Method of making a semiconductor device using treated photoresist
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    发明申请
    Method of making a semiconductor device using treated photoresist 有权
    使用经处理的光致抗蚀剂制造半导体器件的方法

    公开(公告)号:US20050181630A1

    公开(公告)日:2005-08-18

    申请号:US10779007

    申请日:2004-02-13

    摘要: A semiconductor device is made by patterning a conductive layer for forming gates of transistors. The process for forming the gates has a step of patterning photoresist that overlies the conductive layer. The patterned photoresist is trimmed so that its width is reduced. Fluorine, preferably F2, is applied to the trimmed photoresist to increase its hardness and its selectivity to the conductive layer. Using the trimmed and fluorinated photoresist as a mask, the conductive layer is etched to form conductive features useful as gates. Transistors are formed in which the conductive pillars are gates. Other halogens, especially chlorine, may be substituted for the fluorine.

    摘要翻译: 通过图案化用于形成晶体管的栅极的导电层来制造半导体器件。 用于形成栅极的工艺具有将导电层覆盖的光刻胶图形化的步骤。 修整图案化的光致抗蚀剂,使其宽度减小。 氟,优选F 2 N被施加到修剪的光致抗蚀剂以增加其硬度和对导电层的选择性。 使用修剪和氟化光致抗蚀剂作为掩模,蚀刻导电层以形成用作栅极的导电特征。 形成导电柱是栅极的晶体管。 其他卤素,特别是氯可以代替氟。