公开(公告)号：US20210255370A1

公开(公告)日：2021-08-19

申请号：US17054929

申请日：2019-05-15

Applicant: CORNING INCORPORATED

Inventor： Michael Anzlowar ,  Robert Alan Bellman ,  Shiwen Liu ,  Ines Wyrsta

IPC: G02B3/14 ,  G02B26/00 ,  G02B3/00 ,  G03F7/00

Abstract: A method of fabricating a liquid lens or an array of liquid lenses, and the corresponding liquid lens or array of lenses is disclosed. The method includes patterning an insulative layer (132) by photolithographic techniques to expose a portion of the conductive layer (124) and a portion of the insulative layer (132) having a surface energy below 40 mJ/m2. In further embodiments, the liquid lens includes an interface (110) forming a lens between a polar liquid (106) and a non-polar liquid (108) disposed within a cavity (104). The interface intersects a surface of the insulative layer (132) having a surface energy below 40 mJ/m2.

公开(公告)号：US10046542B2

公开(公告)日：2018-08-14

申请号：US15122366

申请日：2015-01-26

Applicant: Corning Incorporated

Inventor： Kaveh Adib ,  Robert Alan Bellman ,  Dana Craig Bookbinder ,  Theresa Chang ,  Shiwen Liu ,  Robert George Manley ,  Prantik Mazumder

IPC: B32B7/06 ,  B32B37/26 ,  B32B7/02 ,  B32B17/06 ,  C03C17/22 ,  C03C23/00 ,  C03C27/06 ,  C03C27/10

Abstract: A method of controllably bonding a thin sheet having a thin sheet bonding surface with a carrier having a carrier bonding surface, by depositing a carbonaceous surface modification layer onto at least one of the thin sheet bonding surface and the carrier bonding surface, incorporating polar groups with the surface modification layer, and then bonding the thin sheet bonding surface to the carrier bonding surface via the surface modification layer. The surface modification layer may include a bulk carbonaceous layer having a first polar group concentration and a surface layer having a second polar group concentration, wherein the second polar group concentration is higher than the first polar group concentration. The surface modification layer deposition and the treatment thereof may be performed by plasma polymerization techniques.

公开(公告)号：US20210048602A1

公开(公告)日：2021-02-18

申请号：US16943732

申请日：2020-07-30

Applicant: CORNING INCORPORATED

Inventor： Christian Daniel Gutleben ,  Shiwen Liu ,  Nicholas James Pfister ,  Ernesto Sanchez, JR.

IPC: G02B7/02 ,  G02B3/14 ,  G02B1/11

Abstract: A liquid lens apparatus includes a first substrate and a sensor. The first substrate has first and second opposing surfaces, a central portion, and a peripheral portion outside of the central portion. The sensor is formed lithographically on either the first or second surfaces of the peripheral portion of the first substrate such that the sensor is on an exterior surface of the liquid lens apparatus. The sensor is configured to detect a temperature of the liquid lens apparatus to enable compensation for thermal expansion or contraction of the liquid lens apparatus resulting from changes in temperature of the liquid lens apparatus.

公开(公告)号：US20200262162A1

公开(公告)日：2020-08-20

申请号：US16754655

申请日：2018-10-12

Applicant: CORNING INCORPORATED

Inventor： Robert Alan Bellman ,  David Francis Dawson-Elli ,  Shiwen Liu ,  ChuanChe Wang

IPC: B29D11/00 ,  C03C17/02 ,  C03C23/00

Abstract: A method includes depositing a surface modification layer on sidewalls of a plurality of cavities of a shaped article. The surface modification layer is formed from a glass material including a mobile component. The shaped article is formed from a glass material, a glass ceramic material, or a combination thereof. At least a portion of the mobile component is migrated from the surface modification layer into surface regions of the sidewalls of the shaped article, whereby subsequent to the migration, the surface regions have a reduced annealing point compared to a bulk of the shaped article. The surface modification layer and the surface regions of the sidewalls are reflowed. A surface roughness of the surface modification layer disposed on the sidewalls following the reflowing is less than a surface roughness of the sidewalls prior to the depositing.

公开(公告)号：US20170352553A1

公开(公告)日：2017-12-07

申请号：US15609238

申请日：2017-05-31

Applicant: CORNING INCORPORATED

Inventor： Robert Alan Bellman ,  Shiwen Liu

IPC: H01L21/48 ,  H01L21/683 ,  C23C16/27 ,  H01L23/498 ,  B05D1/00

CPC classification number: H01L21/486 ,  B05D1/60 ,  C03C15/00 ,  C03C17/22 ,  C03C17/30 ,  C03C23/0025 ,  C03C2204/08 ,  C03C2218/34 ,  C23C16/27 ,  H01L21/3081 ,  H01L21/31144 ,  H01L21/6835 ,  H01L21/76898 ,  H01L23/49827 ,  H01L23/49838

Abstract: Methods of forming vias in substrates having at least one damage region extending from a first surface etching the at least one damage region of the substrate to form a via in the substrate, wherein the via extends through the thickness T of the substrate while the first surface of the substrate is masked. The mask is removed from the first surface of the substrate after etching and upon removal of the mask the first surface of the substrate has a surface roughness (Rq) of about less than 1.0 nm.

