公开(公告)号：US20080141933A1

公开(公告)日：2008-06-19

申请号：US11984402

申请日：2007-11-16

申请人： Cha-jea Jo ,  Joong-hyun Baek ,  Hee-jin Lee ,  Ku-young Kim ,  Ju-il Choi

发明人： Cha-jea Jo ,  Joong-hyun Baek ,  Hee-jin Lee ,  Ku-young Kim ,  Ju-il Choi

IPC分类号： B05C5/00

CPC分类号： C25D5/08 ,  C25D7/123 ,  C25D17/001 ,  C25D21/10 ,  H01L21/2885

摘要： Provided is a semiconductor plating system for plating a semiconductor object with a desired layer. The semiconductor plating system include a plating tank configured to accommodate a plating solution for use in plating the semiconductor object, and a plating solution induction device configured to induce the plating solution to spirally flow toward the semiconductor object.

摘要翻译： 提供了一种用于对具有期望层的半导体物体进行电镀的半导体电镀系统。 半导体电镀系统包括：电镀槽，其配置为容纳用于电镀半导体物体的电镀液;以及电镀液感应装置，其被配置为使电镀液向半导体物体螺旋状流动。

公开(公告)号：US20110032679A1

公开(公告)日：2011-02-10

申请号：US12833470

申请日：2010-07-09

申请人： Joong-hyun Baek ,  Hee-jin Lee ,  Jin-kwon Bae

发明人： Joong-hyun Baek ,  Hee-jin Lee ,  Jin-kwon Bae

IPC分类号： H05K7/20

CPC分类号： H05K7/20472 ,  H01L23/38 ,  H01L2924/0002 ,  H05K7/20409 ,  H01L2924/00

摘要： A semiconductor module includes a semiconductor package generating thermal energy, a heat collecting member transferring thermal energy from the semiconductor package to a heat collection area in the heat collecting member, a heat radiating member transferring thermal energy received from the heat collecting member and package to the outside, and a thermoelectric device transferring thermal energy through the heat collection area to the heat radiating member via the thermoelectric effect. The heat collecting member and heat radiating member may be otherwise insulated so thermal energy is transferred and controlled by the thermoelectric device. The package may be a dynamic random access memory (DRAM), microprocessor, central processing unit (CPU), graphic processing unit (GPU), or flash memory. The heat radiating member may be an external case of a solid state disk (SSD), and the thermoelectric device may be a Peltier cooler controlled through a power line.

摘要翻译： 半导体模块包括产生热能的半导体封装，将热能从半导体封装传递到集热构件中的集热区的集热构件，将从集热构件和封装传递热能的散热构件传送到 以及通过热电效应将热能通过集热区域传递到散热构件的热电装置。 集热构件和散热构件可以以其他方式绝缘，因此热能由热电装置传递和控制。 封装可以是动态随机存取存储器（DRAM），微处理器，中央处理单元（CPU），图形处理单元（GPU）或闪存。 散热构件可以是固态盘（SSD）的外部壳体，并且热电装置可以是通过电力线控制的珀耳帖冷却器。

公开(公告)号：US08184439B2

公开(公告)日：2012-05-22

申请号：US12833470

申请日：2010-07-09

申请人： Joong-hyun Baek ,  Hee-jin Lee ,  Jin-kwon Bae

发明人： Joong-hyun Baek ,  Hee-jin Lee ,  Jin-kwon Bae

IPC分类号： H05K7/20

CPC分类号： H05K7/20472 ,  H01L23/38 ,  H01L2924/0002 ,  H05K7/20409 ,  H01L2924/00

摘要： A semiconductor module includes a semiconductor package generating thermal energy, a heat collecting member transferring thermal energy from the semiconductor package to a heat collection area in the heat collecting member, a heat radiating member transferring thermal energy received from the heat collecting member and package to the outside, and a thermoelectric device transferring thermal energy through the heat collection area to the heat radiating member via the thermoelectric effect. The heat collecting member and heat radiating member may be otherwise insulated so thermal energy is transferred and controlled by the thermoelectric device. The package may be a dynamic random access memory (DRAM), microprocessor, central processing unit (CPU), graphic processing unit (GPU), or flash memory. The heat radiating member may be an external case of a solid state disk (SSD), and the thermoelectric device may be a Peltier cooler controlled through a power line.

