-
公开(公告)号:US10892356B2
公开(公告)日:2021-01-12
申请号:US16376596
申请日:2019-04-05
Applicant: Cree, Inc.
Inventor: Saptharishi Sriram , Thomas Smith , Alexander Suvorov , Christer Hallin
IPC: H01L27/088 , H01L29/778 , H01L29/20 , H01L29/423 , H01L29/66 , H01L29/417 , H01L29/40 , H01L29/10
Abstract: An apparatus includes a substrate. The apparatus further includes a group III-nitride buffer layer on the substrate; a group III-nitride barrier layer on the group III-nitride buffer layer, the group III-nitride barrier layer including a higher bandgap than a bandgap of the group III-nitride buffer layer. The apparatus further includes a source electrically coupled to the group III-nitride barrier layer; a gate electrically coupled to the group III-nitride barrier layer; a drain electrically coupled to the group III-nitride barrier layer; and a p-region being at least one of the following: in the substrate or on the substrate below said group III-nitride barrier layer.
-
2.
公开(公告)号:US20190237569A1
公开(公告)日:2019-08-01
申请号:US16376596
申请日:2019-04-05
Applicant: Cree, Inc.
Inventor: Saptharishi Sriram , Thomas Smith , Alexander Suvorov , Christer Hallin
IPC: H01L29/778 , H01L29/20 , H01L29/40 , H01L29/66 , H01L29/417 , H01L29/423
CPC classification number: H01L29/1087 , H01L21/743 , H01L21/746 , H01L29/1083 , H01L29/1608 , H01L29/2003 , H01L29/205 , H01L29/402 , H01L29/41725 , H01L29/42316 , H01L29/66462 , H01L29/7786 , H01L29/7787
Abstract: An apparatus includes a substrate. The apparatus further includes a group III-nitride buffer layer on the substrate; a group III-nitride barrier layer on the group III-nitride buffer layer, the group III-nitride barrier layer including a higher bandgap than a bandgap of the group III-nitride buffer layer. The apparatus further includes a source electrically coupled to the group III-nitride barrier layer; a gate electrically coupled to the group III-nitride barrier layer; a drain electrically coupled to the group III-nitride barrier layer; and a p-region being at least one of the following: in the substrate or on the substrate below said group III-nitride barrier layer.
-
公开(公告)号:US11862719B2
公开(公告)日:2024-01-02
申请号:US17123727
申请日:2020-12-16
Applicant: CREE, INC.
Inventor: Saptharishi Sriram , Thomas Smith , Alexander Suvorov , Christer Hallin
IPC: H01L29/778 , H01L29/20 , H01L29/423 , H01L29/66 , H01L29/417 , H01L29/40 , H01L29/10
CPC classification number: H01L29/7786 , H01L29/1075 , H01L29/2003 , H01L29/402 , H01L29/41725 , H01L29/42316 , H01L29/66462 , H01L29/7783 , H01L29/7787 , H01L29/1066 , H01L29/41766
Abstract: An apparatus includes a substrate. The apparatus further includes a group III-nitride buffer layer on the substrate; a group III-nitride barrier layer on the group III-nitride buffer layer, the group III-nitride barrier layer including a higher bandgap than a bandgap of the group III-nitride buffer layer. The apparatus further includes a source electrically coupled to the group III-nitride barrier layer; a gate electrically coupled to the group III-nitride barrier layer; a drain electrically coupled to the group III-nitride barrier layer; and a p-region being at least one of the following: in the substrate or on the substrate below said group III-nitride barrier layer.
-
公开(公告)号:US20190229187A1
公开(公告)日:2019-07-25
申请号:US16260095
申请日:2019-01-28
Applicant: Cree, Inc.
Inventor: Saptharishi Sriram , Thomas Smith
IPC: H01L29/10 , H01L29/16 , H01L29/20 , H01L29/205 , H01L29/40 , H01L29/778 , H01L21/74 , H01L29/66
Abstract: The disclosure is directed to a high-electron mobility transistor that includes a SiC substrate layer, a GaN buffer layer arranged on the SiC substrate layer, and a p-type material layer having a length parallel to a surface of the SiC substrate layer over which the GaN buffer layer is provided. The p-type material layer is provided in one of the following: the SiC substrate layer and a first layer arranged on the SiC substrate layer. A method of making the high-electron mobility transistor is also disclosed.
-
-
-