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公开(公告)号：US20150046303A1
公开(公告)日：2015-02-12
申请号：US14457052
申请日：2014-08-11
IPC分类号： G06Q40/00
CPC分类号： G06Q40/12
摘要： An electronic multinational consolidation system and method of combining and translating financial data by automatically applying the correct exchange rate based on predetermined accounting rules to each required general ledger, providing mapping tools to assure consistency across various general ledgers and, hence, accurate financial reporting and allowing for historical corrections to be made and brought forward to the current financial period.
摘要翻译： 一种电子跨国合并系统和方法，通过根据预定的会计规则自动应用正确的汇率，对每个所需的总帐进行组合和翻译财务数据，提供地图绘制工具，以确保各种总分类帐之间的一致性，从而确保准确的财务报告和允许 对本财政期间进行历史修正。
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公开(公告)号：US4253719A
公开(公告)日：1981-03-03
申请号：US115563
申请日：1980-01-28
申请人： William J. McGinley
发明人： William J. McGinley
IPC分类号： H01R12/70 , H01R12/72 , H01R13/506 , H01R13/514 , H01R13/62
CPC分类号： H01R12/721 , H01R12/7005
摘要： An electrical connector for mounting on the edge of a printed circuit board, the connector having a plurality of terminals which engage against electrically conductive contact fingers formed on the printed circuit board adjacent the edge thereof, and the connector being designed to clamp over an edge portion of the circuit board so as to permit a high contact pressure between the connector terminals and the circuit board fingers without requiring a high insertion force to interconnect the connector with the circuit board.
摘要翻译： 一种用于安装在印刷电路板的边缘上的电连接器，所述连接器具有多个端子，所述多个端子与邻近其边缘的印刷电路板上形成的导电接触指接合，并且连接器设计成夹在边缘部分上 以允许连接器端子和电路板指状物之间的高接触压力，而不需要高插入力来将连接器与电路板互连。
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公开(公告)号：US5599595A
公开(公告)日：1997-02-04
申请号：US468235
申请日：1995-06-06
IPC分类号： C09K19/38 , H01R12/71 , H01R13/03 , H01R24/00 , H01R43/16 , H05K1/00 , H05K1/09 , H05K1/11 , H05K3/00 , H05K3/32 , H05K3/36 , H05K3/40 , B52B9/00
CPC分类号： H05K3/0014 , H01R12/716 , H01R13/035 , H05K1/119 , H05K3/326 , H05K1/0284 , H05K1/095 , H05K1/117 , H05K2201/0141 , H05K2201/09045 , H05K2201/09081 , H05K2201/09118 , H05K2201/10446 , H05K2201/1059 , H05K3/366 , Y10S428/901 , Y10S439/931
摘要： A conductive component for carrying electrical signals constructed from a molded polymer substrate and a conductive coating adhered to the substrate, the coating defining a continuous electrical pathway between at least two terminals. Preferably, molded plastic such as liquid crystal polymer is formed to make circuits having conductive ink adhered thereto in order to provide inexpensive and versatile printed circuit boards for carrying electrical traces and other components and to provide printed formed contacts. The conductive solderable inks can be adhered to the substrate, for example, via screen printing, brush, spraying, dipping, masking, vacuum plating or vacuum deposition with subsequent oven drying, reflowing in a vapor phase, post curing or plating.
摘要翻译： 用于承载由模制的聚合物基底构成的电信号的导电组件和粘附到基底的导电涂层，所述涂层在至少两个端子之间限定连续的电通路。 优选地，形成诸如液晶聚合物的模制塑料以使具有导电油墨的电路粘附到其上，以便提供用于承载电迹线和其它部件的便宜且通用的印刷电路板，并提供印刷成形的触点。 导电性可焊墨水可以例如通过丝网印刷，刷涂，喷涂，浸渍，掩模，真空电镀或真空沉积，随后烘箱干燥，气相回流，后固化或电镀而粘附到基底上。
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公开(公告)号：US5688146A
公开(公告)日：1997-11-18
申请号：US686982
申请日：1996-07-25
IPC分类号： C09K19/38 , H01R12/71 , H01R13/03 , H01R24/00 , H01R43/16 , H05K1/00 , H05K1/09 , H05K1/11 , H05K3/00 , H05K3/32 , H05K3/36 , H05K3/40 , H01R23/70
CPC分类号： H05K3/0014 , H01R12/716 , H01R13/035 , H05K1/119 , H05K3/326 , H05K1/0284 , H05K1/095 , H05K1/117 , H05K2201/0141 , H05K2201/09045 , H05K2201/09081 , H05K2201/09118 , H05K2201/10446 , H05K2201/1059 , H05K3/366 , Y10S428/901 , Y10S439/931
摘要： A conductive component for carrying electrical signals constructed from a molded polymer substrate and a conductive coating adhered to the substrate, the coating defining a continuous electrical pathway between at least two terminals. Preferably, molded plastic such as liquid crystal polymer is formed to make circuits having conductive ink adhered thereto in order to provide inexpensive and versatile printed circuit boards for carrying electrical traces and other components and to provide printed formed contacts. The conductive solderable inks can be adhered to the substrate, for example, via screen printing, brush, spraying, dipping, masking, vacuum plating or vacuum deposition with subsequent oven drying, reflowing in a vapor phase, post curing or plating.
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