fen Chou
IPC: F28F13/00 , F28D21/00 , H01L23/467 , H01L23/367 , F28F13/06
Abstract: This disclosure provides a heat dissipation device configured to be in thermal contact with a heat source. The heat dissipation device includes a heat dissipation body and a cover plate. The heat dissipation body has at least one vertical channel. The heat dissipation body is configured to be in thermal contact with the heat source. The cover plate includes a first layer and a second layer that are stacked on each other. The first layer is stacked on the heat dissipation body and covers the at least one vertical channel. A thermal conductivity of the first layer is larger than a thermal conductivity of the second layer. The cover plate has at least one first through hole penetrating through the first layer and the second layer and connecting to the at least one vertical channel.
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公开(公告)号：US11725885B2
公开(公告)日：2023-08-15
申请号：US17942639
申请日：2022-09-12
Applicant: COOLER MASTER CO., LTD.
Inventor： Chia Yu Lin , Shan-Yin Cheng
CPC classification number: F28D20/00 , B21D53/022 , B21D53/04 , B21D53/045 , F28F3/14 , F28F2215/00 , F28F2215/06 , F28F2230/00 , F28F2245/00 , F28F2250/00 , F28F2250/102 , Y10T29/49353 , Y10T29/49366
Abstract: A heat dissipation device includes a base plate and a plurality of fins arranged on the base plate. Each fin includes a fin body including a first metal sheet and a second metal sheet coupled to each other, wherein the fin body is curved and includes a first portion and a second portion transverse to the first portion, an evaporation channel defined in the first portion, one or more connecting channels disposed in the first portion and in fluid communication with the evaporation channel, a condensation channel defined in the second portion, and one or more auxiliary channels disposed in the second portion and in fluid communication with the one or more connecting channels and the condensation channel.
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Patent Agency Ranking
公开(公告)号：US11692777B2
公开(公告)日：2023-07-04
申请号：US17942658
申请日：2022-09-12
Applicant: COOLER MASTER CO., LTD.
Inventor： Chia Yu Lin , Shan-Yin Cheng
CPC classification number: F28D20/00 , B21D53/022 , B21D53/04 , B21D53/045 , F28F3/14 , F28F2215/00 , F28F2215/06 , F28F2230/00 , F28F2245/00 , F28F2250/00 , F28F2250/102 , Y10T29/49353 , Y10T29/49366
Abstract: A heat dissipation device includes a base plate and a plurality of fins arranged on the base plate. Each fin includes a fin body including a first metal sheet and a second metal sheet coupled to each other, wherein the fin body is curved and includes a first portion and a second portion transverse to the first portion, an evaporation channel defined in the first portion, one or more connecting channels disposed in the first portion and in fluid communication with the evaporation channel, a condensation channel defined in the second portion, and one or more auxiliary channels disposed in the second portion and in fluid communication with the one or more connecting channels and the condensation channel.
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公开(公告)号：US11713927B2
公开(公告)日：2023-08-01
申请号：US17983264
申请日：2022-11-08
Applicant: COOLER MASTER CO., LTD.
Inventor： Kui-Yen Chen , Shan-Yin Cheng
CPC classification number: F28D1/0316 , F28D15/0266 , F28D2021/0029 , F28D2021/0031 , F28F2215/06 , F28F2250/10
Abstract: A heat dissipation device is configured for a working fluid to flow therethrough. The heat dissipation device includes a base and at least one heat dissipation fin. The base has at least one internal channel configured for the working fluid to flow therethrough. The at least one heat dissipation fin having an extension channel and an inlet and an outlet is in fluid communication with the extension channel. The at least one heat dissipation fin is inserted into one side of the base, and the extension channel is communicated with the at least one internal channel through the inlet and the outlet.
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公开(公告)号：US11598588B2
公开(公告)日：2023-03-07
申请号：US17826800
申请日：2022-05-27
Applicant: COOLER MASTER CO., LTD.
Inventor： Chia Yu Lin , Shan-Yin Cheng
Abstract: A method includes providing a first metal sheet and a second metal sheet, printing a plurality of channels on the first metal sheet, bonding the first metal sheet and the second metal sheet to each other to obtain a fin body, bending a first portion of the fin body to be transverse to a second portion of the fin body, separating the first metal sheet and the second metal sheet from each other to form the plurality of channels, introducing working fluid in the plurality of channels, and sealing the first metal sheet and the second metal sheet.
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公开(公告)号：US10907907B2
公开(公告)日：2021-02-02
申请号：US15921623
申请日：2018-03-14
Applicant: COOLER MASTER CO.,LTD.
Inventor： Chi-Chuan Wang , Chang-Yu Hsieh , Shan-Yin Cheng , Hsiang-Fen Chou
Abstract: The disclosure is related to a heat dissipation structure. The heat dissipation structure is adapted to accommodate a fluid and thermally contact a heat source. The heat dissipation structure includes a heat conductive plate and a channel arrangement. The heat conductive plate is configured to thermally contact the heat source. The channel arrangement is located on the heat conductive plate, and the channel arrangement includes a wider channel portion and a narrower channel portion. The wider channel portion is wider than the narrower channel portion, and the wider channel portion is connected to the narrower channel portion so that the channel arrangement forms a loop. The channel arrangement is configured to accommodate the fluid and allow the fluid to absorb heat generated by the heat source through the heat conductive plate so as to at least partially change phase of the fluid.
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公开(公告)号：US11732981B2
公开(公告)日：2023-08-22
申请号：US17834821
申请日：2022-06-07
Applicant: COOLER MASTER CO., LTD.
Inventor： Chia-Yu Lin , Chang-Yu Hsieh , Shan-Yin Cheng , Hsiang-Fen Chou
IPC: F28D21/00 , F28F13/00 , H01L23/467 , F28F13/06
CPC classification number: F28F13/06 , F28F13/00 , F28F2013/001 , F28F2215/08 , F28F2250/10
Abstract: This disclosure provides a heat dissipation device configured to be in thermal contact with a heat source. The heat dissipation device includes a heat dissipation body and a cover plate. The heat dissipation body has at least one vertical channel. The heat dissipation body is configured to be in thermal contact with the heat source. The cover plate includes a first layer and a second layer that are stacked on each other. The first layer is stacked on the heat dissipation body and covers the at least one vertical channel. A thermal conductivity of the first layer is larger than a thermal conductivity of the second layer. The cover plate has at least one first through hole penetrating through the first layer and the second layer and connecting to the at least one vertical channel.
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