Sokcet assembly for testing semiconductor device
    1.
    发明申请
    Sokcet assembly for testing semiconductor device 失效
    用于测试半导体器件的Sokcet组件

    公开(公告)号:US20060170412A1

    公开(公告)日:2006-08-03

    申请号:US11196238

    申请日:2005-08-04

    IPC分类号: G01R31/28

    CPC分类号: G01R1/0433

    摘要: The present invention relates to a socket assembly for testing semiconductor device comprising a socket board electrically connected to an outside testing device wherein a plurality of connection pins connected to leads of a semiconductor is provided; a socket guide mounted to cover the socket board, with an open part formed so that the semiconductor may in/out, thereby connecting the semiconductor to the connection pins of the socket board; and a spacer interposed between the socket board and the socket guide for maintaining a predetermined distance between the semiconductor and the socket board by touching an surface of the semiconductor having moved into an inside of the socket guide before a surface of each carrier touches the socket guide. According to the present invention, the balls or the leads of each semiconductor may be pressed to the connection pins of the socket in a predetermined depth without replacing the carriers though the semiconductors have the different thicknesses.

    摘要翻译: 本发明涉及一种用于测试半导体器件的插座组件,包括:电连接到外部测试装置的插座板,其中提供连接到半导体引线的多个连接引脚; 安装成覆盖插座板的插座引导件,其形成为使得半导体可以进/出的开口部,从而将半导体连接到插座板的连接引脚; 以及插入在插座板和插座引导件之间的间隔件,用于通过在每个承载件的表面接触插座导向件之前触摸已经移动到插座导向件内部的半导体的表面来保持半导体和插座板之间的预定距离 。 根据本发明,通过半导体具有不同的厚度,每个半导体的球或引线可以以预定深度被压到插座的连接销上,而不需要更换载体。

    Handler for testing semiconductor devices

    公开(公告)号:US20070152655A1

    公开(公告)日:2007-07-05

    申请号:US11713683

    申请日:2007-03-05

    IPC分类号: G01R31/28

    CPC分类号: G01R31/2893 G01R31/2867

    摘要: A handler for testing semiconductor devices is disclosed which is capable of simplifying the process carried out in an exchanging station, namely, the process of loading/unloading semiconductor devices in/from test trays, and greatly increasing the number of simultaneously testable semiconductor devices. The handler includes a loading station, an unloading station, test trays, an exchanging station comprising a horizontal moving unit for horizontally moving a selected one of the test trays by a predetermined pitch at a working place, a test station in which at least one test board having a plurality of test sockets to be electrically connected with semiconductor devices is mounted, the test station performing a test while connecting the semiconductor devices in one of the test trays, which is fed from the exchanging station to the test station, to the test sockets, device transfer units for transfer the semiconductor devices between the loading station and the exchanging station and between the exchanging station and the unloading station, respectively, and a tray transfer unit for transfer the test trays between the exchanging station and the test station.

    Transfer device of handler for testing semiconductor device
    3.
    发明申请
    Transfer device of handler for testing semiconductor device 失效
    用于半导体器件测试的处理器的传送装置

    公开(公告)号:US20060119345A1

    公开(公告)日:2006-06-08

    申请号:US11200014

    申请日:2005-08-10

    IPC分类号: G01R31/28

    CPC分类号: G01R31/2893

    摘要: The present invention relates to a transfer device of a handler for testing semiconductor device in which a pitch between each head of picker heads may be adjusted to the discretionary one as wanted without replacing a cam plate. The transfer device of a handler for testing semiconductor device comprises a base part, a plurality of picker heads mounted movable horizontally on the base part for securing/detaching the semiconductors, a cam plate movably mounted on the base part, a plurality of cam grooves formed inclined therein, connection parts, wherein each first side thereof is secured to each picker head and each second side thereof is relative-movably connected to each cam groove, thereby connecting each picker head with each cam groove, and a driving unit for reciprocating the cam plate so as that the picker heads may be varied to a discretionary position of the base part.

    摘要翻译: 本发明涉及一种用于半导体器件测试的处理器的传送装置,其中拾取器头部的每个头部之间的间距可根据需要调节到任意尺寸,而不需更换凸轮板。 用于测试半导体器件的处理器的传送装置包括基座部分,安装在基座上水平移动以固定/拆卸半导体的多个拾取头,可移动地安装在基座部分上的凸轮板,形成多个凸轮槽 在其中倾斜的连接部件,其中每个第一侧被固定到每个拾取器头部,并且其每个第二侧部可相对运动地连接到每个凸轮槽,从而将每个拾取器头部与每个凸轮槽连接,以及用于使凸轮往复运动的驱动单元 使得拾取器头可以变化到基部的任意位置。

    Tray transferring apparatus
    4.
    发明申请
    Tray transferring apparatus 失效
    托盘传送设备

    公开(公告)号:US20050173446A1

    公开(公告)日:2005-08-11

    申请号:US10773325

    申请日:2004-02-09

    IPC分类号: B65B59/00 H05K13/02

    摘要: The present invention discloses a tray transferring apparatus for transferring a handling tray on which semiconductor devices are mounted. The tray transferring apparatus stably transfers the semiconductor devices not to be scattered or separated from the handling tray. The tray transferring apparatus includes a fixing means installed on a main frame, for supporting a fixed tray, a correcting means installed on the main frame, for correcting the fixed tray supported by the fixing means, a gripping means installed on the main frame, for gripping a handling tray, and at least one sensor installed on the main frame, for sensing gripper plates and the handling tray. As a result, the tray transferring apparatus prevents the semiconductor devices from being scattered or separated from the handling tray, by fixing the fixed tray by first and second fixing members, correcting right/left inclination of the fixed tray by the correcting means, and precisely covering the upper portion of the handling tray.

    摘要翻译: 本发明公开了一种托盘传送装置,用于传送安装有半导体器件的处理托盘。 托盘传送装置稳定地传送半导体装置不会从处理盘散开或分离。 托盘传送装置包括安装在主框架上用于支撑固定托盘的固定装置,安装在主框架上的校正装置,用于校正由固定装置支撑的固定托盘,安装在主框架上的夹持装置,用于 夹持处理托盘,以及安装在主框架上的至少一个传感器,用于检测夹板和处理托盘。 结果,托盘传送装置通过利用第一和第二固定构件固定固定托盘,通过校正装置校正固定托盘的右/左倾斜,并且精确地防止半导体装置与处理托盘分散或分离 覆盖处理托盘的上部。