公开(公告)号：US11815732B2

公开(公告)日：2023-11-14

申请号：US16943732

申请日：2020-07-30

Applicant: CORNING INCORPORATED ,  LG INNOTEK CO., LTD.

Inventor： Christian Daniel Gutleben ,  Shiwen Liu ,  Nicholas James Pfister ,  Ernesto Sanchez, Jr.

IPC: G02B7/02 ,  G02B1/11 ,  G02B3/14

CPC classification number: G02B7/028 ,  G02B1/11 ,  G02B3/14

Abstract: A liquid lens apparatus includes a first substrate and a sensor. The first substrate has first and second opposing surfaces, a central portion, and a peripheral portion outside of the central portion. The sensor is formed lithographically on either the first or second surfaces of the peripheral portion of the first substrate such that the sensor is on an exterior surface of the liquid lens apparatus. The sensor is configured to detect a temperature of the liquid lens apparatus to enable compensation for thermal expansion or contraction of the liquid lens apparatus resulting from changes in temperature of the liquid lens apparatus.

公开(公告)号：US20230091841A1

公开(公告)日：2023-03-23

申请号：US17989075

申请日：2022-11-17

Applicant: Corning Incorporated

Inventor： Kaveh Adib ,  Robert Alan Bellman ,  Jiangwei Feng ,  Georgiy M Guryanov ,  Jhih-Wei Liang ,  Shiwen Liu ,  Prantik Mazumder

IPC: C03C17/32 ,  B32B17/10 ,  B32B15/04 ,  C03C17/28 ,  B32B7/06 ,  B32B17/06

Abstract: Described herein are articles and methods of making articles, including a first sheet and a second sheet, wherein the thin sheet and carrier are bonded together using a coating layer, preferably a hydrocarbon polymer coating layer, and associated deposition methods and inert gas treatments that may be applied on either sheet, or both, to control van der Waals, hydrogen and covalent bonding between the sheets. The coating layer bonds the sheets together to prevent formation of a permanent bond at high temperature processing while at the same time maintaining a sufficient bond to prevent delamination during high temperature processing.

公开(公告)号：US11535553B2

公开(公告)日：2022-12-27

申请号：US16327145

申请日：2017-08-29

Applicant: CORNING INCORPORATED

Inventor： Kaveh Adib ,  Robert Alan Bellman ,  Jiangwei Feng ,  Georgiy M Guryanov ,  Jhih-Wei Liang ,  Shiwen Liu ,  Prantik Mazumder

IPC: C03C17/32 ,  B32B17/10 ,  B32B15/04 ,  C03C17/28 ,  B32B7/06 ,  B32B17/06

Abstract: Described herein are articles and methods of making articles, including a first sheet and a second sheet, wherein the thin sheet and carrier are bonded together using a coating layer, preferably a hydrocarbon polymer coating layer, and associated deposition methods and inert gas treatments that may be applied on either sheet, or both, to control van der Waals, hydrogen and covalent bonding between the sheets. The coating layer bonds the sheets together to prevent formation of a permanent bond at high temperature processing while at the same time maintaining a sufficient bond to prevent delamination during high temperature processing.

公开(公告)号：US10410883B2

公开(公告)日：2019-09-10

申请号：US15609238

申请日：2017-05-31

Applicant: CORNING INCORPORATED

Inventor： Robert Alan Bellman ,  Shiwen Liu

IPC: H01L21/48 ,  C03C17/30 ,  H01L21/768 ,  H01L21/308 ,  H01L21/311 ,  B05D1/00 ,  C23C16/27 ,  H01L21/683 ,  H01L23/498 ,  C03C15/00 ,  C03C17/22 ,  C03C23/00

Abstract: Methods of forming vias in substrates having at least one damage region extending from a first surface etching the at least one damage region of the substrate to form a via in the substrate, wherein the via extends through the thickness T of the substrate while the first surface of the substrate is masked. The mask is removed from the first surface of the substrate after etching and upon removal of the mask the first surface of the substrate has a surface roughness (Rq) of about less than 1.0 nm.

公开(公告)号：US20220035079A1

公开(公告)日：2022-02-03

申请号：US17276964

申请日：2019-09-20

Applicant: CORNING INCORPORATED

Inventor： Raymond Miller Karam ,  Shiwen Liu ,  Christopher RC Olson ,  Ernesto Sanchez, Jr. ,  Ming Ying

IPC: G02B3/14 ,  G02B26/00 ,  H04N5/225

Abstract: A liquid lens can include a chamber with first and second fluids and an interface between the fluids. A first electrode can be insulated from the fluids, and a second electrode can be in electrical communication with the first fluid. A position of the interface can be based at least in part on a voltage applied between the first and second electrodes. A flexure can be configured to cause a window to displace axially along an optical axis to change a volume of the chamber. The flexure can extend laterally outward from the window substantially linearly, and can be formed between a first recess on an outer side of the liquid lens and a second recess on an inner side of the liquid lens. The second recess can extend laterally outward farther than the first recess such that the first recess and the second recess are offset from each other.