公开(公告)号：US20130224955A1

公开(公告)日：2013-08-29

申请号：US13846126

申请日：2013-03-18

Applicant: Cabot Microelectronics Corporation

Inventor： Vlasta BRUSIC ,  Christopher THOMPSON ,  Jeffrey DYSARD

IPC: H01L21/306

CPC classification number: H01L21/30625 ,  B24B37/044 ,  B24D3/00 ,  C09G1/02 ,  C09K3/1436 ,  C09K3/1463 ,  C23F3/03 ,  C23F3/06

Abstract: The invention provides compositions and methods for planarizing or polishing a substrate. The composition comprises an abrasive consisting of alumina particles optionally treated with a polymer, an α-hydroxycarboxylic acid, an oxidizing agent that oxidizes at least one metal, polyacrylic acid, optionally, a calcium-containing compound, optionally, a biocide, optionally, a pH adjusting agent, and water. The method uses the composition to chemically-mechanically polish a substrate.

Abstract translation: 本发明提供了用于平坦化或抛光基材的组合物和方法。 该组合物包含由任选用聚合物氧化的氧化铝颗粒，α-羟基羧酸，氧化至少一种金属的氧化剂，任选的含钙化合物，任选的含钙化合物，任选的杀生物剂，任选地， pH调节剂和水。 该方法使用组合物对基材进行化学机械抛光。