公开(公告)号：US10459006B2

公开(公告)日：2019-10-29

申请号：US15708681

申请日：2017-09-19

Applicant: Cascade Microtech, Inc.

Inventor： Gavin Neil Fisher ,  Thomas Reiner Thaerigen ,  Peter McCann ,  Rodney Jones ,  Koby L. Duckworth

IPC: G01R31/00 ,  G01R1/067 ,  G01R35/00 ,  G01R31/28 ,  G01R1/073

Abstract: Probe systems and methods are disclosed herein. The methods include directly measuring a distance between a first manipulated assembly and a second manipulated assembly, contacting first and second probes with first and second contact locations, providing a test signal to an electrical structure, and receiving a resultant signal from the electrical structure. The methods further include characterizing at least one of a probe system and the electrical structure based upon the distance. In one embodiment, the probe systems include a measurement device configured to directly measure a distance between a first manipulated assembly and a second manipulated assembly. In another embodiment, the probe systems include a probe head assembly including a platen, a manipulator operatively attached to the platen, a vector network analyzer (VNA) extender operatively attached to the manipulator, and a probe operatively attached to the VNA extender.

公开(公告)号：US20180088149A1

公开(公告)日：2018-03-29

申请号：US15708681

申请日：2017-09-19

Applicant: Cascade Microtech, Inc.

Inventor： Gavin Neil Fisher ,  Thomas Reiner Thaerigen ,  Peter McCann ,  Rodney Jones ,  Koby L. Duckworth

IPC: G01R1/067

CPC classification number: G01R1/06794 ,  G01R1/07364 ,  G01R31/2891 ,  G01R35/00

Abstract: Probe systems and methods are disclosed herein. The methods include directly measuring a distance between a first manipulated assembly and a second manipulated assembly, contacting first and second probes with first and second contact locations, providing a test signal to an electrical structure, and receiving a resultant signal from the electrical structure. The methods further include characterizing at least one of a probe system and the electrical structure based upon the distance. In one embodiment, the probe systems include a measurement device configured to directly measure a distance between a first manipulated assembly and a second manipulated assembly. In another embodiment, the probe systems include a probe head assembly including a platen, a manipulator operatively attached to the platen, a vector network analyzer (VNA) extender operatively attached to the manipulator, and a probe operatively attached to the VNA extender.