摘要翻译： 半导体模块包括产生热能的半导体封装，将热能从半导体封装传递到集热构件中的集热区的集热构件，将从集热构件和封装传递热能的散热构件传送到 以及通过热电效应将热能通过集热区域传递到散热构件的热电装置。 集热构件和散热构件可以以其他方式绝缘，因此热能由热电装置传递和控制。 封装可以是动态随机存取存储器（DRAM），微处理器，中央处理单元（CPU），图形处理单元（GPU）或闪存。 散热构件可以是固态盘（SSD）的外部壳体，并且热电装置可以是通过电力线控制的珀耳帖冷却器。

公开(公告)号：US20090129026A1

公开(公告)日：2009-05-21

申请号：US12292244

申请日：2008-11-14

申请人： Joong-hyun Baek ,  Hee-jin Lee ,  Sun-won Kang

发明人： Joong-hyun Baek ,  Hee-jin Lee ,  Sun-won Kang

IPC分类号： H05K7/20

CPC分类号： H01L23/4093 ,  H01L23/3672 ,  H01L23/4275 ,  H01L2224/16225 ,  H01L2224/73253

摘要： Provided are a heat sink and a heat sink semiconductor module assembly which may include an improved, cooling function. Each of the heat sinks may include a flat heat sink base having a first surface attached to semiconductor devices and a second surface externally exposed; first fins provided on a portion of the second surface of the heat sink base to which no clip is coupled; and second fins provided on portions of the second surface of the heat sink base to which a clip may be coupled. The semiconductor module assembly may secure the heat sinks to both surfaces of a semiconductor module using the clip. Accordingly, air may flow smoothly through the second fins on the portions to which the clip may be coupled, thereby improving the cooling function of the heat sinks.

摘要翻译： 提供了散热器和散热半导体模块组件，其可以包括改进的冷却功能。 每个散热器可以包括平坦的散热器基座，其具有附接到半导体器件的第一表面和外部暴露的第二表面; 第一散热片设置在散热器基座的第二表面的没有夹子连接的部分上; 以及设置在所述散热器基座的所述第二表面的可以联接夹子的部分上的第二散热片。 半导体模块组件可以使用夹子将散热片固定到半导体模块的两个表面。 因此，空气可以平滑地流过夹子可以联接的部分上的第二鳍片，从而改善散热器的冷却功能。

公开(公告)号：US06701371B1

公开(公告)日：2004-03-02

申请号：US09385099

申请日：1999-08-30

申请人： Hee-jin Lee

发明人： Hee-jin Lee

IPC分类号： G06F1516

CPC分类号： H04L12/40097 ,  H04L12/6418 ,  H04L29/06 ,  H04L29/06027 ,  H04L47/193 ,  H04L47/2441 ,  H04L69/16 ,  H04L69/168 ,  H04L69/32

摘要： A data transfer method for matching an upper protocol layer to a high speed serial bus. In the data transfer method, it is determined whether transfer data to be transferred from the upper protocol layer to the high speed serial bus, is stream data that is transferred to a predetermined node which the bus can identify, and form data flow defined by a predetermined flow classifier. If the transfer data is determined to be stream data, a channel is allocated in the bus and the transfer data is transferred through the channel. However, if the transfer data is determined not to be stream data, the transfer data is transferred by an asynchronous transfer method according to the high speed serial bus standard, without allocating a channel. Due to a channel Matron of the high speed serial bus, an upper protocol layer of existing applications which do not specify a service to provide, can be effectively matched to the high speed serial bus.

摘要翻译： 一种用于将上层协议层与高速串行总线进行匹配的数据传输方法。 在数据传送方法中，确定要从上层协议层传送到高速串行总线的传送数据是否被传送到总线可以识别的预定节点的流数据，并形成由 预定流分类器。 如果传输数据被确定为流数据，则在总线中分配信道，并且通过信道传送传输数据。 然而，如果确定传输数据不是流数据，则不需要分配信道就可以通过异步传输方法根据高速串行总线标准传送传输数据。 由于高速串行总线的通道Matron，没有规定提供服务的现有应用的上层协议层可以有效地匹配高速串行总线。

公开(公告)号：US07006503B1

公开(公告)日：2006-02-28

申请号：US09603615

申请日：2000-06-26

申请人： Hee-jin Lee

发明人： Hee-jin Lee

IPC分类号： H04L12/28 ,  H04L12/66 ,  H04L12/403 ,  H04J3/16

CPC分类号： H04L12/64 ,  H04L69/16 ,  H04L69/166

摘要： A method for matching an upper protocol layer to a high speed serial bus is provided. The method includes the steps of (a) determining whether the length of the data packet transferred from an upper layer to a node of the high speed serial bus is no less than a predetermined length, (b) allocating a channel of the bus and transferring data by an isochronous transfer service when it is determined that the length of the data packet is no less than the predetermined length, and (c) transferring data by an asynchronous transfer service when it is determined that the length of the data packet is less than the predetermined length. According to the above method, it is possible to match an existing communications application where it is not specified which service of the high speed serial bus is to be used to the high speed serial bus, while maintaining transparency of communication protocol and to effectively use the channel resources of the bus.

摘要翻译： 提供了将上层协议层与高速串行总线进行匹配的方法。 该方法包括以下步骤：（a）确定从高层串行总线的上层传送到节点的数据包的长度是否不小于预定长度，（b）分配总线的信道和传送 当确定数据分组的长度不小于预定长度时，通过同步传输服务的数据，以及（c）当确定数据分组的长度小于预定长度时，通过异步传输服务传送数据 预定长度。 根据上述方法，可以将不使用高速串行总线的哪个服务的现有通信应用与高速串行总线进行匹配，同时保持通信协议的透明性，并有效地使用 信道资源的总线。